Kazuhiro Motonaga

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Kanagawa, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wiring board having connecting wiring between electrode plane and c...
- Patent number 7,321,166
- Issue date Jan 22, 2008
- NEC Corporation
- Jun Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device having decoupling capacitor formed on substrat...
- Publication number 20090079074
- Publication date Mar 26, 2009
- NEC Electronics Corporation
- Kazuhiro Motonaga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring board for semiconductor integrated circuit package and semic...
- Publication number 20060103004
- Publication date May 18, 2006
- NEC CORPORATION and
- Jun Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR