Kazuhiro MATSUDA

Person

Kizugawa-shi, Kyoto, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electroconductive coating material and method for producing shielde...
- Patent number 11,912,897
- Issue date Feb 27, 2024
- Tatsuta Electric Wire & Cable Co., Ltd.
- Hajime Nakazono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive coating material and production method for shielded pack...
- Patent number 11,414,554
- Issue date Aug 16, 2022
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Hiroaki Umeda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Conductive coating material and production method for shielded pack...
- Patent number 11,370,926
- Issue date Jun 28, 2022
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Hiroaki Umeda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Heat dissipation material adhering composition, heat dissipation ma...
- Patent number 11,236,227
- Issue date Feb 1, 2022
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Hiroaki Umeda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Shield package
- Patent number 11,191,198
- Issue date Nov 30, 2021
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Hiroaki Umeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation substrate, heat dissipation circuit structure body...
- Patent number 10,893,603
- Issue date Jan 12, 2021
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Hiroaki Umeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive coating material for shielding electronic component pack...
- Patent number 10,259,952
- Issue date Apr 16, 2019
- Tatsuta Electric Wire & Cable Co., Ltd.
- Hiroaki Umeda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
CONDUCTIVE COMPOSITION AND METHOD FOR PRODUCING SHIELDED PACKAGE US...
- Publication number 20230151228
- Publication date May 18, 2023
- Tatsuta Electric Wire & Cable Co., Ltd.
- Hiroaki UMEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electroconductive Coating Material and Method for Producing Shielde...
- Publication number 20210024758
- Publication date Jan 28, 2021
- Tatsuta Electric Wire & Cable Co., Ltd.
- Hajime NAKAZONO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CONDUCTIVE COATING MATERIAL AND PRODUCTION METHOD FOR SHIELDED PACK...
- Publication number 20200299523
- Publication date Sep 24, 2020
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD
- Hiroaki UMEDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CONDUCTIVE COATING MATERIAL AND PRODUCTION METHOD FOR SHIELDED PACK...
- Publication number 20200299524
- Publication date Sep 24, 2020
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD
- Hiroaki UMEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELD PACKAGE
- Publication number 20200288608
- Publication date Sep 10, 2020
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD
- Hiroaki Umeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION SUBSTRATE, HEAT DISSIPATION CIRCUIT STRUCTURE BODY...
- Publication number 20200084875
- Publication date Mar 12, 2020
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD
- Hiroaki Umeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE COATING MATERIAL AND PRODUCTION METHOD FOR SHIELDED PACK...
- Publication number 20190292381
- Publication date Sep 26, 2019
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD
- Hajime Nakazono
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
HEAT DISSIPATION MATERIAL ADHERING COMPOSITION, HEAT DISSIPATION MA...
- Publication number 20180298185
- Publication date Oct 18, 2018
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD
- Hiroaki Umeda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN-CLAD COPPER FOIL, AND PRINTED WIRING BOARD
- Publication number 20180222152
- Publication date Aug 9, 2018
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD
- Hiroaki Umeda
- B32 - LAYERED PRODUCTS
Information Patent Application
CONDUCTIVE COATING MATERIAL FOR SHIELDING ELECTRONIC COMPONENT PACK...
- Publication number 20170247550
- Publication date Aug 31, 2017
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD
- Hiroaki UMEDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Kazuhiro MATSUDA

Person

Patents Grantslast 30 patents

Electroconductive coating material and method for producing shielde...

Conductive coating material and production method for shielded pack...

Conductive coating material and production method for shielded pack...

Heat dissipation material adhering composition, heat dissipation ma...

Shield package

Heat dissipation substrate, heat dissipation circuit structure body...

Conductive coating material for shielding electronic component pack...

Patents Applicationslast 30 patents

CONDUCTIVE COMPOSITION AND METHOD FOR PRODUCING SHIELDED PACKAGE US...

Electroconductive Coating Material and Method for Producing Shielde...

CONDUCTIVE COATING MATERIAL AND PRODUCTION METHOD FOR SHIELDED PACK...

CONDUCTIVE COATING MATERIAL AND PRODUCTION METHOD FOR SHIELDED PACK...

SHIELD PACKAGE

HEAT DISSIPATION SUBSTRATE, HEAT DISSIPATION CIRCUIT STRUCTURE BODY...

CONDUCTIVE COATING MATERIAL AND PRODUCTION METHOD FOR SHIELDED PACK...

HEAT DISSIPATION MATERIAL ADHERING COMPOSITION, HEAT DISSIPATION MA...

RESIN-CLAD COPPER FOIL, AND PRINTED WIRING BOARD

CONDUCTIVE COATING MATERIAL FOR SHIELDING ELECTRONIC COMPONENT PACK...