Kazuko Narutaki

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Resin-sealed chip stack type semiconductor device
- Patent number 6,545,365
- Issue date Apr 8, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Takashi Kondo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Resin-sealed chip stack type semiconductor device
- Publication number 20010035587
- Publication date Nov 1, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Takashi Kondo
- H01 - BASIC ELECTRIC ELEMENTS