Kazumasa Kimura

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Nishitama-gun, JP

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Patents Grantslast 30 patents

Information Patent Grant
Bonding data setting device and method
- Patent number 6,901,305
- Issue date May 31, 2005
- Kabushiki Kaisha Shinkawa
- Kazumasa Kimura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding method
- Patent number 6,036,080
- Issue date Mar 14, 2000
- Kabushiki Kaisha Shinkawa
- Kuniyuki Takahashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Single point bonding method
- Patent number 5,634,586
- Issue date Jun 3, 1997
- Kabushiki Kaisha Shinkawa
- Kazumasa Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conveying apparatus used in assembling semicondutors
- Patent number 5,203,443
- Issue date Apr 20, 1993
- Kabushiki Kaisha Shinkawa
- Kiyoshi Toriumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method
- Patent number 5,020,715
- Issue date Jun 4, 1991
- Kabushiki Kaisha Shinkawa
- Kazumasa Kimura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Bonding data setting device and method
- Publication number 20020079348
- Publication date Jun 27, 2002
- KABUSHIKI KAISHA SHINKAWA
- Kazumasa Kimura
- H01 - BASIC ELECTRIC ELEMENTS