Kazuo Hagiwara

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Osaka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Heat dissipation structure
- Patent number 10,356,946
- Issue date Jul 16, 2019
- Kaneka Corporation
- Keisuke Oguma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat dissipating structure
- Patent number 9,826,623
- Issue date Nov 21, 2017
- Kaneka Corporation
- Aki Koukami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Curable resin composition
- Patent number 6,183,551
- Issue date Feb 6, 2001
- Kaneka Corporation
- Toshihiko Okamoto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for adhering or sealing
- Patent number 5,804,253
- Issue date Sep 8, 1998
- Kanegafuchi Chemical Ind. Co., Ltd.
- Kazuo Hagiwara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
HEAT DISSIPATING STRUCTURE
- Publication number 20160157334
- Publication date Jun 2, 2016
- Kaneka Corporation
- Aki KOUKAMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION STRUCTURE
- Publication number 20150351217
- Publication date Dec 3, 2015
- Kaneka Corporation
- Aki KOUKAMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION STRUCTURE
- Publication number 20150163958
- Publication date Jun 11, 2015
- Kaneka Corporation
- Keisuke Oguma
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Primer composition and method of bonding therewith
- Publication number 20040176518
- Publication date Sep 9, 2004
- Toshihiko Okamoto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...