Kazunori Hayashi

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Yokohama, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with smaller package
- Patent number 5,801,433
- Issue date Sep 1, 1998
- Kabushiki Kaisha Toshiba
- Mitsuhiro Nakao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with smaller package having leads with alterna...
- Patent number 5,592,020
- Issue date Jan 7, 1997
- Kabushiki Kaisha Toshiba
- Mitsuhiro Nakao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for semiconductor device of the resin encapsulation type
- Patent number 5,283,466
- Issue date Feb 1, 1994
- Kabushiki Kaisha Toshiba
- Kazunori Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for semiconductor device that prevents island torsion
- Patent number 5,162,895
- Issue date Nov 10, 1992
- Kabushiki Kaisha Toshiba
- Kenji Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frames for use in plastic mold type semiconductor devices
- Patent number 5,153,706
- Issue date Oct 6, 1992
- Kabushiki Kaisha Toshiba
- Isao Baba
- H01 - BASIC ELECTRIC ELEMENTS