Kazunari Michii

Person

Itami, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with terminals, and method of manufacturing th...
- Patent number 7,348,191
- Issue date Mar 25, 2008
- Renesas Technology Corp.
- Kazunari Michii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with terminals, and method of manufacturing th...
- Patent number 7,166,490
- Issue date Jan 23, 2007
- Renesas Technology Corp.
- Kazunari Michii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,858,938
- Issue date Feb 22, 2005
- Renesas Technology Corp.
- Kazunari Michii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame, and method for manufacturing semiconductor device and m...
- Patent number 6,836,004
- Issue date Dec 28, 2004
- Renesas Technology Corp.
- Kazunari Michii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including stacked semiconductor chips
- Patent number 6,836,007
- Issue date Dec 28, 2004
- Renesas Technology Corp.
- Kazunari Michii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module having an upper layer semiconductor package ov...
- Patent number 6,798,056
- Issue date Sep 28, 2004
- Renesas Technology Corp.
- Tetsuya Matsuura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sealed semiconductor device and lead frame used for the same
- Patent number 6,737,733
- Issue date May 18, 2004
- Renesas Technology Corp.
- Kazuyuki Misumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and electronic component
- Patent number 6,670,701
- Issue date Dec 30, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuya Matsuura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead frame with raised leads and plastic packaged semiconductor dev...
- Patent number 6,614,101
- Issue date Sep 2, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Kazuyuki Misumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of producing the same
- Patent number 6,583,511
- Issue date Jun 24, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Kazunari Michii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-encapsulated semiconductor device
- Patent number 6,552,418
- Issue date Apr 22, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Kazuyuki Misumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple chip package semiconductor device
- Patent number 6,545,366
- Issue date Apr 8, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Kazunari Michii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 6,518,652
- Issue date Feb 11, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Yasuki Takata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,445,064
- Issue date Sep 3, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Hideki Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,353,265
- Issue date Mar 5, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Kazunari Michii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,323,545
- Issue date Nov 27, 2001
- Mitsubishi DenkiKabushiki Kaisha
- Kazunari Michii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing inversion type IC's and IC module using same
- Patent number RE36077
- Issue date Feb 2, 1999
- Mitsubishi Denki Kabushiki Kaisha
- Kazunari Michii
- 351 - Optics: eye examining, vision testing and correcting
Information Patent Grant
Semiconductor device and method of producing the same
- Patent number RE35496
- Issue date Apr 29, 1997
- Mitsubishi Denki Kabushiki Kaisha
- Ken Yamamura
- 174 - Electricity: conductors and insulators
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 5,508,232
- Issue date Apr 16, 1996
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuya Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for semiconductor device
- Patent number 5,424,577
- Issue date Jun 13, 1995
- Mitsubishi Denki Kabushiki Kaisha
- Yasuhito Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device including multiple semiconductor chip...
- Patent number 5,373,188
- Issue date Dec 13, 1994
- Mitsubishi Denki Kabushiki Kaisha
- Kazunari Michii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of producing the same
- Patent number 5,334,803
- Issue date Aug 2, 1994
- Mitsubishi Denki Kabushiki Kaisha
- Ken Yamamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing inversion type IC's and IC module using same
- Patent number 5,303,120
- Issue date Apr 12, 1994
- Mitsubishi Denki Kabushiki Kaisha
- Kazunari Michii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device having tab tape and particular power...
- Patent number 5,252,853
- Issue date Oct 12, 1993
- Mitsubishi Denki Kabushiki Kaisha
- Kazunari Michii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 5,220,196
- Issue date Jun 15, 1993
- Mitsubishi Denki Kabushiki Kaisha
- Kazunari Michii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier tape
- Patent number 5,196,917
- Issue date Mar 23, 1993
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuya Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device and semiconductor device packaging el...
- Patent number 5,105,257
- Issue date Apr 14, 1992
- Mitsubishi Denki Kabushiki Kaisha
- Kazunari Michii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 5,067,005
- Issue date Nov 19, 1991
- Mitsubishi Denki Kabushiki Kaisha
- Kazunari Michii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic molded-type semiconductor device
- Patent number 5,053,855
- Issue date Oct 1, 1991
- Mitsubishi Denki Kabushiki Kaisha
- Kazunari Michii
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device with terminals, and method of manufacturing th...
- Publication number 20060240596
- Publication date Oct 26, 2006
- Renesas Technology Corp.
- Kazunari Michii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacture thereof
- Publication number 20040159925
- Publication date Aug 19, 2004
- RENESAS TECHNOLOGY CORP.
- Tetsuya Matsuura
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor package
- Publication number 20040061211
- Publication date Apr 1, 2004
- Mitsubishi Denki Kabushiki Kaisha
- Kazunari Michii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20040026789
- Publication date Feb 12, 2004
- Mitsubishi Denki Kabushiki Kaisha
- Kazunari Michii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
.Lead frame, and method for manufacturing semiconductor device and...
- Publication number 20040018663
- Publication date Jan 29, 2004
- Mitsubishi Denki Kabushiki Kaisha
- Kazunari Michii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with terminals, and method of manufacturing th...
- Publication number 20040007783
- Publication date Jan 15, 2004
- Mitsubishi Denki Kabushiki Kaisha
- Kazunari Michii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor module
- Publication number 20030174481
- Publication date Sep 18, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuya Matsuura
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor device
- Publication number 20030052393
- Publication date Mar 20, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Kazunari Michii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A SEMICONDUCTOR DEVICE
- Publication number 20020173076
- Publication date Nov 21, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Kazunari Michii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME WITH RAISED LEADS AND PLASTIC PACKAGED SEMICONDUCTOR DEV...
- Publication number 20020105060
- Publication date Aug 8, 2002
- Kazuyuki Misumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL PACKAGE SEMICONDUCTOR DEVICE
- Publication number 20020105091
- Publication date Aug 8, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Hideki Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor module and electronic component
- Publication number 20020100965
- Publication date Aug 1, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuya Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20020089050
- Publication date Jul 11, 2002
- Kazunari Michii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sealed semiconductor device and lead frame used for the same
- Publication number 20020070431
- Publication date Jun 13, 2002
- Kazuyuki Misumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resin-encapsulated semiconductor device
- Publication number 20020030251
- Publication date Mar 14, 2002
- Kazuyuki Misumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package
- Publication number 20020027279
- Publication date Mar 7, 2002
- Yasuki Takata
- H01 - BASIC ELECTRIC ELEMENTS

Kazunari Michii

Person

Patents Grantslast 30 patents

Semiconductor device with terminals, and method of manufacturing th...

Semiconductor device with terminals, and method of manufacturing th...

Semiconductor device

Lead frame, and method for manufacturing semiconductor device and m...

Semiconductor package including stacked semiconductor chips

Semiconductor module having an upper layer semiconductor package ov...

Sealed semiconductor device and lead frame used for the same

Semiconductor module and electronic component

Lead frame with raised leads and plastic packaged semiconductor dev...

Semiconductor device and a method of producing the same

Resin-encapsulated semiconductor device

Multiple chip package semiconductor device

Semiconductor package

Semiconductor device

Semiconductor device

Semiconductor device

Method of manufacturing inversion type IC's and IC module using same

Semiconductor device and method of producing the same

Method of manufacturing a semiconductor device

Lead frame for semiconductor device

Packaged semiconductor device including multiple semiconductor chip...

Semiconductor device and method of producing the same

Method of manufacturing inversion type IC's and IC module using same

Packaged semiconductor device having tab tape and particular power...

Semiconductor device

Carrier tape

Packaged semiconductor device and semiconductor device packaging el...

Semiconductor device

Plastic molded-type semiconductor device

Patents Applicationslast 30 patents

Semiconductor device with terminals, and method of manufacturing th...

Semiconductor device and method for manufacture thereof

Semiconductor package

Semiconductor device

.Lead frame, and method for manufacturing semiconductor device and...

Semiconductor device with terminals, and method of manufacturing th...

Semiconductor module

Semiconductor device

A SEMICONDUCTOR DEVICE

LEAD FRAME WITH RAISED LEADS AND PLASTIC PACKAGED SEMICONDUCTOR DEV...

DUAL PACKAGE SEMICONDUCTOR DEVICE

Semiconductor module and electronic component

Semiconductor device

Sealed semiconductor device and lead frame used for the same

Resin-encapsulated semiconductor device

Semiconductor package