Kazuma Sekiya

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Dressing member
- Patent number 12,350,788
- Issue date Jul 8, 2025
- Disco Corporation
- Kazuma Sekiya
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus with thickness measuring unit
- Patent number 12,330,266
- Issue date Jun 17, 2025
- Disco Corporation
- Kazuma Sekiya
- B24 - GRINDING POLISHING
Information Patent Grant
Grinding apparatus and use method of grinding apparatus
- Patent number 12,304,027
- Issue date May 20, 2025
- Disco Corporation
- Tomotaka Tabuchi
- B24 - GRINDING POLISHING
Information Patent Grant
Processing method of wafer, protective sheet, and protective sheet...
- Patent number 12,217,966
- Issue date Feb 4, 2025
- Disco Corporation
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing method
- Patent number 12,211,731
- Issue date Jan 28, 2025
- Disco Corporation
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer manufacturing method
- Patent number 12,134,138
- Issue date Nov 5, 2024
- Disco Corporation
- Kazuma Sekiya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wet etching method and wet etching system
- Patent number 12,119,230
- Issue date Oct 15, 2024
- Disco Corporation
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing wafer and method of manufacturing stacked d...
- Patent number 12,087,589
- Issue date Sep 10, 2024
- Disco Corporation
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate processing method
- Patent number 12,080,564
- Issue date Sep 3, 2024
- Disco Corporation
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing apparatus including a cassette mounting section, a readi...
- Patent number 12,040,214
- Issue date Jul 16, 2024
- Disco Corporation
- Kazuma Sekiya
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Fixed temperature liquid supply apparatus
- Patent number 12,017,314
- Issue date Jun 25, 2024
- Disco Corporation
- Kazuma Sekiya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer, wafer manufacturing method, device chip manufacturing method...
- Patent number 12,011,784
- Issue date Jun 18, 2024
- Disco Corporation
- Kazuma Sekiya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Grinding apparatus and method of driving grinding apparatus
- Patent number 11,858,090
- Issue date Jan 2, 2024
- Disco Corporation
- Kazuma Sekiya
- B24 - GRINDING POLISHING
Information Patent Grant
Dressing board, use method of dressing board, and cutting apparatus
- Patent number 11,850,696
- Issue date Dec 26, 2023
- Disco Corporation
- Kazuma Sekiya
- B24 - GRINDING POLISHING
Information Patent Grant
Management method of machining system
- Patent number 11,738,422
- Issue date Aug 29, 2023
- Disco Corporation
- Kazuma Sekiya
- B24 - GRINDING POLISHING
Information Patent Grant
Protective sheet application apparatus and method
- Patent number 11,651,978
- Issue date May 16, 2023
- Disco Corporation
- Kazuma Sekiya
- B32 - LAYERED PRODUCTS
Information Patent Grant
Screwdriver
- Patent number 11,548,126
- Issue date Jan 10, 2023
- Disco Corporation
- Kazuma Sekiya
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Laser processing apparatus
- Patent number 11,534,862
- Issue date Dec 27, 2022
- Disco Corporation
- Kazuma Sekiya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silicon wafer forming method
- Patent number 11,511,374
- Issue date Nov 29, 2022
- Disco Corporation
- Kazuma Sekiya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cutting apparatus
- Patent number 11,389,920
- Issue date Jul 19, 2022
- Disco Corporation
- Kazuma Sekiya
- B24 - GRINDING POLISHING
Information Patent Grant
Cutting apparatus
- Patent number 11,351,651
- Issue date Jun 7, 2022
- Disco Corporation
- Kazuma Sekiya
- B24 - GRINDING POLISHING
Information Patent Grant
Method of processing wafer
- Patent number 11,276,588
- Issue date Mar 15, 2022
- Disco Corporation
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing method
- Patent number 11,222,823
- Issue date Jan 11, 2022
- Disco Corporation
- Kazuma Sekiya
- B32 - LAYERED PRODUCTS
Information Patent Grant
Management Method of processing tool
- Patent number 11,188,050
- Issue date Nov 30, 2021
- Disco Corporation
- Kazuma Sekiya
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cutting blade and mounting mechanism for cutting blade
- Patent number 11,167,393
- Issue date Nov 9, 2021
- Disco Corporation
- Kazuma Sekiya
- B24 - GRINDING POLISHING
Information Patent Grant
Cutting blade supplying apparatus and cutting blade case
- Patent number 11,148,243
- Issue date Oct 19, 2021
- Disco Corporation
- Kazuma Sekiya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Recess or through-hole forming method and electrode forming method
- Patent number 11,110,549
- Issue date Sep 7, 2021
- Disco Corporation
- Kazuma Sekiya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chuck table, cutting apparatus, and method correcting chuck table
- Patent number 11,101,162
- Issue date Aug 24, 2021
- Disco Corporation
- Setsuo Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing packaged board
- Patent number 11,096,287
- Issue date Aug 17, 2021
- Disco Corporation
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer and wafer producing method
- Patent number 11,072,042
- Issue date Jul 27, 2021
- Disco Corporation
- Kazuma Sekiya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
DEVICE CHIP MANUFACTURING METHOD AND WORKPIECE PROCESSING APPARATUS
- Publication number 20250239493
- Publication date Jul 24, 2025
- Disco Corporation
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM-ATTACHED SUPPORT FRAME, SUPPORT FRAME, AND METHOD OF TREATING...
- Publication number 20250135511
- Publication date May 1, 2025
- Disco Corporation
- Kazuma Sekiya
- B08 - CLEANING
Information Patent Application
WAFER PROCESSING APPARATUS AND WAFER PROCESSING METHOD
- Publication number 20240395512
- Publication date Nov 28, 2024
- Disco Corporation
- Kazuma SEKIYA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF GRINDING WAFER
- Publication number 20240383090
- Publication date Nov 21, 2024
- Disco Corporation
- Kazuma Sekiya
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF AND APPARATUS FOR PROCESSING WORKPIECE
- Publication number 20240339363
- Publication date Oct 10, 2024
- Disco Corporation
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER, AND FRONT/BACK SURFACE DETERMINATION METHOD FOR WAFER
- Publication number 20240274431
- Publication date Aug 15, 2024
- Disco Corporation
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20240145308
- Publication date May 2, 2024
- Disco Corporation
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING METHOD AND DEVICE CHIP MANUFACTURING METHOD
- Publication number 20240105513
- Publication date Mar 28, 2024
- Disco Corporation
- Kazuma SEKIYA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESSING METHOD OF BONDED WAFER AND PROCESSING APPARATUS
- Publication number 20240087901
- Publication date Mar 14, 2024
- Disco Corporation
- Kazuma SEKIYA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR AND METHOD OF PROCESSING WORKPIECE
- Publication number 20230390878
- Publication date Dec 7, 2023
- Disco Corporation
- Kazuma Sekiya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER MANUFACTURING METHOD
- Publication number 20230249282
- Publication date Aug 10, 2023
- Disco Corporation
- Kazuma Sekiya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
POLISHING APPARATUS
- Publication number 20230150086
- Publication date May 18, 2023
- Disco Corporation
- Kazuma SEKIYA
- B24 - GRINDING POLISHING
Information Patent Application
FIXED TEMPERATURE LIQUID SUPPLY APPARATUS
- Publication number 20230043272
- Publication date Feb 9, 2023
- Disco Corporation
- Kazuma SEKIYA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DRESSING BOARD, USE METHOD OF DRESSING BOARD, AND CUTTING APPARATUS
- Publication number 20230001536
- Publication date Jan 5, 2023
- Disco Corporation
- Kazuma Sekiya
- B24 - GRINDING POLISHING
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20220359259
- Publication date Nov 10, 2022
- Disco Corporation
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE PROCESSING METHOD
- Publication number 20220336232
- Publication date Oct 20, 2022
- Disco Corporation
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING WAFER AND METHOD OF MANUFACTURING STACKED D...
- Publication number 20220293424
- Publication date Sep 15, 2022
- Disco Corporation
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRINDING APPARATUS AND METHOD OF DRIVING GRINDING APPARATUS
- Publication number 20220193861
- Publication date Jun 23, 2022
- Disco Corporation
- Kazuma Sekiya
- B24 - GRINDING POLISHING
Information Patent Application
WAFER, WAFER MANUFACTURING METHOD, AND DEVICE CHIP MANUFACTURING ME...
- Publication number 20220032404
- Publication date Feb 3, 2022
- Disco Corporation
- Kazuma SEKIYA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESSING METHOD OF WAFER, PROTECTIVE SHEET, AND PROTECTIVE SHEET...
- Publication number 20220037160
- Publication date Feb 3, 2022
- Disco Corporation
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRESSING MEMBER
- Publication number 20210362295
- Publication date Nov 25, 2021
- Disco Corporation
- Kazuma Sekiya
- B24 - GRINDING POLISHING
Information Patent Application
MANAGEMENT METHOD OF MACHINING SYSTEM
- Publication number 20210339358
- Publication date Nov 4, 2021
- Disco Corporation
- Kazuma SEKIYA
- B24 - GRINDING POLISHING
Information Patent Application
WET ETCHING METHOD AND WET ETCHING SYSTEM
- Publication number 20210335620
- Publication date Oct 28, 2021
- Disco Corporation
- Kazuma SEKIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CUTTING APPARATUS, TRAY, AND TRANSPORT SYSTEM
- Publication number 20210316411
- Publication date Oct 14, 2021
- Disco Corporation
- Kazuma Sekiya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROTECTIVE SHEET APPLICATION APPARATUS AND METHOD
- Publication number 20210197537
- Publication date Jul 1, 2021
- Disco Corporation
- Kazuma Sekiya
- B32 - LAYERED PRODUCTS
Information Patent Application
SELF-POWERED WATER LEAKAGE DETECTOR
- Publication number 20210172823
- Publication date Jun 10, 2021
- Disco Corporation
- Kazuma Sekiya
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF PROCESSING WAFER
- Publication number 20210134619
- Publication date May 6, 2021
- Disco Corporation
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONVEYANCE SYSTEM
- Publication number 20210024294
- Publication date Jan 28, 2021
- Disco Corporation
- Kazuma Sekiya
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
TAPE ATTACHING METHOD
- Publication number 20200399089
- Publication date Dec 24, 2020
- Disco Corporation
- Kazuma Sekiya
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
GRINDING APPARATUS AND USE METHOD OF GRINDING APPARATUS
- Publication number 20200391337
- Publication date Dec 17, 2020
- Disco Corporation
- Tomotaka TABUCHI
- B24 - GRINDING POLISHING

Kazuma Sekiya

Person

Patents Grantslast 30 patents

Dressing member

Polishing apparatus with thickness measuring unit

Grinding apparatus and use method of grinding apparatus

Processing method of wafer, protective sheet, and protective sheet...

Wafer processing method

Wafer manufacturing method

Wet etching method and wet etching system

Method of manufacturing wafer and method of manufacturing stacked d...

Package substrate processing method

Processing apparatus including a cassette mounting section, a readi...

Fixed temperature liquid supply apparatus

Wafer, wafer manufacturing method, device chip manufacturing method...

Grinding apparatus and method of driving grinding apparatus

Dressing board, use method of dressing board, and cutting apparatus

Management method of machining system

Protective sheet application apparatus and method

Screwdriver

Laser processing apparatus

Silicon wafer forming method

Cutting apparatus

Cutting apparatus

Method of processing wafer

Wafer processing method

Management Method of processing tool

Cutting blade and mounting mechanism for cutting blade

Cutting blade supplying apparatus and cutting blade case

Recess or through-hole forming method and electrode forming method

Chuck table, cutting apparatus, and method correcting chuck table

Method of manufacturing packaged board

Wafer and wafer producing method

Patents Applicationslast 30 patents

DEVICE CHIP MANUFACTURING METHOD AND WORKPIECE PROCESSING APPARATUS

FILM-ATTACHED SUPPORT FRAME, SUPPORT FRAME, AND METHOD OF TREATING...

WAFER PROCESSING APPARATUS AND WAFER PROCESSING METHOD

METHOD OF GRINDING WAFER

METHOD OF AND APPARATUS FOR PROCESSING WORKPIECE

WAFER, AND FRONT/BACK SURFACE DETERMINATION METHOD FOR WAFER

WAFER PROCESSING METHOD

WAFER PROCESSING METHOD AND DEVICE CHIP MANUFACTURING METHOD

PROCESSING METHOD OF BONDED WAFER AND PROCESSING APPARATUS

APPARATUS FOR AND METHOD OF PROCESSING WORKPIECE

WAFER MANUFACTURING METHOD

POLISHING APPARATUS

FIXED TEMPERATURE LIQUID SUPPLY APPARATUS

DRESSING BOARD, USE METHOD OF DRESSING BOARD, AND CUTTING APPARATUS

WAFER PROCESSING METHOD

PACKAGE SUBSTRATE PROCESSING METHOD

METHOD OF MANUFACTURING WAFER AND METHOD OF MANUFACTURING STACKED D...

GRINDING APPARATUS AND METHOD OF DRIVING GRINDING APPARATUS

WAFER, WAFER MANUFACTURING METHOD, AND DEVICE CHIP MANUFACTURING ME...

PROCESSING METHOD OF WAFER, PROTECTIVE SHEET, AND PROTECTIVE SHEET...

DRESSING MEMBER

MANAGEMENT METHOD OF MACHINING SYSTEM

WET ETCHING METHOD AND WET ETCHING SYSTEM

CUTTING APPARATUS, TRAY, AND TRANSPORT SYSTEM

PROTECTIVE SHEET APPLICATION APPARATUS AND METHOD

SELF-POWERED WATER LEAKAGE DETECTOR

METHOD OF PROCESSING WAFER

CONVEYANCE SYSTEM

TAPE ATTACHING METHOD

GRINDING APPARATUS AND USE METHOD OF GRINDING APPARATUS