Kazuhisa Otsuka

Person

Shimodate, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Insulation material, film, circuit board and method of producing them
- Patent number 7,700,185
- Issue date Apr 20, 2010
- Hitachi Chemical Company, Ltd.
- Yasushi Kumashiro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring board, manufacturing method thereof, semiconducto...
- Patent number 7,592,250
- Issue date Sep 22, 2009
- Hitachi Chemical Company, Ltd.
- Yasushi Shimada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring board, method for producing the same, semiconduct...
- Patent number 7,239,013
- Issue date Jul 3, 2007
- Hitachi Chemical Co., Ltd.
- Yasushi Shimada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of electronic circuit including multilayer cir...
- Patent number 6,889,431
- Issue date May 10, 2005
- Hitachi, Ltd.
- Hiroshi Okabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Production of insulating varnishes and multilayer printed circuit b...
- Patent number 6,197,149
- Issue date Mar 6, 2001
- Hitachi Chemical Company, Ltd.
- Kazuhito Kobayashi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Process for producing multilayer printed circuit board for wire bon...
- Patent number 5,879,568
- Issue date Mar 9, 1999
- Hitachi, Ltd.
- Naoyuki Urasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing multilayer printed circuit board
- Patent number 5,690,837
- Issue date Nov 25, 1997
- Hitachi Chemical Company, Ltd.
- Akishi Nakaso
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Multilayer wiring board, manufacturing method thereof, semiconducto...
- Publication number 20070108588
- Publication date May 17, 2007
- Yasushi Shimada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Insulation material, film, circuit board and method of producing them
- Publication number 20070060672
- Publication date Mar 15, 2007
- Yasushi Kumashiro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer wiring board, method for producing the same, semiconduct...
- Publication number 20060063367
- Publication date Mar 23, 2006
- HITACHI CHEMICAL CO., Ltd.
- Yasushi Shimada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing method of electronic circuit including multilayer cir...
- Publication number 20030097750
- Publication date May 29, 2003
- Hitachi, Ltd.
- Hiroshi Okabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Kazuhisa Otsuka

Person

Patents Grantslast 30 patents

Insulation material, film, circuit board and method of producing them

Multilayer wiring board, manufacturing method thereof, semiconducto...

Multilayer wiring board, method for producing the same, semiconduct...

Manufacturing method of electronic circuit including multilayer cir...

Production of insulating varnishes and multilayer printed circuit b...

Process for producing multilayer printed circuit board for wire bon...

Process for producing multilayer printed circuit board

Patents Applicationslast 30 patents

Multilayer wiring board, manufacturing method thereof, semiconducto...

Insulation material, film, circuit board and method of producing them

Multilayer wiring board, method for producing the same, semiconduct...

Manufacturing method of electronic circuit including multilayer cir...