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Kazuo Hujie
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Tokyo, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Wafer and method of producing the same
Patent number
7,951,716
Issue date
May 31, 2011
Sumco Corporation
Etsurou Morita
B24 - GRINDING POLISHING
Information
Patent Grant
Bonded wafer and method of producing the same
Patent number
7,718,507
Issue date
May 18, 2010
Sumco Corporation
Etsurou Morita
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Bonded wafer and method of producing the same
Publication number
20070243694
Publication date
Oct 18, 2007
Etsurou Morita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Wafer and method of producing the same
Publication number
20070197035
Publication date
Aug 23, 2007
SUMCO CORPORATION
Etsurou Morita
B24 - GRINDING POLISHING