Kazuji Yamada

Person

Ibaraki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Circuit board
- Patent number 7,141,741
- Issue date Nov 28, 2006
- Hitachi, Ltd.
- Kazuji Yamada
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Electronic device and method of fabricating the same
- Patent number 6,680,435
- Issue date Jan 20, 2004
- Hitachi, Ltd.
- Toshio Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid cooled circuit device
- Patent number 6,594,149
- Issue date Jul 15, 2003
- Hitachi, Ltd.
- Kazuji Yamada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid cooled circuit device and a manufacturing method thereof
- Patent number 6,588,647
- Issue date Jul 8, 2003
- Hitachi, Ltd.
- Kazuji Yamada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flat semiconductor device and power converter employing the same
- Patent number 6,452,261
- Issue date Sep 17, 2002
- Hitachi, Ltd.
- Hironori Kodama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,434,008
- Issue date Aug 13, 2002
- Hitachi, Ltd.
- Kazuji Yamada
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor module
- Patent number 6,353,258
- Issue date Mar 5, 2002
- Hitachi, Ltd.
- Hirokazu Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module and motor drive system
- Patent number 6,313,598
- Issue date Nov 6, 2001
- Hitachi, Ltd.
- Akihiro Tamba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including an integrally molded lead frame
- Patent number 6,291,880
- Issue date Sep 18, 2001
- Hitachi, Ltd.
- Toshio Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module, power converter using the same and manufactur...
- Patent number 6,144,571
- Issue date Nov 7, 2000
- Hitachi, Ltd.
- Yasushi Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having power semiconductor elements
- Patent number 5,956,231
- Issue date Sep 21, 1999
- Hitachi, Ltd.
- Kazuji Yamada
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Power semiconductor module employing metal based molded case and sc...
- Patent number 5,920,119
- Issue date Jul 6, 1999
- Hitachi, Ltd.
- Akihiro Tamba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power hybrid integrated circuit apparatus
- Patent number 5,661,343
- Issue date Aug 26, 1997
- Hitachi, Ltd.
- Masaaki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting substrate
- Patent number 5,350,886
- Issue date Sep 27, 1994
- Hitachi, Ltd.
- Kunio Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus of module installing type
- Patent number 5,315,482
- Issue date May 24, 1994
- Hitachi, Ltd.
- Akira Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic apparatus using semiconductor d...
- Patent number 5,258,649
- Issue date Nov 2, 1993
- Hitachi, Ltd.
- Akira Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor-carrying semiconductor module
- Patent number 5,177,670
- Issue date Jan 5, 1993
- Hitachi, Ltd.
- Hiroichi Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and computer using it
- Patent number 5,097,318
- Issue date Mar 17, 1992
- Hitachi, Ltd.
- Akira Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and computer using the package
- Patent number 5,095,359
- Issue date Mar 10, 1992
- Hitachi, Ltd.
- Akira Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip module
- Patent number 4,970,577
- Issue date Nov 13, 1990
- Hitachi, Ltd.
- Satoru Ogihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling apparatus and semiconductor device employing the same
- Patent number 4,908,695
- Issue date Mar 13, 1990
- Hitachi, Ltd.
- Atsushi Morihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder carrier, manufacturing method thereof and method of mounting...
- Patent number 4,906,823
- Issue date Mar 6, 1990
- Hitachi, Ltd.
- Tadao Kushima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical functional device of an optical waveguide type
- Patent number 4,896,930
- Issue date Jan 30, 1990
- Hitachi, Ltd.
- Shigeki Tsuchitani
- G02 - OPTICS
Information Patent Grant
X-ray tube and method for generating X-rays in the X-ray tube
- Patent number 4,891,831
- Issue date Jan 2, 1990
- Hitachi, Ltd.
- Akira Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical interconnections for integrated circuits
- Patent number 4,835,595
- Issue date May 30, 1989
- Hitachi, Ltd.
- Shigeru Oho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor absolute pressure sensor units
- Patent number 4,802,952
- Issue date Feb 7, 1989
- Hitachi, Ltd.
- Shigeyuki Kobori
- G01 - MEASURING TESTING
Information Patent Grant
Two-wire communication system
- Patent number 4,737,787
- Issue date Apr 12, 1988
- Hitachi, Ltd.
- Yukio Ito
- G08 - SIGNALLING
Information Patent Grant
Method of making silicon diaphragm pressure sensor
- Patent number 4,670,969
- Issue date Jun 9, 1987
- Hitachi, Ltd.
- Kazuji Yamada
- G01 - MEASURING TESTING
Information Patent Grant
Method of manufacturing semiconductor device having a pressure sensor
- Patent number 4,618,397
- Issue date Oct 21, 1986
- Hitachi, Ltd.
- Isao Shimizu
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor-type pressure transducer
- Patent number 4,604,899
- Issue date Aug 12, 1986
- Hitachi, Ltd.
- Kazuji Yamada
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Circuit board
- Publication number 20040056349
- Publication date Mar 25, 2004
- Kazuji Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Liquid cooled circuit device and a manufacturing method thereof
- Publication number 20030053294
- Publication date Mar 20, 2003
- Kazuji Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Liquid cooled circuit device and a manufacturing method thereof
- Publication number 20030053298
- Publication date Mar 20, 2003
- Kazuji Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20030016502
- Publication date Jan 23, 2003
- Kazuji Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power semiconductor module
- Publication number 20020153532
- Publication date Oct 24, 2002
- Yukio Sonobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flat semiconductor device and power converter employing the same
- Publication number 20020145188
- Publication date Oct 10, 2002
- Hironori Kodama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power semiconductor module
- Publication number 20010038143
- Publication date Nov 8, 2001
- Yukio Sonobe
- H01 - BASIC ELECTRIC ELEMENTS

Kazuji Yamada

Person

Patents Grantslast 30 patents

Circuit board

Electronic device and method of fabricating the same

Liquid cooled circuit device

Liquid cooled circuit device and a manufacturing method thereof

Flat semiconductor device and power converter employing the same

Semiconductor device

Semiconductor module

Power semiconductor module and motor drive system

Semiconductor device including an integrally molded lead frame

Semiconductor module, power converter using the same and manufactur...

Semiconductor device having power semiconductor elements

Power semiconductor module employing metal based molded case and sc...

Power hybrid integrated circuit apparatus

Mounting substrate

Semiconductor apparatus of module installing type

Semiconductor device and electronic apparatus using semiconductor d...

Capacitor-carrying semiconductor module

Semiconductor package and computer using it

Semiconductor package and computer using the package

Semiconductor chip module

Cooling apparatus and semiconductor device employing the same

Solder carrier, manufacturing method thereof and method of mounting...

Optical functional device of an optical waveguide type

X-ray tube and method for generating X-rays in the X-ray tube

Optical interconnections for integrated circuits

Method for manufacturing semiconductor absolute pressure sensor units

Two-wire communication system

Method of making silicon diaphragm pressure sensor

Method of manufacturing semiconductor device having a pressure sensor

Semiconductor-type pressure transducer

Patents Applicationslast 30 patents

Circuit board

Liquid cooled circuit device and a manufacturing method thereof

Liquid cooled circuit device and a manufacturing method thereof

Semiconductor device

Power semiconductor module

Flat semiconductor device and power converter employing the same

Power semiconductor module