Kazuo SHIMOKAWA

Person

Yokohama-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing semiconductor device having chip stacked a...
- Patent number 11,923,287
- Issue date Mar 5, 2024
- Kabushiki Kaisha Toshiba
- Takayuki Tajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor
- Patent number 11,862,667
- Issue date Jan 2, 2024
- Kabushiki Kaisha Toshiba
- Susumu Obata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor and etching method
- Patent number 11,688,557
- Issue date Jun 27, 2023
- Kabushiki Kaisha Toshiba
- Kazuhito Higuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus and wire bonding method
- Patent number 11,610,860
- Issue date Mar 21, 2023
- Kabushiki Kaisha Toshiba
- Masatoshi Tanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structural body and method of manufacturing the same
- Patent number 11,588,059
- Issue date Feb 21, 2023
- Kabushiki Kaisha Toshiba
- Mitsuo Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor and capacitor module
- Patent number 11,551,864
- Issue date Jan 10, 2023
- Kabushiki Kaisha Toshiba
- Keiichiro Matsuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor
- Patent number 11,322,308
- Issue date May 3, 2022
- Kabushiki Kaisha Toshiba
- Mitsuo Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 11,270,934
- Issue date Mar 8, 2022
- Kabushiki Kaisha Toshiba
- Takayuki Tajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having chip stacked and molded
- Patent number 11,227,826
- Issue date Jan 18, 2022
- Kabushiki Kaisha Toshiba
- Takayuki Tajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method and plating solution
- Patent number 10,991,590
- Issue date Apr 27, 2021
- Kabushiki Kaisha Toshiba
- Mitsuo Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing system for a catalytic layer of a noble metal formed on...
- Patent number 10,978,358
- Issue date Apr 13, 2021
- Kabushiki Kaisha Toshiba
- Mitsuo Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor and capacitor module
- Patent number 10,964,474
- Issue date Mar 30, 2021
- Kabushiki Kaisha Toshiba
- Keiichiro Matsuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method, method of manufacturing semiconductor chip, and met...
- Patent number 10,854,466
- Issue date Dec 1, 2020
- Kabushiki Kaisha Toshiba
- Keiichiro Matsuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 10,811,391
- Issue date Oct 20, 2020
- Kabushiki Kaisha Toshiba
- Akira Tojo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a re-interconnection layer and metho...
- Patent number 10,658,338
- Issue date May 19, 2020
- TOSHIBA MEMORY CORPORATION
- Takayuki Tajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a three-sided textured substrate
- Patent number 10,573,603
- Issue date Feb 25, 2020
- Kabushiki Kaisha Toshiba
- Akira Tojo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method for manufacturing semiconductor device...
- Patent number 10,510,726
- Issue date Dec 17, 2019
- Kabushiki Kaisha Toshiba
- Akira Tojo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,438,935
- Issue date Oct 8, 2019
- TOSHIBA MEMORY CORPORATION
- Kazuo Shimokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device and the semiconductor...
- Patent number 10,128,153
- Issue date Nov 13, 2018
- Kabushiki Kaisha Toshiba
- Takayuki Tajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method, method of manufacturing semiconductor chip, and met...
- Patent number 10,090,158
- Issue date Oct 2, 2018
- Kabushiki Kaisha Toshiba
- Keiichiro Matsuo
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Magnetic shielded package having magnetic shield members
- Patent number 9,885,762
- Issue date Feb 6, 2018
- Kabushiki Kaisha Toshiba
- Keiju Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 9,431,588
- Issue date Aug 30, 2016
- Kabushiki Kaisha Toshiba
- Kazuo Shimokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and luminaire
- Patent number 9,236,551
- Issue date Jan 12, 2016
- Toshiba Lighting & Technology Corporation
- Kiyoshi Nishimura
- F21 - LIGHTING
Information Patent Grant
Semiconductor light emitting device and method for manufacturing th...
- Patent number 9,202,982
- Issue date Dec 1, 2015
- Kabushiki Kaisha Toshiba
- Susumu Obata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light emitting device and method for manufacturing th...
- Patent number 9,087,974
- Issue date Jul 21, 2015
- Kabushiki Kaisha Toshiba
- Akiya Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical semiconductor device and method for manufacturing same
- Patent number 8,981,412
- Issue date Mar 17, 2015
- Kabushiki Kaisha Toshiba
- Hiroshi Koizumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light emitting device and method for manufacturing th...
- Patent number 8,916,901
- Issue date Dec 23, 2014
- Kabushiki Kaisha Toshiba
- Akiya Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,906,716
- Issue date Dec 9, 2014
- Kabushiki Kaisha Toshiba
- Kazuo Shimokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical semiconductor device and method for manufacturing same
- Patent number 8,754,429
- Issue date Jun 17, 2014
- Kabushiki Kaisha Toshiba
- Hiroshi Koizumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,581,291
- Issue date Nov 12, 2013
- Kabushiki Kaisha Toshiba
- Kazuo Shimokawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CAPACITOR AND ETCHING METHOD
- Publication number 20230307184
- Publication date Sep 28, 2023
- Kabushiki Kaisha Toshiba
- Kazuhito HIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CHIP STACKED AND MOLDED
- Publication number 20220102262
- Publication date Mar 31, 2022
- Kabushiki Kaisha Toshiba
- Takayuki TAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND MANUFACTURING APP...
- Publication number 20210313194
- Publication date Oct 7, 2021
- Kabushiki Kaisha Toshiba
- Takayuki TAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING CATALYST LAYER
- Publication number 20210299648
- Publication date Sep 30, 2021
- Kabushiki Kaisha Toshiba
- Susumu OBATA
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
STRUCTURAL BODY AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210296513
- Publication date Sep 23, 2021
- Kabushiki Kaisha Toshiba
- Mitsuo SANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BATTERY AND MANUFACTURING METHOD OF BATTERY
- Publication number 20210280837
- Publication date Sep 9, 2021
- Kabushiki Kaisha Toshiba
- Takashi ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUNDLING METHOD, MANUFACTURING METHOD OF BATTERY, AND BUNDLING APPA...
- Publication number 20210280841
- Publication date Sep 9, 2021
- Kabushiki Kaisha Toshiba
- Takahiro AIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRODE GROUP AND BATTERY
- Publication number 20210280840
- Publication date Sep 9, 2021
- Kabushiki Kaisha Toshiba
- Masatoshi TANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD AND PLATING SOLUTION
- Publication number 20210217626
- Publication date Jul 15, 2021
- Kabushiki Kaisha Toshiba
- Mitsuo SANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR AND CAPACITOR MODULE
- Publication number 20210175011
- Publication date Jun 10, 2021
- KABUSHIKI KAISHA TOSHIBA
- Keiichiro MATSUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR AND ETCHING METHOD
- Publication number 20210091171
- Publication date Mar 25, 2021
- KABUSHIKI KAISHA TOSHIBA
- Kazuhito HIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS AND WIRE BONDING METHOD
- Publication number 20210091038
- Publication date Mar 25, 2021
- Kabushiki Kaisha Toshiba
- Masatoshi Tanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAPACITOR
- Publication number 20210090814
- Publication date Mar 25, 2021
- KABUSHIKI KAISHA TOSHIBA
- Mitsuo SANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20200266089
- Publication date Aug 20, 2020
- KABUSHIKI KAISHA TOSHIBA
- Kazuo SHIMOKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR AND CAPACITOR MODULE
- Publication number 20200258682
- Publication date Aug 13, 2020
- KABUSHIKI KAISHA TOSHIBA
- Keiichiro MATSUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR
- Publication number 20200235200
- Publication date Jul 23, 2020
- KABUSHIKI KAISHA TOSHIBA
- Susumu OBATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD AND PLATING SOLUTION
- Publication number 20200098582
- Publication date Mar 26, 2020
- KABUSHIKI KAISHA TOSHIBA
- Mitsuo SANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURNG SAME
- Publication number 20200098678
- Publication date Mar 26, 2020
- KABUSHIKI KAISHA TOSHIBA
- Takayuki TAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING SYSTEM, DETERMINING METHOD WITH REGARD TO CATALYTIC LAYE...
- Publication number 20200051873
- Publication date Feb 13, 2020
- KABUSHIKI KAISHA TOSHIBA
- Mitsuo SANO
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20190287895
- Publication date Sep 19, 2019
- KABUSHIKI KAISHA TOSHIBA
- Takayuki TAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20190287945
- Publication date Sep 19, 2019
- KABUSHIKI KAISHA TOSHIBA
- Akira TOJO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190287952
- Publication date Sep 19, 2019
- Toshiba Memory Corporation
- Kazuo SHIMOKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20190267350
- Publication date Aug 29, 2019
- Toshiba Memory Corporation
- Takayuki TAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR CHIP, AND MET...
- Publication number 20190252199
- Publication date Aug 15, 2019
- KABUSHIKI KAISHA TOSHIBA
- Keiichiro MATSUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...
- Publication number 20190067250
- Publication date Feb 28, 2019
- KABUSHIKI KAISHA TOSHIBA
- Akira Tojo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180286819
- Publication date Oct 4, 2018
- KABUSHIKI KAISHA TOSHIBA
- Akira Tojo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR CHIP, AND MET...
- Publication number 20180033634
- Publication date Feb 1, 2018
- KABUSHIKI KAISHA TOSHIBA
- Keiichiro MATSUO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PRINTED WIRING BOARD AND MAGNETICSHIELD PACKAGE
- Publication number 20170050842
- Publication date Feb 23, 2017
- Kabushiki Kaisha Toshiba
- Keiju YAMADA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR DEVICE AND THE SEMICONDUCTOR...
- Publication number 20160365340
- Publication date Dec 15, 2016
- KABUSHIKI KAISHA TOSHIBA
- Takayuki TAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC SHIELDED PACKAGE
- Publication number 20160091575
- Publication date Mar 31, 2016
- Kabushiki Kaisha Toshiba
- Keiju YAMADA
- G01 - MEASURING TESTING

Kazuo SHIMOKAWA

Person

Patents Grantslast 30 patents

Method for manufacturing semiconductor device having chip stacked a...

Capacitor

Capacitor and etching method

Wire bonding apparatus and wire bonding method

Structural body and method of manufacturing the same

Capacitor and capacitor module

Capacitor

Semiconductor device and method for manufacturing same

Semiconductor device having chip stacked and molded

Etching method and plating solution

Processing system for a catalytic layer of a noble metal formed on...

Capacitor and capacitor module

Etching method, method of manufacturing semiconductor chip, and met...

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device including a re-interconnection layer and metho...

Semiconductor device having a three-sided textured substrate

Semiconductor device, method for manufacturing semiconductor device...

Semiconductor device

Method of fabricating a semiconductor device and the semiconductor...

Etching method, method of manufacturing semiconductor chip, and met...

Magnetic shielded package having magnetic shield members

Semiconductor device and method for manufacturing the same

Light emitting device and luminaire

Semiconductor light emitting device and method for manufacturing th...

Semiconductor light emitting device and method for manufacturing th...

Optical semiconductor device and method for manufacturing same

Semiconductor light emitting device and method for manufacturing th...

Semiconductor device and method for manufacturing the same

Optical semiconductor device and method for manufacturing same

Semiconductor device and method for manufacturing the same

Patents Applicationslast 30 patents

CAPACITOR AND ETCHING METHOD

SEMICONDUCTOR DEVICE HAVING CHIP STACKED AND MOLDED

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND MANUFACTURING APP...

METHOD OF FORMING CATALYST LAYER

STRUCTURAL BODY AND METHOD OF MANUFACTURING THE SAME

BATTERY AND MANUFACTURING METHOD OF BATTERY

BUNDLING METHOD, MANUFACTURING METHOD OF BATTERY, AND BUNDLING APPA...

ELECTRODE GROUP AND BATTERY

ETCHING METHOD AND PLATING SOLUTION

CAPACITOR AND CAPACITOR MODULE

CAPACITOR AND ETCHING METHOD

WIRE BONDING APPARATUS AND WIRE BONDING METHOD

CAPACITOR

CARRIER AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

CAPACITOR AND CAPACITOR MODULE

CAPACITOR

ETCHING METHOD AND PLATING SOLUTION

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURNG SAME

PROCESSING SYSTEM, DETERMINING METHOD WITH REGARD TO CATALYTIC LAYE...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

ETCHING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR CHIP, AND MET...

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

ETCHING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR CHIP, AND MET...

PRINTED WIRING BOARD AND MAGNETICSHIELD PACKAGE

METHOD OF FABRICATING A SEMICONDUCTOR DEVICE AND THE SEMICONDUCTOR...

MAGNETIC SHIELDED PACKAGE