Kazuo Kondo

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Osaka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Copper filling-up method
- Patent number 9,512,534
- Issue date Dec 6, 2016
- OSAKA PREFECTURE UNIVERSITY PUBLIC CORPORATION
- Kazuo Kondo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper filling-up method
- Patent number 8,273,232
- Issue date Sep 25, 2012
- Osaka Prefecture University Public Corporation
- Naoki Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ACIDIC COPPER PLATING SOLUTION, ACIDIC COPPER PLATED PRODUCT, AND M...
- Publication number 20180112321
- Publication date Apr 26, 2018
- FINE FEATURE ELECTRODEPOSITION RESEARCH INSTITUTE, INC.
- Kazuo KONDO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FILM-FORMING APPARATUS AND FILM-FORMING METHOD
- Publication number 20140246325
- Publication date Sep 4, 2014
- SHINMAYWA INDUSTRIES, LTD.
- Takayuki Tsuchiya
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COPPER FILLING-UP METHOD
- Publication number 20130334053
- Publication date Dec 19, 2013
- Nitto Boseki Co., Ltd.
- Kazuo KONDO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER FILLING-UP METHOD
- Publication number 20100307925
- Publication date Dec 9, 2010
- OSAKA PREFECTURE UNIVERSITY PUBLIC CORPORATION
- Kazuo KONDO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER FILLING-UP METHOD
- Publication number 20100255269
- Publication date Oct 7, 2010
- OSAKA PREFECTURE UNIVERSITY PUBLIC CORPORATION
- Naoki Okamoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR