Kazunari KOSAKAI

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Aizuwakamatsu, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having an external connection electrode extend...
- Patent number 6,281,571
- Issue date Aug 28, 2001
- Fujitsu Limited
- Akira Takashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin molded semiconductor device and method of manufacturing semic...
- Patent number 6,166,433
- Issue date Dec 26, 2000
- Fujitsu Limited
- Akira Takashima
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
RESIN SEALING METHOD, MOLD FOR RESIN SEALING, AND RESIN SEALING APP...
- Publication number 20080230950
- Publication date Sep 25, 2008
- Fujitsu Limited
- Takao NISHIMURA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL