Kazumi Onda

Person

Hanyu-city, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device manufacturing method
- Patent number 9,917,010
- Issue date Mar 13, 2018
- Semiconductor Components Industries, LLC
- Hideaki Yoshimi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin sealing type semiconductor device and method of manufacturing...
- Patent number 9,905,497
- Issue date Feb 27, 2018
- Semiconductor Components Industries, LLC
- Takeshi Susaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin sealing type semiconductor device and method of manufacturing...
- Patent number 9,171,761
- Issue date Oct 27, 2015
- Semiconductor Components Industries, LLC
- Takeshi Sasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin sealing type semiconductor device and method of manufacturing...
- Patent number 9,136,174
- Issue date Sep 15, 2015
- Semiconductor Components Industries, LLC
- Takeshi Sasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 8,736,047
- Issue date May 27, 2014
- Semiconductor Components Industries, LLC
- Hideaki Yoshimi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin sealing type semiconductor device and method of manufacturing...
- Patent number 8,704,342
- Issue date Apr 22, 2014
- Semiconductor Components Industries, LLC
- Takeshi Sasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead frame, resin sealing mold and method for manufacturing a semic...
- Patent number 7,326,041
- Issue date Feb 5, 2008
- Sanyo Electric Co., LTD
- Isao Ochiai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame, resin sealing mold and method for manufacturing a semic...
- Patent number 6,724,072
- Issue date Apr 20, 2004
- Sanyo Electric Co., Ltd.
- Isao Ochiai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
IMAGE SENSOR PACKAGES AND RELATED METHODS
- Publication number 20240332327
- Publication date Oct 3, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Kazumi ONDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN SEALING TYPE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...
- Publication number 20150380344
- Publication date Dec 31, 2015
- Semiconductor Components Industries, LLC
- Takeshi Susaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20140220739
- Publication date Aug 7, 2014
- Semiconductor Components Industries, LLC
- Hideaki Yoshimi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN SEALING TYPE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...
- Publication number 20140179063
- Publication date Jun 26, 2014
- Semiconductor Components Industries, LLC
- Takeshi Sasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN SEALING TYPE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...
- Publication number 20100052125
- Publication date Mar 4, 2010
- SANYO ELECTRIC CO., LTD.
- Takeshi Sasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20070228554
- Publication date Oct 4, 2007
- Sanyo Electric Co., Ltd.
- Hideaki Yoshimi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead frame, resin sealing mold and method for manufacturing a semic...
- Publication number 20040155365
- Publication date Aug 12, 2004
- Sanyo Electric Co., Ltd.
- Isao Ochiai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead frame, resin sealing mold and method for manufacturing a semic...
- Publication number 20030090877
- Publication date May 15, 2003
- Isao Ochiai
- H01 - BASIC ELECTRIC ELEMENTS

Kazumi Onda

Person

Patents Grantslast 30 patents

Semiconductor device manufacturing method

Resin sealing type semiconductor device and method of manufacturing...

Resin sealing type semiconductor device and method of manufacturing...

Resin sealing type semiconductor device and method of manufacturing...

Semiconductor device and manufacturing method thereof

Resin sealing type semiconductor device and method of manufacturing...

Lead frame, resin sealing mold and method for manufacturing a semic...

Lead frame, resin sealing mold and method for manufacturing a semic...

Patents Applicationslast 30 patents

IMAGE SENSOR PACKAGES AND RELATED METHODS

RESIN SEALING TYPE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

RESIN SEALING TYPE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...

RESIN SEALING TYPE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Lead frame, resin sealing mold and method for manufacturing a semic...

Lead frame, resin sealing mold and method for manufacturing a semic...