Kazushige Kawasaki

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Kyoto-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 8,373,276
- Issue date Feb 12, 2013
- International Business Machines Corporation
- Hiroyuki Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 8,209,856
- Issue date Jul 3, 2012
- International Business Machines Corporation
- Hiroyuki Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrically optimized and structurally protected via structure for...
- Patent number 7,911,049
- Issue date Mar 22, 2011
- International Business Machines Corporation
- Paul M. Harvey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrically optimized and structurally protected via structure for...
- Patent number 7,687,391
- Issue date Mar 30, 2010
- International Business Machines Corporation
- Paul M. Harvey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High density microvia substrate with high wireability
- Patent number 6,919,635
- Issue date Jul 19, 2005
- International Business Machines Corporation
- Kazushige Kawasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120132463
- Publication date May 31, 2012
- International Business Machines Corporation
- Hiroyuki Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100096744
- Publication date Apr 22, 2010
- International Business Machines Corporation
- Hiroyuki Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrically Optimized and Structurally Protected Via Structure for...
- Publication number 20080272862
- Publication date Nov 6, 2008
- International Business Machines Corporation
- Paul M. Harvey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrically Optimized and Structurally Protected Via Structure for...
- Publication number 20080073796
- Publication date Mar 27, 2008
- Paul M. Harvey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH DENSITY MICROVIA SUBSTRATE WITH HIGH WIREABILITY
- Publication number 20050093133
- Publication date May 5, 2005
- International Business Machines Corporation
- Kazushige Kawasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR