Kazunori Kitamura

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing hole-filling printed wiring board, curable...
- Patent number 9,732,183
- Issue date Aug 15, 2017
- San-ei Kagaku Co., Ltd.
- Yukihiro Usui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder-mounted board, production method therefor, and semiconductor...
- Patent number 9,565,754
- Issue date Feb 7, 2017
- San-ei Kagaku Co., Ltd.
- Kazunori Kitamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition for solder bump formation, solder bump formation...
- Patent number 9,415,469
- Issue date Aug 16, 2016
- San-ei Kagaku Co., Ltd.
- Yasuhiro Takase
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface mounting method utilizing active resin composition
- Patent number 9,072,205
- Issue date Jun 30, 2015
- San-ei Kagaku Co., Ltd.
- Kazunori Kitamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for producing the same
- Patent number 8,758,986
- Issue date Jun 24, 2014
- San-ei Kagaku Co., Ltd.
- Takeshi Saito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for surface mounting using cleaning-free activated resinous...
- Patent number 8,551,819
- Issue date Oct 8, 2013
- San-ei Kagaku Co., Ltd.
- Kazunori Kitamura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Curable resin composition, halogen-free resin substrate, and haloge...
- Patent number 8,232,477
- Issue date Jul 31, 2012
- San-ei Kagaku Co., Ltd.
- Kazunori Kitamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Smooth board and process for preparing a smooth board
- Patent number 7,410,673
- Issue date Aug 12, 2008
- SAN-EI Kagaku Co., Ltd.
- Kiyoshi Sato
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Photo-setting and thermosetting resin composition, process for prep...
- Patent number 7,396,885
- Issue date Jul 8, 2008
- SAN-EI Kagaku Co., Ltd.
- Kiyoshi Sato
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Composition of epoxy resin-unsaturated acid adduct, (meth)acrylate...
- Patent number 6,812,299
- Issue date Nov 2, 2004
- San-ei Kagaku Co., Ltd.
- Kiyoshi Sato
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING HOLE-FILLING PRINTED WIRING BOARD, CURABLE...
- Publication number 20170066868
- Publication date Mar 9, 2017
- SAN-EI KAGAKU CO., LTD.
- Yukihiro USUI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE MOUNTING METHOD UTILIZING ACTIVE RESIN COMPOSITION
- Publication number 20150158103
- Publication date Jun 11, 2015
- SAN-EI KAGAKU CO., LTD.
- Kazunori KITAMURA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION FOR SOLDER BUMP FORMATION, SOLDER BUMP FORMATION...
- Publication number 20150027768
- Publication date Jan 29, 2015
- SAN-EI KAGAKU CO., LTD.
- Yasuhiro TAKASE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER-MOUNTED BOARD, PRODUCTION METHOD THEREFOR, AND SEMICONDUCTOR...
- Publication number 20130264105
- Publication date Oct 10, 2013
- SAN-EI KAGAKU CO., LTD.
- Kazunori KITAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE RESIN COMPOSITION, SURFACE MOUNTING METHOD AND PRINTED WIRIN...
- Publication number 20120168219
- Publication date Jul 5, 2012
- SAN-EI KAGAKU CO., LTD.
- Kazunori KITAMURA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SURFACE MOUNTING USING CLEANING-FREE ACTIVATED RESINOUS...
- Publication number 20120153009
- Publication date Jun 21, 2012
- SAN-EI KAGAKU CO., LTD.
- Kazunori Kitamura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME
- Publication number 20110132639
- Publication date Jun 9, 2011
- SAN-EI KAGAKU CO., LTD.
- Takeshi SAITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CLEANING-FREE ACTIVATED RESINOUS COMPOSITION AND METHOD FOR SURFACE...
- Publication number 20110031300
- Publication date Feb 10, 2011
- SAN-EI KAGAKU CO., LTD.
- Kazunori Kitamura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CURABLE RESIN COMPOSITION, HALOGEN-FREE RESIN SUBSTRATE, AND HALOGE...
- Publication number 20100006324
- Publication date Jan 14, 2010
- SAN-EI KAGAKU CO., LTD.
- Kazunori KITAMURA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Multilayer circuit board and method of producing the same
- Publication number 20060042832
- Publication date Mar 2, 2006
- Kiyoshi Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermosetting resin composition
- Publication number 20050019582
- Publication date Jan 27, 2005
- Kiyoshi Sato
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Photo-setting and thermosetting resin composition, process for prep...
- Publication number 20030215567
- Publication date Nov 20, 2003
- SAN-EI KAGAKU Co., Ltd.
- Kiyoshi Sato
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Thermosetting resin composition
- Publication number 20030162898
- Publication date Aug 28, 2003
- Kiyoshi Sato
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Kazunori Kitamura

Person

Patents Grantslast 30 patents

Method for manufacturing hole-filling printed wiring board, curable...

Solder-mounted board, production method therefor, and semiconductor...

Resin composition for solder bump formation, solder bump formation...

Surface mounting method utilizing active resin composition

Printed wiring board and method for producing the same

Method for surface mounting using cleaning-free activated resinous...

Curable resin composition, halogen-free resin substrate, and haloge...

Smooth board and process for preparing a smooth board

Photo-setting and thermosetting resin composition, process for prep...

Composition of epoxy resin-unsaturated acid adduct, (meth)acrylate...

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING HOLE-FILLING PRINTED WIRING BOARD, CURABLE...

SURFACE MOUNTING METHOD UTILIZING ACTIVE RESIN COMPOSITION

RESIN COMPOSITION FOR SOLDER BUMP FORMATION, SOLDER BUMP FORMATION...

SOLDER-MOUNTED BOARD, PRODUCTION METHOD THEREFOR, AND SEMICONDUCTOR...

ACTIVE RESIN COMPOSITION, SURFACE MOUNTING METHOD AND PRINTED WIRIN...

METHOD FOR SURFACE MOUNTING USING CLEANING-FREE ACTIVATED RESINOUS...

PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME

CLEANING-FREE ACTIVATED RESINOUS COMPOSITION AND METHOD FOR SURFACE...

CURABLE RESIN COMPOSITION, HALOGEN-FREE RESIN SUBSTRATE, AND HALOGE...

Multilayer circuit board and method of producing the same

Thermosetting resin composition

Photo-setting and thermosetting resin composition, process for prep...

Thermosetting resin composition