Kazuhiro TADA

Person

Chiyoda-ku, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 12,080,673
- Issue date Sep 3, 2024
- Mitsubishi Electric Corporation
- Tatsuya Kitagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,490,491
- Issue date Nov 26, 2019
- Mitsubishi Electric Corporation
- Kazuhiro Tada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat conductive insulating sheet, power module, and manufacturing m...
- Patent number 10,177,068
- Issue date Jan 8, 2019
- Mitsubishi Electric Corporation
- Kenji Mimura
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,390,995
- Issue date Jul 12, 2016
- Mitsubishi Electric Corporation
- Kei Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a bulge portion and manufacturing metho...
- Patent number 9,320,173
- Issue date Apr 19, 2016
- Mitsubishi Electric Corporation
- Kei Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power semiconductor module
- Patent number 9,299,628
- Issue date Mar 29, 2016
- Mitsubishi Electric Corporation
- Takayoshi Miki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module
- Patent number 9,129,885
- Issue date Sep 8, 2015
- Mitsubishi Electric Corporation
- Yasushi Nakayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,741,695
- Issue date Jun 3, 2014
- Mitsubishi Electric Corporation
- Seiji Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat conductive sheet and method for producing same, and powder module
- Patent number 8,193,633
- Issue date Jun 5, 2012
- Mitsubishi Electric Corporation
- Kenji Mimura
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor device and method for producing the same
- Patent number 7,671,453
- Issue date Mar 2, 2010
- Mitsubishi Denki Kabushiki Kaisha
- Kenichi Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold resin-sealed power semiconductor device having insulating resi...
- Patent number 7,151,311
- Issue date Dec 19, 2006
- Mitsubishi Denki Kabushiki Kaisha
- Dai Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory circuit having a plurality of cell arrays
- Patent number 4,768,171
- Issue date Aug 30, 1988
- NEC Corporation
- Kazuhiro Tada
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
POWER MODULE, POWER SEMICONDUCTOR DEVICE, AND MANUFACTURING METHODS...
- Publication number 20230105637
- Publication date Apr 6, 2023
- Mitsubishi Electric Corporation
- Tomohisa YAMANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20220262761
- Publication date Aug 18, 2022
- Mitsubishi Electric Corporation
- Tatsuya KITAGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180269140
- Publication date Sep 20, 2018
- MITSUBISHI ELECTRIC CORPORATION
- Kazuhiro TADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT CONDUCTIVE INSULATING SHEET, POWER MODULE, AND MANUFACTURING M...
- Publication number 20160013116
- Publication date Jan 14, 2016
- MITSUBISHI ELECTRIC CORPORATION
- Kenji MIMURA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20150016064
- Publication date Jan 15, 2015
- Mitsubishi Electric Corporation
- Kei Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140367702
- Publication date Dec 18, 2014
- Mitsubishi Electric Corporation
- Kei Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE
- Publication number 20140138707
- Publication date May 22, 2014
- MITSUBISHI ELECTRIC CORPORATION
- Takayoshi Miki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130181225
- Publication date Jul 18, 2013
- Mitsubishi Electric Corporation
- Seiji OKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE
- Publication number 20120286292
- Publication date Nov 15, 2012
- Mitsubishi Electric Corporation
- Yasushi Nakayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND METHOD FOR DETECTING INSULATION DEGRADATION THEREOF
- Publication number 20120039045
- Publication date Feb 16, 2012
- Mitsubishi Electric Corporation
- Xiaohong Yin
- G01 - MEASURING TESTING
Information Patent Application
HEAT CONDUCTIVE SHEET AND POWER MODULE
- Publication number 20100226095
- Publication date Sep 9, 2010
- Mitsubishi Electric Corporation
- Kenji Mimura
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Semiconductor device and method for producing the same
- Publication number 20050067719
- Publication date Mar 31, 2005
- Mitsubishi Denki Kabushiki Kaisha
- Kenichi Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mold resin-sealed power semiconductor device having insulating resi...
- Publication number 20040089928
- Publication date May 13, 2004
- Mitsubishi Denki Kabushiki Kaisha
- Dai Nakajima
- H01 - BASIC ELECTRIC ELEMENTS

Kazuhiro TADA

Person

Patents Grantslast 30 patents

Semiconductor device and manufacturing method therefor

Semiconductor device

Heat conductive insulating sheet, power module, and manufacturing m...

Semiconductor device and method of manufacturing the same

Semiconductor device having a bulge portion and manufacturing metho...

Power semiconductor module

Power semiconductor module

Semiconductor device and method of manufacturing the same

Heat conductive sheet and method for producing same, and powder module

Semiconductor device and method for producing the same

Mold resin-sealed power semiconductor device having insulating resi...

Memory circuit having a plurality of cell arrays

Patents Applicationslast 30 patents

POWER MODULE, POWER SEMICONDUCTOR DEVICE, AND MANUFACTURING METHODS...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR DEVICE

HEAT CONDUCTIVE INSULATING SHEET, POWER MODULE, AND MANUFACTURING M...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

POWER SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

POWER SEMICONDUCTOR MODULE

POWER MODULE AND METHOD FOR DETECTING INSULATION DEGRADATION THEREOF

HEAT CONDUCTIVE SHEET AND POWER MODULE

Semiconductor device and method for producing the same

Mold resin-sealed power semiconductor device having insulating resi...