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Kazuo Akamatsu
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Okazaki, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device having semiconductor chip and metal plate
Patent number
8,441,122
Issue date
May 14, 2013
Denso Corporation
Daisuke Fukuoka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of patterning resin insulation laye...
Patent number
8,405,218
Issue date
Mar 26, 2013
Denso Corporation
Manabu Tomisaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Formation method of metallic electrode of semiconductor device and...
Patent number
8,263,490
Issue date
Sep 11, 2012
Denso Corporation
Manabu Tomisaka
G01 - MEASURING TESTING
Information
Patent Grant
Method of manufacturing semiconductor device
Patent number
6,908,857
Issue date
Jun 21, 2005
Denso Corporation
Kazuo Akamatsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electrical wiring of semiconductor device enabling increase in elec...
Patent number
6,650,017
Issue date
Nov 18, 2003
Denso Corporation
Kazuo Akamatsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Aluminum line with crystal grains
Patent number
5,018,001
Issue date
May 21, 1991
Nippondenso Co., Ltd.
Kenji Kondo
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20230121589
Publication date
Apr 20, 2023
DENSO CORPORATION
KAZUO AKAMATSU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Publication number
20110207264
Publication date
Aug 25, 2011
DENSO CORPORATION
Manabu TOMISAKA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Formation method of metallic electrode of semiconductor device and...
Publication number
20110207241
Publication date
Aug 25, 2011
DENSO CORPORATION
Manabu Tomisaka
G01 - MEASURING TESTING
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF PATTERNNING RESIN INSULATION LAY...
Publication number
20110198733
Publication date
Aug 18, 2011
DENSO CORPORATION
Manabu Tomisaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device having semiconductor chip and metal plate and...
Publication number
20110042741
Publication date
Feb 24, 2011
DENSO CORPORATION
Daisuke Fukuoka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of manufacturing semiconductor device
Publication number
20040046266
Publication date
Mar 11, 2004
Kazuo Akamatsu
H01 - BASIC ELECTRIC ELEMENTS