Kazuhisa Ishii

Person

Ebina, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Laser machining apparatus
- Patent number 7,473,867
- Issue date Jan 6, 2009
- Hitachi via Mechanics, Ltd.
- Kazuhisa Ishii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser machining method and laser machining apparatus
- Patent number 7,205,501
- Issue date Apr 17, 2007
- Hitachi Via Mechanics, Ltd.
- Kunio Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor light emitting device having quantum well layer sandw...
- Patent number 7,084,422
- Issue date Aug 1, 2006
- Stanley Electric Co., Ltd.
- Tsuyoshi Maruyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light emitting device having quantum well layer sandw...
- Patent number 6,900,467
- Issue date May 31, 2005
- Stanley Electric Co., Ltd.
- Tsuyoshi Maruyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for drilling printed wiring boards
- Patent number 6,531,677
- Issue date Mar 11, 2003
- Hitachi Via Mechanics, Ltd.
- Kunio Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light radiating device with large beam spot size and spatial optica...
- Patent number 6,520,670
- Issue date Feb 18, 2003
- Stanley Electric Co., Ltd.
- Ji Hao Liang
- F21 - LIGHTING

Patents Applicationslast 30 patents

Information Patent Application
LASER PROCESSING METHOD OF PRINTED CIRCUIT BOARD AND LASER PROCESSI...
- Publication number 20220216665
- Publication date Jul 7, 2022
- OFUNA ENTERPRISE Japan Co., Ltd.
- Kunio ARAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and Apparatus for Machining Thin-Film Layer of Workpiece
- Publication number 20120031147
- Publication date Feb 9, 2012
- HITACHI VIA MECHANICS, LTD.
- Kunio Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Composite sheet, machining method for composite sheet and laser mac...
- Publication number 20080008854
- Publication date Jan 10, 2008
- HITACHI VIA MECHANICS, LTD.
- Kunio Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for laser drilling
- Publication number 20060076323
- Publication date Apr 13, 2006
- Hitachi Via Mechanics, Ltd.
- Kunio Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laser machining apparatus
- Publication number 20050161445
- Publication date Jul 28, 2005
- Kazuhisa Ishii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laser machining method and laser machining apparatus
- Publication number 20050155958
- Publication date Jul 21, 2005
- Hitachi Via Mechanics Ltd.
- Kunio Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor light emitting device having quantum well layer sandw...
- Publication number 20050145857
- Publication date Jul 7, 2005
- Stanley Electric Co., Ltd
- Tsuyoshi Maruyama
- B82 - NANO-TECHNOLOGY
Information Patent Application
Method and apparatus for laser drilling
- Publication number 20040217093
- Publication date Nov 4, 2004
- Hitachi Via Mechanics, Ltd.
- Kunio Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor light emitting device having quantum well layer sandw...
- Publication number 20040069996
- Publication date Apr 15, 2004
- Stanley Electric Co., Ltd
- Tsuyoshi Maruyama
- B82 - NANO-TECHNOLOGY
Information Patent Application
Method and apparatus for drilling printed wiring boards
- Publication number 20020040893
- Publication date Apr 11, 2002
- Hitachi Via Mechanics, Ltd.
- Kunio Arai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Light radiating device with large beam spot size and spatial optica...
- Publication number 20020024823
- Publication date Feb 28, 2002
- Stanley Electric Co., Ltd
- J. H. Liang
- H01 - BASIC ELECTRIC ELEMENTS

Kazuhisa Ishii

Person

Patents Grantslast 30 patents

Laser machining apparatus

Laser machining method and laser machining apparatus

Semiconductor light emitting device having quantum well layer sandw...

Semiconductor light emitting device having quantum well layer sandw...

Method and apparatus for drilling printed wiring boards

Light radiating device with large beam spot size and spatial optica...

Patents Applicationslast 30 patents

LASER PROCESSING METHOD OF PRINTED CIRCUIT BOARD AND LASER PROCESSI...

Method and Apparatus for Machining Thin-Film Layer of Workpiece

Composite sheet, machining method for composite sheet and laser mac...

Method and apparatus for laser drilling

Laser machining apparatus

Laser machining method and laser machining apparatus

Semiconductor light emitting device having quantum well layer sandw...

Method and apparatus for laser drilling

Semiconductor light emitting device having quantum well layer sandw...

Method and apparatus for drilling printed wiring boards

Light radiating device with large beam spot size and spatial optica...