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Nagano, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Lead frame, method for manufacturing the same and semiconductor device
Patent number
8,304,872
Issue date
Nov 6, 2012
Shinko Electric Industries Co., Ltd.
Kazumitsu Seki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lead frame having outer leads coated with a four layer plating
Patent number
8,283,759
Issue date
Oct 9, 2012
Panasonic Corporation
Seishi Oida
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Conductor substrate, semiconductor device and production method the...
Patent number
7,524,702
Issue date
Apr 28, 2009
Shinko Electric Industries Co., Ltd.
Kazumitsu Seki
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Lead frame for semiconductor device
Patent number
7,408,248
Issue date
Aug 5, 2008
Shinko Electric Industries Co., Ltd.
Kazumitsu Seki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadframe for semiconductor device
Patent number
7,329,944
Issue date
Feb 12, 2008
Shinko Electric Industries Co., Ltd.
Kazumitsu Seki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductor substrate, semiconductor device and production method the...
Patent number
7,301,226
Issue date
Nov 27, 2007
Shinko Electric Industries Co., Ltd.
Kazumitsu Seki
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Packaging component and semiconductor package
Patent number
7,190,057
Issue date
Mar 13, 2007
Shinko Electric Industries Co., Ltd.
Kazumitsu Seki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device lead frame
Patent number
6,593,643
Issue date
Jul 15, 2003
Shinko Electric Industries Co., Ltd.
Kazumitsu Seki
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
LEAD FRAME, METHOD FOR MANUFACTURING THE SAME AND SEMICONDUCTOR DEVICE
Publication number
20100127369
Publication date
May 27, 2010
Shinko Electric Industries Co., Ltd.
Kazumitsu Seki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Palladium-Plated Lead Finishing Structure For Semiconductor Part An...
Publication number
20070272441
Publication date
Nov 29, 2007
Shinko Electric Industries Co., Ltd.
Kazumitsu Seki
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Lead frame
Publication number
20070090501
Publication date
Apr 26, 2007
Seishi Oida
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Conductor substrate, semiconductor device and production method the...
Publication number
20070085178
Publication date
Apr 19, 2007
Shinko Electric Industries Co., Ltd.
Kazumitsu Seki
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Leadframe for semiconductor device
Publication number
20060214272
Publication date
Sep 28, 2006
Shinko Electric Industries Co., Ltd.
Kazumitsu Seki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Lead frame for semiconductor device
Publication number
20060125073
Publication date
Jun 15, 2006
Kazumitsu Seki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Lead frame for semiconductor packages
Publication number
20040262719
Publication date
Dec 30, 2004
Shinko Electric Industries Co., Ltd.
Kazumitsu Seki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Packaging component and semiconductor package
Publication number
20040232534
Publication date
Nov 25, 2004
SHINKO ELECTRIC INDUSTRIES, CO., LTD.
Kazumitsu Seki
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Conductor substrate, semiconductor device and production method the...
Publication number
20040207056
Publication date
Oct 21, 2004
Shinko Electric Industries Co., Ltd.
Kazumitsu Seki
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR