Kazunori Yamamoto

Person

Tsukuba, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Adhesive agent, adhesive material using the same, and method of use...
- Patent number 10,322,572
- Issue date Jun 18, 2019
- HITACHI CHEMICAL COMPANY, LTD.
- Katsuyuki Masuda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Composition set, conductive substrate and method of producing the s...
- Patent number 9,676,969
- Issue date Jun 13, 2017
- Hitachi Chemical Company, Ltd.
- Hideo Nakako
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper metal film, method for producing same, copper metal pattern,...
- Patent number 9,457,406
- Issue date Oct 4, 2016
- Hitachi Chemical Company, Ltd.
- Hideo Nakako
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Copper conductor film and manufacturing method thereof, conductive...
- Patent number 8,801,971
- Issue date Aug 12, 2014
- Hitachi Chemical Company, Ltd.
- Hideo Nakako
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Ink for forming liquid crystal spacer and liquid crystal display de...
- Patent number 8,040,486
- Issue date Oct 18, 2011
- Hitachi Chemical Company, Ltd.
- Yasushi Kumashiro
- G02 - OPTICS
Information Patent Grant
Insulation material, film, circuit board and method of producing them
- Patent number 7,700,185
- Issue date Apr 20, 2010
- Hitachi Chemical Company, Ltd.
- Yasushi Kumashiro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring board, manufacturing method thereof, semiconducto...
- Patent number 7,592,250
- Issue date Sep 22, 2009
- Hitachi Chemical Company, Ltd.
- Yasushi Shimada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring board, method for producing the same, semiconduct...
- Patent number 7,239,013
- Issue date Jul 3, 2007
- Hitachi Chemical Co., Ltd.
- Yasushi Shimada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of electronic circuit including multilayer cir...
- Patent number 6,889,431
- Issue date May 10, 2005
- Hitachi, Ltd.
- Hiroshi Okabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive, adhesive member, interconnecting substrate for semiconduc...
- Patent number 6,838,170
- Issue date Jan 4, 2005
- Hitachi Chemical Company, Ltd.
- Yuko Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive, adhesive member, interconnecting substrate for semiconduc...
- Patent number 6,673,441
- Issue date Jan 6, 2004
- Hitachi Chemical Company, Ltd.
- Yuko Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor device, substrate for mounting semiconductor chip, pr...
- Patent number 6,621,170
- Issue date Sep 16, 2003
- Hitachi Chemical Company, Ltd.
- Kazunori Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filmy adhesive for connecting circuits and circuit board
- Patent number 6,328,844
- Issue date Dec 11, 2001
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device, semiconductor chip mounting substrate, method...
- Patent number 6,265,782
- Issue date Jul 24, 2001
- Hitachi Chemical Co., Ltd.
- Kazunori Yamamoto
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of production of semiconductor device
- Patent number 6,223,429
- Issue date May 1, 2001
- Hitachi Chemical Company, Ltd.
- Aizou Kaneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Production of insulating varnishes and multilayer printed circuit b...
- Patent number 6,197,149
- Issue date Mar 6, 2001
- Hitachi Chemical Company, Ltd.
- Kazuhito Kobayashi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Electronic component parts device
- Patent number 6,184,577
- Issue date Feb 6, 2001
- Hitachi Chemical Company, Ltd.
- Kenzo Takemura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring board for mounting semiconductor device and metho...
- Patent number 6,090,468
- Issue date Jul 18, 2000
- Hitachi Chemical Company, Ltd.
- Yasushi Shimada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive, adhesive film and adhesive-backed metal foil
- Patent number 5,965,269
- Issue date Oct 12, 1999
- Hitachi Chemical Company, Ltd.
- Teiichi Inada
- B32 - LAYERED PRODUCTS
Information Patent Grant
Bonding film for printed circuit boards
- Patent number 5,885,723
- Issue date Mar 23, 1999
- Hitachi Chemical Company, Ltd.
- Atsushi Takahashi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Process for producing multilayer printed circuit board
- Patent number 5,690,837
- Issue date Nov 25, 1997
- Hitachi Chemical Company, Ltd.
- Akishi Nakaso
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
COMPOSITION SET, CONDUCTIVE SUBSTRATE AND METHOD OF PRODUCING THE S...
- Publication number 20140242362
- Publication date Aug 28, 2014
- Hideo Nakako
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR FORMING A COPPER WIRING PATTERN
- Publication number 20130295276
- Publication date Nov 7, 2013
- Hideo NAKAKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE AGENT, ADHESIVE MATERIAL USING THE SAME, AND METHOD OF USE...
- Publication number 20130008593
- Publication date Jan 10, 2013
- Hitachi Chemical Company, Ltd.
- Katsuyuki MASUDA
- B32 - LAYERED PRODUCTS
Information Patent Application
COPPER METAL FILM, METHOD FOR PRODUCING SAME, COPPER METAL PATTERN,...
- Publication number 20120175147
- Publication date Jul 12, 2012
- Hideo Nakako
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
PRINTING INK, METAL NANOPARTICLES USED IN THE SAME, WIRING, CIRCUIT...
- Publication number 20120170241
- Publication date Jul 5, 2012
- Hideo Nakako
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER CONDUCTOR FILM AND MANUFACTURING METHOD THEREOF, CONDUCTIVE...
- Publication number 20120125659
- Publication date May 24, 2012
- Hideo Nakako
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROCESS FOR PRODUCING SPACER FOR LIQUID CRYSTAL DISPLAY APPARATUS,...
- Publication number 20110141428
- Publication date Jun 16, 2011
- Naoki Maruyama
- G02 - OPTICS
Information Patent Application
Ink for Forming Liquid Crystal Spacer and Liquid Crystal Display De...
- Publication number 20100328599
- Publication date Dec 30, 2010
- Yasushi Kumashiro
- G02 - OPTICS
Information Patent Application
METHOD FOR FORMING A COPPER WIRING PATTERN, AND COPPER OXIDE PARTIC...
- Publication number 20100233011
- Publication date Sep 16, 2010
- Hideo Nakako
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Organic Field Effect Transistor
- Publication number 20090134386
- Publication date May 28, 2009
- Hideo Nakako
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer wiring board, manufacturing method thereof, semiconducto...
- Publication number 20070108588
- Publication date May 17, 2007
- Yasushi Shimada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Insulation material, film, circuit board and method of producing them
- Publication number 20070060672
- Publication date Mar 15, 2007
- Yasushi Kumashiro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Adhesive, adhesive member, interconnecting substrate for semiconduc...
- Publication number 20030145949
- Publication date Aug 7, 2003
- Yuko Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Manufacturing method of electronic circuit including multilayer cir...
- Publication number 20030097750
- Publication date May 29, 2003
- Hitachi, Ltd.
- Hiroshi Okabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device, substrate for mounting semiconductor chip, pr...
- Publication number 20010022404
- Publication date Sep 20, 2001
- Hitachi Chemical Company Ltd.
- Kazunori Yamamoto
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Kazunori Yamamoto

Person

Patents Grantslast 30 patents

Adhesive agent, adhesive material using the same, and method of use...

Composition set, conductive substrate and method of producing the s...

Copper metal film, method for producing same, copper metal pattern,...

Copper conductor film and manufacturing method thereof, conductive...

Ink for forming liquid crystal spacer and liquid crystal display de...

Insulation material, film, circuit board and method of producing them

Multilayer wiring board, manufacturing method thereof, semiconducto...

Multilayer wiring board, method for producing the same, semiconduct...

Manufacturing method of electronic circuit including multilayer cir...

Adhesive, adhesive member, interconnecting substrate for semiconduc...

Adhesive, adhesive member, interconnecting substrate for semiconduc...

Semiconductor device, substrate for mounting semiconductor chip, pr...

Filmy adhesive for connecting circuits and circuit board

Semiconductor device, semiconductor chip mounting substrate, method...

Method of production of semiconductor device

Production of insulating varnishes and multilayer printed circuit b...

Electronic component parts device

Multilayer wiring board for mounting semiconductor device and metho...

Adhesive, adhesive film and adhesive-backed metal foil

Bonding film for printed circuit boards

Process for producing multilayer printed circuit board

Patents Applicationslast 30 patents

COMPOSITION SET, CONDUCTIVE SUBSTRATE AND METHOD OF PRODUCING THE S...

METHOD FOR FORMING A COPPER WIRING PATTERN

ADHESIVE AGENT, ADHESIVE MATERIAL USING THE SAME, AND METHOD OF USE...

COPPER METAL FILM, METHOD FOR PRODUCING SAME, COPPER METAL PATTERN,...

PRINTING INK, METAL NANOPARTICLES USED IN THE SAME, WIRING, CIRCUIT...

COPPER CONDUCTOR FILM AND MANUFACTURING METHOD THEREOF, CONDUCTIVE...

PROCESS FOR PRODUCING SPACER FOR LIQUID CRYSTAL DISPLAY APPARATUS,...

Ink for Forming Liquid Crystal Spacer and Liquid Crystal Display De...

METHOD FOR FORMING A COPPER WIRING PATTERN, AND COPPER OXIDE PARTIC...

Organic Field Effect Transistor

Multilayer wiring board, manufacturing method thereof, semiconducto...

Insulation material, film, circuit board and method of producing them

Adhesive, adhesive member, interconnecting substrate for semiconduc...

Manufacturing method of electronic circuit including multilayer cir...

Semiconductor device, substrate for mounting semiconductor chip, pr...