Kazuki KAJIHARA

Person

Ogaki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 10,398,038
- Issue date Aug 27, 2019
- Ibiden Co., Ltd.
- Kazuki Kajihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interposer and method for manufacturing interposer
- Patent number 10,262,930
- Issue date Apr 16, 2019
- Ibiden Co., Ltd.
- Kazuki Kajihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and method for manufacturing same
- Patent number 10,051,740
- Issue date Aug 14, 2018
- Ibiden Co., Ltd.
- Kazuki Kajihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board
- Patent number 9,668,361
- Issue date May 30, 2017
- Ibiden Co., Ltd.
- Kazuki Kajihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 9,313,901
- Issue date Apr 12, 2016
- Ibiden Co., Ltd.
- Kazuki Kajihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 8,431,833
- Issue date Apr 30, 2013
- Ibiden Co., Ltd.
- Kazuki Kajihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING SAME
- Publication number 20180146554
- Publication date May 24, 2018
- IBIDEN CO., LTD.
- Kazuki KAJIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20180116057
- Publication date Apr 26, 2018
- IBIDEN CO., LTD.
- Kazuki KAJIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER
- Publication number 20170309558
- Publication date Oct 26, 2017
- IBIDEN CO., LTD.
- Kazuki KAJIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE
- Publication number 20170053878
- Publication date Feb 23, 2017
- IBIDEN CO., LTD.
- Kazuki KAJIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFAC...
- Publication number 20170033036
- Publication date Feb 2, 2017
- IBIDEN CO., LTD.
- Kazuki KAJIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20150034378
- Publication date Feb 5, 2015
- IBIDEN CO., LTD.
- Kazuki KAJIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20140338965
- Publication date Nov 20, 2014
- IBIDEN CO., LTD.
- Kazuki KAJIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20140060904
- Publication date Mar 6, 2014
- IBIDEN CO., LTD.
- Kazuki KAJIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20140060905
- Publication date Mar 6, 2014
- IBIDEN CO., LTD.
- Kazuki KAJIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130146345
- Publication date Jun 13, 2013
- Kazuki KAJIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100163297
- Publication date Jul 1, 2010
- IBIDEN CO., LTD.
- Kazuki KAJIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Kazuki KAJIHARA

Person

Patents Grantslast 30 patents

Printed wiring board and method for manufacturing printed wiring board

Interposer and method for manufacturing interposer

Wiring substrate and method for manufacturing same

Printed wiring board

Printed wiring board

Printed wiring board and method for manufacturing the same

Patents Applicationslast 30 patents

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING SAME

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER

PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE

PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFAC...

PRINTED WIRING BOARD

PRINTED WIRING BOARD

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME