Kazumoto Komiya

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Mold die for a semiconductor device
- Patent number 7,355,278
- Issue date Apr 8, 2008
- Hitachi Cable, Ltd.
- Akiji Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and process for producing the same
- Patent number 6,940,161
- Issue date Sep 6, 2005
- Hitachi Cable, Ltd.
- Tadashi Kawanobe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Mold die and method for manufacturing semiconductor device using th...
- Publication number 20040180475
- Publication date Sep 16, 2004
- Akiji Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and process for producing the same
- Publication number 20020185661
- Publication date Dec 12, 2002
- HITACHI CABLE,LTD.
- Tadashi Kawanobe
- H01 - BASIC ELECTRIC ELEMENTS