Kazuo Ogata

Person

Tsukuba-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated heat spreader for multi-chip packages
- Patent number 9,460,982
- Issue date Oct 4, 2016
- Intel Corporation
- Shinobu Kourakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated heat spreader for multi-chip packages
- Patent number 9,236,323
- Issue date Jan 12, 2016
- Intel Corporation
- Shinobu Kourakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated heat spreader and method of fabrication
- Patent number 8,863,383
- Issue date Oct 21, 2014
- Intel Corporation
- Kazuo Ogata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated heat spreader and method of fabrication
- Patent number 8,136,244
- Issue date Mar 20, 2012
- Intel Corporation
- Kazuo Ogata
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Flexible joint methodology to attach a die on an organic substrate
- Patent number 7,554,198
- Issue date Jun 30, 2009
- Intel Corporation
- Kazuo Ogata
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SWAGING PROCESS FOR COMPLEX INTEGRATED HEAT SPREADERS
- Publication number 20190043778
- Publication date Feb 7, 2019
- Zhizhong TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED HEAT SPREADER FOR MULTI-CHIP PACKAGES
- Publication number 20160372398
- Publication date Dec 22, 2016
- Intel Corporation
- Shinobu Kourakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED HEAT SPREADER FOR MULTI-CHIP PACKAGES
- Publication number 20160086871
- Publication date Mar 24, 2016
- Intel Corporation
- Shinobu Kourakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED HEAT SPREADER FOR MULTI-CHIP PACKAGES
- Publication number 20140239482
- Publication date Aug 28, 2014
- Shinobu Kourakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED HEAT SPREADER AND METHOD OF FABRICATION
- Publication number 20120114859
- Publication date May 10, 2012
- Kazuo Ogata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED HEAT SPREADER AND METHOD OF FABRICATION
- Publication number 20090229127
- Publication date Sep 17, 2009
- Kazuo Ogata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flexible joint methodology to attach a die on an organic substrate
- Publication number 20080001270
- Publication date Jan 3, 2008
- Kazuo Ogata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cured mold compound spacer for stacked-die package
- Publication number 20070231970
- Publication date Oct 4, 2007
- Tsuyoshi Fukuo
- H01 - BASIC ELECTRIC ELEMENTS

Kazuo Ogata

Person

Patents Grantslast 30 patents

Integrated heat spreader for multi-chip packages

Integrated heat spreader for multi-chip packages

Integrated heat spreader and method of fabrication

Integrated heat spreader and method of fabrication

Flexible joint methodology to attach a die on an organic substrate

Patents Applicationslast 30 patents

SWAGING PROCESS FOR COMPLEX INTEGRATED HEAT SPREADERS

INTEGRATED HEAT SPREADER FOR MULTI-CHIP PACKAGES

INTEGRATED HEAT SPREADER FOR MULTI-CHIP PACKAGES

INTEGRATED HEAT SPREADER FOR MULTI-CHIP PACKAGES

INTEGRATED HEAT SPREADER AND METHOD OF FABRICATION

INTEGRATED HEAT SPREADER AND METHOD OF FABRICATION

Flexible joint methodology to attach a die on an organic substrate

Cured mold compound spacer for stacked-die package