Kazumasa Takeuchi

Person

Tsukuba-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Dust core compound, molded body, and dust core
- Patent number 12,053,820
- Issue date Aug 6, 2024
- Resonac Corporation
- Arisa Taira
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Compound and tablet
- Patent number 11,732,124
- Issue date Aug 22, 2023
- Resonac Corporation
- Kazumasa Takeuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pregreg, film with resin, metal foil with resin, metal-clad laminat...
- Patent number 10,251,265
- Issue date Apr 2, 2019
- Hitachi Chemical Company, Ltd.
- Akiko Kawaguchi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Resin composition, prepreg using same, metal foil with resin, adhes...
- Patent number 9,132,611
- Issue date Sep 15, 2015
- Hitachi Chemical Co., Ltd.
- Kazumasa Takeuchi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Printed wiring board
- Patent number 8,664,534
- Issue date Mar 4, 2014
- Hitachi Chemical Company, Ltd.
- Kazumasa Takeuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Primer, conductor foil with resin, laminated sheet and method of ma...
- Patent number 8,507,100
- Issue date Aug 13, 2013
- Hitachi Chemical Company, Ltd.
- Kenji Tanaka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Prepreg for printed wiring board, metal foil clad laminate and prin...
- Patent number 7,947,332
- Issue date May 24, 2011
- Hitachi Chemical Company, Ltd.
- Nozomu Takano
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Prepreg, metal-clad laminate and printed circuit board using same
- Patent number 7,871,694
- Issue date Jan 18, 2011
- Hitachi Chemical Company, Ltd.
- Kazumasa Takeuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Prepreg, metal-clad laminate and printed circuit board using same
- Patent number 7,758,951
- Issue date Jul 20, 2010
- Hitachi Chemical Company, Ltd.
- Kazumasa Takeuchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Primer, conductor foil with resin, laminated sheet and method of ma...
- Patent number 7,648,770
- Issue date Jan 19, 2010
- Hitachi Chemical Company, Ltd.
- Kenji Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Prepreg and a laminated sheet
- Patent number 7,138,174
- Issue date Nov 21, 2006
- Hitachi Chemical Co., Ltd.
- Kazumasa Takeuchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive film formed of a siloxane-modified polyamideimide resin co...
- Patent number 6,475,629
- Issue date Nov 5, 2002
- Hitachi Chemical Company, Ltd.
- Kazumasa Takeuchi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Siloxane-modified polyamideimide resin composition, adhesive film,...
- Patent number 6,252,010
- Issue date Jun 26, 2001
- Hitachi Chemical Company, Ltd.
- Kazumasa Takeuchi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin composition which can be cured by application of heat or irra...
- Patent number 6,156,870
- Issue date Dec 5, 2000
- Hitachi Chemical Company, Ltd.
- Masaki Morita
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Photolithographically viahole-forming photosensitive element compri...
- Patent number 5,532,105
- Issue date Jul 2, 1996
- Hitachi Chemical Company, Ltd.
- Takashi Yamadera
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
MONOMER COMPOSITION, MOLDED BODY, BONDED MAGNET, DUST CORE
- Publication number 20240209168
- Publication date Jun 27, 2024
- Kazumasa TAKEUCHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MAGNETIC POWDER, COMPOUND, MOLDED BODY, BONDED MAGNET, AND POWDER M...
- Publication number 20240177897
- Publication date May 30, 2024
- Resonac Corporation
- Kazumasa TAKEUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPUND FOR BONDED MAGNETS, MOLDED BODY AND BONDED MAGNET
- Publication number 20230250257
- Publication date Aug 10, 2023
- Showa Denko Materials Co., Ltd.
- Kazumasa TAKEUCHI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
DUST CORE COMPOUND, MOLDED BODY, AND DUST CORE
- Publication number 20230191480
- Publication date Jun 22, 2023
- Showa Denko Materials Co., Ltd.
- Arisa TAIRA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
COMPOUND POWDER
- Publication number 20200391287
- Publication date Dec 17, 2020
- Hitachi Chemical Company, Ltd.
- Kazumasa TAKEUCHI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
COMPOUND AND TABLET
- Publication number 20200385566
- Publication date Dec 10, 2020
- Hitachi Chemical Company, Ltd.
- Kazumasa TAKEUCHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CURABLE-RESIN COMPOSITION AND CURED OBJECT THEREOF
- Publication number 20190062480
- Publication date Feb 28, 2019
- HITACHI CHEMICAL COMPANY, LTD.
- Kosuke YOKOYAMA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CURABLE RESIN COMPOSITION, COMPOSITION FOR MOLDING, RESIN MOLDED AR...
- Publication number 20180237599
- Publication date Aug 23, 2018
- HITACHI CHEMICAL COMPANY, LTD.
- Toshiaki SHIRASAKA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
COMPOSITE MATERIAL, PHOTOSENSITIVE RESIN COMPOSITION FOR SOLDER RES...
- Publication number 20180237549
- Publication date Aug 23, 2018
- HITACHI CHEMICAL COMPANY, LTD.
- Kazumasa TAKEUCHI
- B32 - LAYERED PRODUCTS
Information Patent Application
PREGREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINAT...
- Publication number 20180098425
- Publication date Apr 5, 2018
- Akiko Kawaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRIMER, CONDUCTOR FOIL WITH RESIN, LAMINATED SHEET AND METHOD OF MA...
- Publication number 20120315438
- Publication date Dec 13, 2012
- Kenji Tanaka
- B32 - LAYERED PRODUCTS
Information Patent Application
MULTI-LAYER WIRING BOARD
- Publication number 20120285732
- Publication date Nov 15, 2012
- Kazumasa TAKEUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION, PREPREG USING SAME, METAL FOIL WITH RESIN, ADHES...
- Publication number 20120244332
- Publication date Sep 27, 2012
- Hitachi Chemical Company, Ltd.
- Kazumasa Takeuchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PREGREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINAT...
- Publication number 20110272185
- Publication date Nov 10, 2011
- Akiko Kawaguchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20100270059
- Publication date Oct 28, 2010
- Kazumasa Takeuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRIMER, CONDUCTOR FOIL WITH RESIN, LAMINATED SHEET AND METHOD OF MA...
- Publication number 20100119853
- Publication date May 13, 2010
- Kenji Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MULTI-LAYER WIRING BOARD
- Publication number 20100065313
- Publication date Mar 18, 2010
- Kazumasa Takeuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PREPREG, METAL-CLAD LAMINATE AND PRINTED CIRCUIT BOARD USING SAME
- Publication number 20080302558
- Publication date Dec 11, 2008
- Kazumasa TAKEUCHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Prepreg, Metal-Clad Laminate and Printed Circuit Board Using Same
- Publication number 20070287021
- Publication date Dec 13, 2007
- Kazumasa Takeuchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Prepreg for Printed Wiring Board, Metal Foil Clad Laminate and Prin...
- Publication number 20070277375
- Publication date Dec 6, 2007
- Nozomu Takano
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Primer, conductor foil with resin, laminated sheet and method of ma...
- Publication number 20070185297
- Publication date Aug 9, 2007
- Kenji Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Prepreg and a laminated sheet
- Publication number 20040258899
- Publication date Dec 23, 2004
- Kazumasa Takeuchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Kazumasa Takeuchi

Person

Patents Grantslast 30 patents

Dust core compound, molded body, and dust core

Compound and tablet

Pregreg, film with resin, metal foil with resin, metal-clad laminat...

Resin composition, prepreg using same, metal foil with resin, adhes...

Printed wiring board

Primer, conductor foil with resin, laminated sheet and method of ma...

Prepreg for printed wiring board, metal foil clad laminate and prin...

Prepreg, metal-clad laminate and printed circuit board using same

Prepreg, metal-clad laminate and printed circuit board using same

Primer, conductor foil with resin, laminated sheet and method of ma...

Prepreg and a laminated sheet

Adhesive film formed of a siloxane-modified polyamideimide resin co...

Siloxane-modified polyamideimide resin composition, adhesive film,...

Resin composition which can be cured by application of heat or irra...

Photolithographically viahole-forming photosensitive element compri...

Patents Applicationslast 30 patents

MONOMER COMPOSITION, MOLDED BODY, BONDED MAGNET, DUST CORE

MAGNETIC POWDER, COMPOUND, MOLDED BODY, BONDED MAGNET, AND POWDER M...

COMPUND FOR BONDED MAGNETS, MOLDED BODY AND BONDED MAGNET

DUST CORE COMPOUND, MOLDED BODY, AND DUST CORE

COMPOUND POWDER

COMPOUND AND TABLET

CURABLE-RESIN COMPOSITION AND CURED OBJECT THEREOF

CURABLE RESIN COMPOSITION, COMPOSITION FOR MOLDING, RESIN MOLDED AR...

COMPOSITE MATERIAL, PHOTOSENSITIVE RESIN COMPOSITION FOR SOLDER RES...

PREGREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINAT...

PRIMER, CONDUCTOR FOIL WITH RESIN, LAMINATED SHEET AND METHOD OF MA...

MULTI-LAYER WIRING BOARD

RESIN COMPOSITION, PREPREG USING SAME, METAL FOIL WITH RESIN, ADHES...

PREGREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINAT...

PRINTED WIRING BOARD

PRIMER, CONDUCTOR FOIL WITH RESIN, LAMINATED SHEET AND METHOD OF MA...

MULTI-LAYER WIRING BOARD

PREPREG, METAL-CLAD LAMINATE AND PRINTED CIRCUIT BOARD USING SAME

Prepreg, Metal-Clad Laminate and Printed Circuit Board Using Same

Prepreg for Printed Wiring Board, Metal Foil Clad Laminate and Prin...

Primer, conductor foil with resin, laminated sheet and method of ma...

Prepreg and a laminated sheet