Kazushi Higashi

Person

Neyagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Joining apparatus with UV cleaning
- Patent number 8,240,539
- Issue date Aug 14, 2012
- Panasonic Corporation
- Kazushi Higashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor light emitting device and semiconductor light emittin...
- Patent number 8,129,739
- Issue date Mar 6, 2012
- Panasonic Corporation
- Kazushi Higashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic element package and method of manufacturing the same
- Patent number 8,077,447
- Issue date Dec 13, 2011
- Panasonic Corporation
- Kazushi Higashi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor element and semiconductor element fabrication method
- Patent number 7,994,634
- Issue date Aug 9, 2011
- Panasonic Corporation
- Takeshi Kita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of a through-electrode by inkjet deposition of resin pastes
- Patent number 7,955,974
- Issue date Jun 7, 2011
- Panasonic Corporation
- Kazushi Higashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic part and method of producing the same
- Patent number 7,790,594
- Issue date Sep 7, 2010
- Panasonic Corporation
- Kazushi Higashi
- G01 - MEASURING TESTING
Information Patent Grant
Packaged electronic element and method of producing electronic elem...
- Patent number 7,692,292
- Issue date Apr 6, 2010
- Panasonic Corporation
- Kazushi Higashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,646,095
- Issue date Jan 12, 2010
- Panasonic Corporation
- Kazushi Higashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package manufacturing method and electronic devic...
- Patent number 7,615,406
- Issue date Nov 10, 2009
- Panasonic Corporation
- Kazushi Higashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light-emitting element, manufacturing method and moun...
- Patent number 7,554,126
- Issue date Jun 30, 2009
- Panasonic Corporation
- Kazushi Higashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component mounting tool, and method and apparatus for mounting comp...
- Patent number 7,549,567
- Issue date Jun 23, 2009
- Panasonic Corporation
- Kazushi Higashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for forming bump
- Patent number 7,350,684
- Issue date Apr 1, 2008
- Matsushita Electric Industrial Co., Ltd.
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component mounting apparatus including a polishing device
- Patent number 7,219,419
- Issue date May 22, 2007
- Matsushita Electric Industrial Co., Ltd.
- Kazushi Higashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor element having protruded bump electrodes
- Patent number 7,071,090
- Issue date Jul 4, 2006
- Matsushita Electric Industrial Co., Ltd.
- Kazushi Higashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic part mounting apparatus and method
- Patent number 6,996,889
- Issue date Feb 14, 2006
- Matsushita Electric Industrial Co., Ltd.
- Kazushi Higashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device and method for forming bump
- Patent number 6,910,613
- Issue date Jun 28, 2005
- Matsushita Electric Industrial Co., Ltd.
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element having protruded bump electrodes
- Patent number 6,894,387
- Issue date May 17, 2005
- Matsushita Electric Industrial Co., Ltd.
- Kazushi Higashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for assembling integral type electronic component and integr...
- Patent number 6,825,055
- Issue date Nov 30, 2004
- Matsushita Electric Industrial Co., Ltd.
- Kazushi Higashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical information processing apparatus for use in Optical Computi...
- Patent number 6,590,199
- Issue date Jul 8, 2003
- Matsushita Electric Industrial Co., Ltd.
- Hideo Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump-joining method
- Patent number 6,572,005
- Issue date Jun 3, 2003
- Matsushita Electric Industrial Co., Ltd.
- Shozo Minamitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for mounting component
- Patent number 6,506,222
- Issue date Jan 14, 2003
- Matsushita Electric Industrial Co., Ltd.
- Shozo Minamitani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bump bonding device and bump bonding method
- Patent number 6,481,616
- Issue date Nov 19, 2002
- Matsushita Electric Industrial Co. Ltd.
- Makoto Imanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for mounting component
- Patent number 6,467,670
- Issue date Oct 22, 2002
- Matsushita Electric Industrial Co., Ltd.
- Kazushi Higashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bump joining judging device and method, and semiconductor component...
- Patent number 6,439,447
- Issue date Aug 27, 2002
- Matsushita Electric Industrial Co., Ltd.
- Shozo Minamitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for packaging IC chip, and tape-shaped carrier...
- Patent number 6,332,268
- Issue date Dec 25, 2001
- Matsushita Electric Industrial Co., Ltd.
- Makoto Imanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bonding device and bump bonding method
- Patent number 6,328,196
- Issue date Dec 11, 2001
- Matsushita Electric Industrial Co., Ltd.
- Makoto Imanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump joining method
- Patent number 6,321,973
- Issue date Nov 27, 2001
- Matsushita Electric Industrial Co., Ltd.
- Shozo Minamitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for mounting component
- Patent number 6,264,704
- Issue date Jul 24, 2001
- Matsushita Electric Industrial Co., Ltd.
- Shozo Minamitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a ball bond using a bonding capillary
- Patent number 6,207,549
- Issue date Mar 27, 2001
- Matsushita Electric Industrial Co., Ltd.
- Kazushi Higashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component mounting method and apparatus
- Patent number 6,193,136
- Issue date Feb 27, 2001
- Matsushita Electric Industrial Co., Ltd.
- Kazushi Higashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FORMING THROUGH ELECTRODE AND SEMICONDUCTOR DEVICE
- Publication number 20110057326
- Publication date Mar 10, 2011
- Takayuki Kai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor light emitting device and semiconductor light emittin...
- Publication number 20100012965
- Publication date Jan 21, 2010
- Kazushi Higashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR THROUGH-ELECTRODE FORMING METHOD
- Publication number 20090280647
- Publication date Nov 12, 2009
- Panasonic Corporation
- Kazushi HIGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR ELEMENT FABRICATION METHOD
- Publication number 20090243120
- Publication date Oct 1, 2009
- PANASONIC CORPORATION
- Takeshi KITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PART AND METHOD OF PRODUCING THE SAME
- Publication number 20090140410
- Publication date Jun 4, 2009
- Panasonic Corporation
- Kazushi Higashi
- G01 - MEASURING TESTING
Information Patent Application
Electronic Device Package Manufacturing Method and Electronic Devic...
- Publication number 20080277771
- Publication date Nov 13, 2008
- Matsushita Electric Industrial Co., Ltd.
- Kazushi Higashi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ELECTRONIC ELEMENT PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20080137270
- Publication date Jun 12, 2008
- Matsushita Electric Industrial Co., Ltd.
- Kazushi Higashi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Light-Emitting Element, Manufacturing Method and Moun...
- Publication number 20070262338
- Publication date Nov 15, 2007
- Kazushi Higashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT MOUNTING TOOL, AND METHOD AND APPARATUS FOR MOUNTING COMP...
- Publication number 20070119905
- Publication date May 31, 2007
- Kazushi Higashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Packaged electronic element and method of producing electronic elem...
- Publication number 20070108634
- Publication date May 17, 2007
- Kazushi Higashi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Electronic part mounting apparatus and method
- Publication number 20060081974
- Publication date Apr 20, 2006
- Matsushita Electric Industrial Co., Ltd.
- Kazushi Higashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Joining apparatus and method
- Publication number 20060037997
- Publication date Feb 23, 2006
- Kazushi Higashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and method for forming bump
- Publication number 20050191838
- Publication date Sep 1, 2005
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor element having protruded bump electrodes
- Publication number 20050146029
- Publication date Jul 7, 2005
- Kazushi Higashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20050104173
- Publication date May 19, 2005
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Kazushi Higashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for assembling integral type electronic device, and integral...
- Publication number 20050001315
- Publication date Jan 6, 2005
- Kazushi Higashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Device and method for forming bump
- Publication number 20040102030
- Publication date May 27, 2004
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic part mounting apparatus and method
- Publication number 20040022037
- Publication date Feb 5, 2004
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Kazushi Higashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bump joining method
- Publication number 20030205607
- Publication date Nov 6, 2003
- Shozo Minamitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component mounting tool, and method and apparatus for mounting comp...
- Publication number 20030150108
- Publication date Aug 14, 2003
- Kazushi Higashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bump bonding device and bump bonding method
- Publication number 20020030087
- Publication date Mar 14, 2002
- Makoto Imanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for assembling integral type electronic component and integr...
- Publication number 20020028595
- Publication date Mar 7, 2002
- Kazushi Higashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump joining method
- Publication number 20020008132
- Publication date Jan 24, 2002
- Shozo Minamitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for mounting component
- Publication number 20010026012
- Publication date Oct 4, 2001
- Shozo Minamitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical information processing apparatus
- Publication number 20010006219
- Publication date Jul 5, 2001
- Hideo Kawai
- G02 - OPTICS
Information Patent Application
Method of forming a ball bond using a bonding capillary
- Publication number 20010005054
- Publication date Jun 28, 2001
- Kazushi Higashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for mounting component
- Publication number 20010001469
- Publication date May 24, 2001
- Kazushi Higashi
- H01 - BASIC ELECTRIC ELEMENTS

Kazushi Higashi

Person

Patents Grantslast 30 patents

Joining apparatus with UV cleaning

Semiconductor light emitting device and semiconductor light emittin...

Electronic element package and method of manufacturing the same

Semiconductor element and semiconductor element fabrication method

Formation of a through-electrode by inkjet deposition of resin pastes

Electronic part and method of producing the same

Packaged electronic element and method of producing electronic elem...

Semiconductor device

Electronic device package manufacturing method and electronic devic...

Semiconductor light-emitting element, manufacturing method and moun...

Component mounting tool, and method and apparatus for mounting comp...

Apparatus and method for forming bump

Component mounting apparatus including a polishing device

Semiconductor element having protruded bump electrodes

Electronic part mounting apparatus and method

Device and method for forming bump

Semiconductor element having protruded bump electrodes

Method for assembling integral type electronic component and integr...

Optical information processing apparatus for use in Optical Computi...

Bump-joining method

Method and apparatus for mounting component

Bump bonding device and bump bonding method

Method and apparatus for mounting component

Bump joining judging device and method, and semiconductor component...

Method and apparatus for packaging IC chip, and tape-shaped carrier...

Bump bonding device and bump bonding method

Bump joining method

Method and apparatus for mounting component

Method of forming a ball bond using a bonding capillary

Component mounting method and apparatus

Patents Applicationslast 30 patents

METHOD FOR FORMING THROUGH ELECTRODE AND SEMICONDUCTOR DEVICE

Semiconductor light emitting device and semiconductor light emittin...

SEMICONDUCTOR THROUGH-ELECTRODE FORMING METHOD

SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR ELEMENT FABRICATION METHOD

ELECTRONIC PART AND METHOD OF PRODUCING THE SAME

Electronic Device Package Manufacturing Method and Electronic Devic...

ELECTRONIC ELEMENT PACKAGE AND METHOD OF MANUFACTURING THE SAME

Semiconductor Light-Emitting Element, Manufacturing Method and Moun...

COMPONENT MOUNTING TOOL, AND METHOD AND APPARATUS FOR MOUNTING COMP...

Packaged electronic element and method of producing electronic elem...

Electronic part mounting apparatus and method

Joining apparatus and method

Apparatus and method for forming bump

Semiconductor element having protruded bump electrodes

Semiconductor device and manufacturing method thereof

Method for assembling integral type electronic device, and integral...

Device and method for forming bump

Electronic part mounting apparatus and method

Bump joining method

Component mounting tool, and method and apparatus for mounting comp...

Bump bonding device and bump bonding method

Method for assembling integral type electronic component and integr...

Bump joining method

Method and apparatus for mounting component

Optical information processing apparatus

Method of forming a ball bond using a bonding capillary

Method and apparatus for mounting component