Kazunari MAKI

Person

Saitama-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Copper alloy plate, copper alloy plate with plating film, and metho...
- Patent number 11,926,889
- Issue date Mar 12, 2024
- Mitsubishi Materials Corporation
- Kenji Morikawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper alloy sheet, copper alloy sheet with plating film, and metho...
- Patent number 11,920,228
- Issue date Mar 5, 2024
- Mitsubishi Materials Corporation
- Yoshiteru Akisaka
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Terminal material for connector
- Patent number 11,905,614
- Issue date Feb 20, 2024
- Mitsubishi Materials Corporation
- Naoki Miyashima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper alloy plate, copper alloy plate with plating film, and manuf...
- Patent number 11,795,525
- Issue date Oct 24, 2023
- Mitsubishi Materials Corporation
- Naoki Miyashima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper alloy plate, plating film-attached copper alloy plate, and m...
- Patent number 11,781,234
- Issue date Oct 10, 2023
- Mitsubishi Materials Corporation
- Naoki Miyashima
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Copper alloy for electronic/electric device, copper alloy sheet/str...
- Patent number 11,655,523
- Issue date May 23, 2023
- Mitsubishi Materials Corporation
- Hirotaka Matsunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconductivity stabilizing material, superconducting wire and su...
- Patent number 11,613,794
- Issue date Mar 28, 2023
- Mitsubishi Materials Corporation
- Kosei Fukuoka
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Tin-plated copper terminal material and method of manufacturing the...
- Patent number 11,572,633
- Issue date Feb 7, 2023
- Mitsubishi Materials Corporation
- Fuyumi Mawatari
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper alloy for electronic and electrical equipment, copper alloy...
- Patent number 11,319,615
- Issue date May 3, 2022
- Mitsubishi Materials Corporation
- Hirotaka Matsunaga
- C21 - METALLURGY OF IRON
Information Patent Grant
Copper alloy for electronic and electrical equipment, copper alloy...
- Patent number 11,203,806
- Issue date Dec 21, 2021
- Mitsubishi Materials Corporation
- Hirotaka Matsunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stabilizer material for superconductor
- Patent number 11,149,329
- Issue date Oct 19, 2021
- Mitsubishi Materials Corporation
- Kosei Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper alloy for electronic/electric device, copper alloy sheet/str...
- Patent number 11,104,977
- Issue date Aug 31, 2021
- Mitsubishi Materials Corporation
- Hirotaka Matsunaga
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Superconducting wire and superconducting coil
- Patent number 10,971,278
- Issue date Apr 6, 2021
- Mitsubishi Materials Corporation
- Kosei Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting wire and superconducting coil
- Patent number 10,964,454
- Issue date Mar 30, 2021
- Mitsubishi Materials Corporation
- Kosei Fukuoka
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Superconducting stabilization material, superconducting wire, and s...
- Patent number 10,964,453
- Issue date Mar 30, 2021
- Mitsubishi Materials Corporation
- Kosei Fukuoka
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Terminal material for connectors and method for producing same
- Patent number 10,923,245
- Issue date Feb 16, 2021
- Mitsubishi Materials Corporation
- Yuki Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting wire and superconducting coil
- Patent number 10,910,132
- Issue date Feb 2, 2021
- Mitsubishi Materials Corporation
- Kosei Fukuoka
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Copper alloy for electronic/electrical device, copper alloy plastic...
- Patent number 10,676,803
- Issue date Jun 9, 2020
- Mitsubishi Materials Corporation
- Hirotaka Matsunaga
- B32 - LAYERED PRODUCTS
Information Patent Grant
Copper alloy and copper alloy forming material
- Patent number 10,458,003
- Issue date Oct 29, 2019
- Mitsubishi Materials Corporation
- Kazunari Maki
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Copper alloy for electronic/electrical device, copper alloy plastic...
- Patent number 10,453,582
- Issue date Oct 22, 2019
- Mitsubishi Materials Corporation
- Hirotaka Matsunaga
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Copper alloy for electric and electronic devices, copper alloy shee...
- Patent number 10,392,680
- Issue date Aug 27, 2019
- Mitsubishi Materials Corporation
- Kazunari Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper alloy for electronic and electrical equipment, plastically w...
- Patent number 10,294,547
- Issue date May 21, 2019
- Mitsubishi Materials Corporation
- Yuki Ito
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper alloy for electronic and electrical equipment, copper alloy...
- Patent number 10,190,194
- Issue date Jan 29, 2019
- Mitsubishi Materials Corporation
- Kazunari Maki
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Copper alloy for electronic/electric device, copper alloy plastic w...
- Patent number 10,157,694
- Issue date Dec 18, 2018
- Mitsubishi Materials Corporation
- Yuki Ito
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Copper alloy for electronic devices, method of manufacturing copper...
- Patent number 10,153,063
- Issue date Dec 11, 2018
- Mitsubishi Materials Corporation
- Yuki Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper alloy for electronic/electrical device, plastically-worked c...
- Patent number 10,128,019
- Issue date Nov 13, 2018
- Mitsubishi Materials Corporation
- Hirotaka Matsunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper alloy for electronic device, method for producing copper all...
- Patent number 10,056,165
- Issue date Aug 21, 2018
- Mitsubishi Materials Corporation
- Yuki Ito
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Copper alloy for electronic device, method for producing copper all...
- Patent number 10,032,536
- Issue date Jul 24, 2018
- Mitsubishi Materials Corporation
- Yuki Ito
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Hot-rolled copper plate
- Patent number 9,938,606
- Issue date Apr 10, 2018
- Mitsubishi Materials Corporation
- Kazunari Maki
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Copper alloy for electric and electronic device, copper alloy sheet...
- Patent number 9,653,191
- Issue date May 16, 2017
- Mitsubishi Materials Corporation
- Kazunari Maki
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Patents Applicationslast 30 patents

Information Patent Application
COPPER STRIP FOR EDGEWISE BENDING, COMPONENT FOR ELECTRIC OR ELECTR...
- Publication number 20240371543
- Publication date Nov 7, 2024
- MITSUBISHI MATERIALS CORPORATION
- Kosei FUKUOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOT-ROLLED COPPER ALLOY SHEET AND SPUTTERING TARGET
- Publication number 20240124955
- Publication date Apr 18, 2024
- MITSUBISHI MATERIALS CORPORATION
- Yosuke NAKASATO
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SLIT COPPER MATERIAL, COMPONENT FOR ELECTRONIC/ELECTRIC DEVICES, BU...
- Publication number 20230395278
- Publication date Dec 7, 2023
- MITSUBISHI MATERIALS CORPORATION
- Hirotaka MATSUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER ALLOY PLASTIC WORKING MATERIAL, COPPER ALLOY ROD MATERIAL, C...
- Publication number 20230313341
- Publication date Oct 5, 2023
- MITSUBISHI MATERIALS CORPORATION
- Hirotaka MATSUNAGA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SLIT COPPER MATERIAL, PART FOR ELECTRIC/ELECTRONIC DEVICE, BUS BAR,...
- Publication number 20230313342
- Publication date Oct 5, 2023
- MITSUBISHI MATERIALS CORPORATION
- Hirotaka MATSUNAGA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COPPER ALLOY, COPPER ALLOY PLASTIC WORKING MATERIAL, COMPONENT FOR...
- Publication number 20230250514
- Publication date Aug 10, 2023
- MITSUBISHI MATERIALS CORPORATION
- Hirotaka MATSUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER ALLOY, COPPER ALLOY PLASTIC WORKING MATERIAL, COMPONENT FOR...
- Publication number 20230243018
- Publication date Aug 3, 2023
- MITSUBISHI MATERIALS CORPORATION
- Hirotaka MATSUNAGA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASTIC COPPER ALLOY WORKING MATERIAL, COPPER ALLOY WIRE MATERIAL,...
- Publication number 20230243020
- Publication date Aug 3, 2023
- MITSUBISHI MATERIALS CORPORATION
- Hirotaka MATSUNAGA
- C21 - METALLURGY OF IRON
Information Patent Application
COPPER ALLOY, PLASTICALLY WORKED COPPER ALLOY MATERIAL, COMPONENT F...
- Publication number 20230243019
- Publication date Aug 3, 2023
- MITSUBISHI MATERIALS CORPORATION
- Hirotaka MATSUNAGA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Cu-Ni-Si BASED COPPER ALLOY PLATE, Cu-Ni-Si BASED COPPER ALLOY PLAT...
- Publication number 20230143481
- Publication date May 11, 2023
- MITSUBISHI MATERIALS CORPORATION
- Kazuaki Sakai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER ALLOY SHEET, COPPER ALLOY SHEET WITH PLATING FILM, AND METHO...
- Publication number 20230047984
- Publication date Feb 16, 2023
- MITSUBISHI MATERIALS CORPORATION
- Yoshiteru Akisaka
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
TERMINAL MATERIAL FOR CONNECTOR
- Publication number 20220380924
- Publication date Dec 1, 2022
- MITSUBISHI MATERIALS CORPORATION
- Naoki Miyashima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER ALLOY PLATE, COPPER ALLOY PLATE WITH PLATING FILM, AND METHO...
- Publication number 20220316028
- Publication date Oct 6, 2022
- MITSUBISHI MATERIALS CORPORATION
- Kenji Morikawa
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COPPER ALLOY PLATE, COPPER ALLOY PLATE WITH PLATING FILM, AND MANUF...
- Publication number 20220145424
- Publication date May 12, 2022
- MITSUBISHI MATERIALS CORPORATION
- Naoki Miyashima
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COPPER ALLOY PLATE, PLATING FILM-ATTACHED COPPER ALLOY PLATE, AND M...
- Publication number 20220081738
- Publication date Mar 17, 2022
- MITSUBISHI MATERIALS CORPORATION
- Naoki Miyashima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER ALLOY FOR ELECTRONIC/ELECTRIC DEVICE, COPPER ALLOY SHEET/STR...
- Publication number 20210363612
- Publication date Nov 25, 2021
- MITSUBISHI MATERIALS CORPORATION
- Hirotaka MATSUNAGA
- B32 - LAYERED PRODUCTS
Information Patent Application
SUPERCONDUCTING WIRE AND SUPERCONDUCTING COIL
- Publication number 20210225560
- Publication date Jul 22, 2021
- MITSUBISHI MATERIALS CORPORATION
- Kosei FUKUOKA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
TIN-PLATED COPPER TERMINAL MATERIAL AND METHOD OF MANUFACTURING THE...
- Publication number 20210108325
- Publication date Apr 15, 2021
- MITSUBISHI MATERIALS CORPORATION
- Fuyumi Mawatari
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER ALLOY FOR ELECTRONIC AND ELECTRICAL EQUIPMENT, COPPER ALLOY...
- Publication number 20210017628
- Publication date Jan 21, 2021
- MITSUBISHI MATERIALS CORPORATION
- Hirotaka MATSUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER ALLOY FOR ELECTRONIC/ELECTRIC DEVICE, COPPER ALLOY SHEET/STR...
- Publication number 20210002743
- Publication date Jan 7, 2021
- MITSUBISHI MATERIALS CORPORATION
- Hirotaka MATSUNAGA
- B60 - VEHICLES IN GENERAL
Information Patent Application
SUPERCONDUCTIVITY STABILIZING MATERIAL, SUPERCONDUCTING WIRE AND SU...
- Publication number 20200340079
- Publication date Oct 29, 2020
- MITSUBISHI MATERIALS CORPORATION
- Kosei FUKUOKA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SUPERCONDUCTING STABILIZER, SUPERCONDUCTING WIRE AND SUPERCONDUCTIN...
- Publication number 20200002787
- Publication date Jan 2, 2020
- MITSUBISHI MATERIALS CORPORATION
- Kosei FUKUOKA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
TERMINAL MATERIAL FOR CONNECTORS AND METHOD FOR PRODUCING SAME
- Publication number 20190362865
- Publication date Nov 28, 2019
- Mitsubishi Shindoh Co., Ltd
- Yuki Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPERCONDUCTING STABILIZER
- Publication number 20190338396
- Publication date Nov 7, 2019
- MITSUBISHI MATERIALS CORPORATION
- Kosei FUKUOKA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SUPERCONDUCTING WIRE AND SUPERCONDUCTING COIL
- Publication number 20190066865
- Publication date Feb 28, 2019
- MITSUBISHI MATERIALS CORPORATION
- Kosei FUKUOKA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COPPER ALLOY FOR ELECTRONIC AND ELECTRICAL EQUIPMENT, COPPER ALLOY...
- Publication number 20190048449
- Publication date Feb 14, 2019
- MITSUBISHI MATERIALS CORPORATION
- Hirotaka MATSUNAGA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COPPER ALLOY FOR ELECTRONIC AND ELECTRIC DEVICE, COMPONENT FOR ELEC...
- Publication number 20180245183
- Publication date Aug 30, 2018
- MITSUBISHI MATERIALS CORPORATION
- Kazunari MAKI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COPPER ALLOY FOR ELECTRONIC/ELECTRICAL DEVICE, PLASTICALLY-WORKED C...
- Publication number 20180211741
- Publication date Jul 26, 2018
- MITSUBISHI MATERIALS CORPORATION
- Hirotaka MATSUNAGA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COPPER ALLOY FOR ELECTRONIC/ELECTRICAL DEVICE, COPPER ALLOY PLASTIC...
- Publication number 20180187292
- Publication date Jul 5, 2018
- MITSUBISHI MATERIALS CORPORATION
- Hirotaka MATSUNAGA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COPPER ALLOY FOR ELECTRONIC/ELECTRICAL DEVICE, COPPER ALLOY PLASTIC...
- Publication number 20180171437
- Publication date Jun 21, 2018
- MITSUBISHI MATERIALS CORPORATION
- Hirotaka MATSUNAGA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Kazunari MAKI

Person

Patents Grantslast 30 patents

Copper alloy plate, copper alloy plate with plating film, and metho...

Copper alloy sheet, copper alloy sheet with plating film, and metho...

Terminal material for connector

Copper alloy plate, copper alloy plate with plating film, and manuf...

Copper alloy plate, plating film-attached copper alloy plate, and m...

Copper alloy for electronic/electric device, copper alloy sheet/str...

Superconductivity stabilizing material, superconducting wire and su...

Tin-plated copper terminal material and method of manufacturing the...

Copper alloy for electronic and electrical equipment, copper alloy...

Copper alloy for electronic and electrical equipment, copper alloy...

Stabilizer material for superconductor

Copper alloy for electronic/electric device, copper alloy sheet/str...

Superconducting wire and superconducting coil

Superconducting wire and superconducting coil

Superconducting stabilization material, superconducting wire, and s...

Terminal material for connectors and method for producing same

Superconducting wire and superconducting coil

Copper alloy for electronic/electrical device, copper alloy plastic...

Copper alloy and copper alloy forming material

Copper alloy for electronic/electrical device, copper alloy plastic...

Copper alloy for electric and electronic devices, copper alloy shee...

Copper alloy for electronic and electrical equipment, plastically w...

Copper alloy for electronic and electrical equipment, copper alloy...

Copper alloy for electronic/electric device, copper alloy plastic w...

Copper alloy for electronic devices, method of manufacturing copper...

Copper alloy for electronic/electrical device, plastically-worked c...

Copper alloy for electronic device, method for producing copper all...

Copper alloy for electronic device, method for producing copper all...

Hot-rolled copper plate

Copper alloy for electric and electronic device, copper alloy sheet...

Patents Applicationslast 30 patents

COPPER STRIP FOR EDGEWISE BENDING, COMPONENT FOR ELECTRIC OR ELECTR...

HOT-ROLLED COPPER ALLOY SHEET AND SPUTTERING TARGET

SLIT COPPER MATERIAL, COMPONENT FOR ELECTRONIC/ELECTRIC DEVICES, BU...

COPPER ALLOY PLASTIC WORKING MATERIAL, COPPER ALLOY ROD MATERIAL, C...

SLIT COPPER MATERIAL, PART FOR ELECTRIC/ELECTRONIC DEVICE, BUS BAR,...

COPPER ALLOY, COPPER ALLOY PLASTIC WORKING MATERIAL, COMPONENT FOR...

COPPER ALLOY, COPPER ALLOY PLASTIC WORKING MATERIAL, COMPONENT FOR...

PLASTIC COPPER ALLOY WORKING MATERIAL, COPPER ALLOY WIRE MATERIAL,...

COPPER ALLOY, PLASTICALLY WORKED COPPER ALLOY MATERIAL, COMPONENT F...

Cu-Ni-Si BASED COPPER ALLOY PLATE, Cu-Ni-Si BASED COPPER ALLOY PLAT...

COPPER ALLOY SHEET, COPPER ALLOY SHEET WITH PLATING FILM, AND METHO...

TERMINAL MATERIAL FOR CONNECTOR

COPPER ALLOY PLATE, COPPER ALLOY PLATE WITH PLATING FILM, AND METHO...

COPPER ALLOY PLATE, COPPER ALLOY PLATE WITH PLATING FILM, AND MANUF...

COPPER ALLOY PLATE, PLATING FILM-ATTACHED COPPER ALLOY PLATE, AND M...

COPPER ALLOY FOR ELECTRONIC/ELECTRIC DEVICE, COPPER ALLOY SHEET/STR...

SUPERCONDUCTING WIRE AND SUPERCONDUCTING COIL

TIN-PLATED COPPER TERMINAL MATERIAL AND METHOD OF MANUFACTURING THE...

COPPER ALLOY FOR ELECTRONIC AND ELECTRICAL EQUIPMENT, COPPER ALLOY...

COPPER ALLOY FOR ELECTRONIC/ELECTRIC DEVICE, COPPER ALLOY SHEET/STR...

SUPERCONDUCTIVITY STABILIZING MATERIAL, SUPERCONDUCTING WIRE AND SU...

SUPERCONDUCTING STABILIZER, SUPERCONDUCTING WIRE AND SUPERCONDUCTIN...

TERMINAL MATERIAL FOR CONNECTORS AND METHOD FOR PRODUCING SAME

SUPERCONDUCTING STABILIZER

SUPERCONDUCTING WIRE AND SUPERCONDUCTING COIL

COPPER ALLOY FOR ELECTRONIC AND ELECTRICAL EQUIPMENT, COPPER ALLOY...

COPPER ALLOY FOR ELECTRONIC AND ELECTRIC DEVICE, COMPONENT FOR ELEC...

COPPER ALLOY FOR ELECTRONIC/ELECTRICAL DEVICE, PLASTICALLY-WORKED C...

COPPER ALLOY FOR ELECTRONIC/ELECTRICAL DEVICE, COPPER ALLOY PLASTIC...

COPPER ALLOY FOR ELECTRONIC/ELECTRICAL DEVICE, COPPER ALLOY PLASTIC...