Kazushige Toriyama

Person

Yamato, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Solder fill into high aspect through holes
- Patent number 10,424,510
- Issue date Sep 24, 2019
- International Business Machines Corporation
- Toyohiro Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder fill into high aspect through holes
- Patent number 10,388,566
- Issue date Aug 20, 2019
- International Business Machines Corporation
- Toyohiro Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Forming a solder joint between metal layers
- Patent number 10,252,363
- Issue date Apr 9, 2019
- International Business Machines Corporation
- Toyohiro Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip mounting structure
- Patent number 10,141,278
- Issue date Nov 27, 2018
- International Business Machines Corporation
- Akihiro Horibe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wireless communication device with joined semiconductors
- Patent number 10,090,586
- Issue date Oct 2, 2018
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connecting structure between a substrate and a semicondu...
- Patent number 9,941,230
- Issue date Apr 10, 2018
- International Business Machines Corporation
- Keiji Matsumoto
- G02 - OPTICS
Information Patent Grant
Chip mounting structure
- Patent number 9,893,031
- Issue date Feb 13, 2018
- International Business Machines Corporation
- Akihiro Horibe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wireless communication device with joined semiconductors
- Patent number 9,780,442
- Issue date Oct 3, 2017
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via for electrical contact passing through layers of optical wavegu...
- Patent number 9,772,462
- Issue date Sep 26, 2017
- International Business Machines Corporation
- Hirokazu Noma
- G02 - OPTICS
Information Patent Grant
Interfacial alloy layer for improving electromigration (EM) resista...
- Patent number 9,698,119
- Issue date Jul 4, 2017
- International Business Machines Corporation
- Hirokazu Noma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming a solder joint between metal layers
- Patent number 9,586,281
- Issue date Mar 7, 2017
- International Business Machines Corporation
- Toyohiro Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a solder bump on a substrate
- Patent number 9,520,375
- Issue date Dec 13, 2016
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating pillar solder bump
- Patent number 9,508,594
- Issue date Nov 29, 2016
- International Business Machines Corporation
- Toyohiro Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor structure including a through electrode, and method f...
- Patent number 9,466,533
- Issue date Oct 11, 2016
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interfacial alloy layer for improving electromigration (EM) resista...
- Patent number 9,391,034
- Issue date Jul 12, 2016
- International Business Machines Corporation
- Hirokazu Noma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure including a through electrode, and method f...
- Patent number 9,373,545
- Issue date Jun 21, 2016
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via for electrical contact passing through layers of optical wavegu...
- Patent number 9,354,408
- Issue date May 31, 2016
- International Business Machines Corporation
- Hirokazu Noma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabricating pillar solder bump
- Patent number 9,299,606
- Issue date Mar 29, 2016
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package for millimeter wave semiconductor dies
- Patent number 9,219,041
- Issue date Dec 22, 2015
- International Business Machines Corporation
- Danny Elad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure and mounting structure manufacturing method
- Patent number 9,099,315
- Issue date Aug 4, 2015
- International Business Machines Corporation
- Sayuri Hada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spacer resin pattern helping to reduce optical coupling loss in opt...
- Patent number 8,971,678
- Issue date Mar 3, 2015
- International Business Machines Corporation
- Daiju Nakano
- G02 - OPTICS
Information Patent Grant
High frequency transition matching in an electronic package for mil...
- Patent number 8,912,634
- Issue date Dec 16, 2014
- International Business Machines Corporation
- Elad Danny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Injection molded solder method for forming solder bumps on substrates
- Patent number 8,381,962
- Issue date Feb 26, 2013
- International Business Machines Corporation
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Injection molded solder method for forming solder bumps on substrates
- Patent number 7,931,187
- Issue date Apr 26, 2011
- International Business Machines Corporation
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting method for semiconductor parts on circuit substrate
- Patent number 7,674,651
- Issue date Mar 9, 2010
- International Business Machines Corporation
- Yukifumi Oyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CHIP MOUNTING STRUCTURE
- Publication number 20180076162
- Publication date Mar 15, 2018
- International Business Machines Corporation
- Akihiro HORIBE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER FILL INTO HIGH ASPECT THROUGH HOLES
- Publication number 20170338152
- Publication date Nov 23, 2017
- International Business Machines Corporation
- Toyohiro Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRELESS COMMUNICATION DEVICE WITH JOINED SEMICONDUCTORS
- Publication number 20170309998
- Publication date Oct 26, 2017
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER FILL INTO HIGH ASPECT THROUGH HOLES
- Publication number 20170263498
- Publication date Sep 14, 2017
- International Business Machines Corporation
- Toyohiro Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL CONNECTING STRUCTURE
- Publication number 20170194277
- Publication date Jul 6, 2017
- International Business Machines Corporation
- Keji Matsumodo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING A SOLDER JOINT BETWEEN METAL LAYERS
- Publication number 20170120361
- Publication date May 4, 2017
- International Business Machines Corporation
- Toyohiro Aoki
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
CHIP MOUNTING STRUCTURE
- Publication number 20170005053
- Publication date Jan 5, 2017
- International Business Machines Corporation
- Akihiro HORIBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming a Solder Bump on a Substrate
- Publication number 20160322319
- Publication date Nov 3, 2016
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERFACIAL ALLOY LAYER FOR IMPROVING ELECTROMIGRATION (EM) RESISTA...
- Publication number 20160260681
- Publication date Sep 8, 2016
- International Business Machines Corporation
- Hirokazu Noma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA FOR ELECTRICAL CONTACT PASSING THROUGH LAYERS OF OPTICAL WAVEGU...
- Publication number 20160246017
- Publication date Aug 25, 2016
- International Business Machines Corporation
- Hirokazu Noma
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR STRUCTURE INCLUDING A THROUGH ELECTRODE, AND METHOD F...
- Publication number 20160099175
- Publication date Apr 7, 2016
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING A SOLDER JOINT BETWEEN METAL LAYERS
- Publication number 20160066435
- Publication date Mar 3, 2016
- International Business Machines Corporation
- Toyohiro Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FABRICATING PILLAR SOLDER BUMP
- Publication number 20160056116
- Publication date Feb 25, 2016
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE INCLUDING A THROUGH ELECTRODE, AND METHOD F...
- Publication number 20160056129
- Publication date Feb 25, 2016
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS COMMUNICATION DEVICE WITH JOINED SEMICONDUCTORS
- Publication number 20150380813
- Publication date Dec 31, 2015
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA FOR ELECTRICAL CONTACT PASSING THROUGH LAYERS OF OPTICAL WAVEGU...
- Publication number 20150338589
- Publication date Nov 26, 2015
- International Business Machines Corporation
- Hirokazu Noma
- G02 - OPTICS
Information Patent Application
SUBSTRATE BONDING AND BUMP FORMATION OF A SEMICONDUCTOR DEVICE
- Publication number 20150155255
- Publication date Jun 4, 2015
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING STRUCTURE AND MOUNTING STRUCTURE MANUFACTURING METHOD
- Publication number 20150021777
- Publication date Jan 22, 2015
- International Business Machines Corporation
- Sayuri Hada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERFACIAL ALLOY LAYER FOR IMPROVING ELECTROMIGRATION (EM) RESISTA...
- Publication number 20140061889
- Publication date Mar 6, 2014
- International Business Machines Corporation
- Hirokazu Noma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Design For Spacer Resin Pattern Helping to Reduce Optical Coupling...
- Publication number 20130301986
- Publication date Nov 14, 2013
- Daiju Nakano
- G02 - OPTICS
Information Patent Application
ELECTRONIC PACKAGE FOR MILLIMETER WAVE SEMICONDUCTOR DIES
- Publication number 20130256850
- Publication date Oct 3, 2013
- International Business Machines Corporation
- Elad Danny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH FREQUENCY TRANSITION MATCHING IN AN ELECTRONIC PACKAGE FOR MIL...
- Publication number 20130256849
- Publication date Oct 3, 2013
- International Business Machines Corporation
- Elad Danny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING STUDS USED FOR SELF-ALIGNMENT OF SOLDER BUMPS
- Publication number 20130119536
- Publication date May 16, 2013
- International Business Machines Corporation
- Sayuri Hada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Injection Molded Solder Method for Forming Solder Bumps on Substrates
- Publication number 20110127312
- Publication date Jun 2, 2011
- International Business Machines Corporation
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INJECTION MOLDED SOLDER METHOD FOR FORMING SOLDER BUMPS ON SUBSTRATES
- Publication number 20100116871
- Publication date May 13, 2010
- International Business Machines Corporation
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING METHOD FOR SEMICONDUCTOR PARTS ON CIRCUIT SUBSTRATE
- Publication number 20080150135
- Publication date Jun 26, 2008
- Yukifumi Oyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Kazushige Toriyama

Person

Patents Grantslast 30 patents

Solder fill into high aspect through holes

Solder fill into high aspect through holes

Forming a solder joint between metal layers

Chip mounting structure

Wireless communication device with joined semiconductors

Electrical connecting structure between a substrate and a semicondu...

Chip mounting structure

Wireless communication device with joined semiconductors

Via for electrical contact passing through layers of optical wavegu...

Interfacial alloy layer for improving electromigration (EM) resista...

Forming a solder joint between metal layers

Method of forming a solder bump on a substrate

Fabricating pillar solder bump

Semiconductor structure including a through electrode, and method f...

Interfacial alloy layer for improving electromigration (EM) resista...

Semiconductor structure including a through electrode, and method f...

Via for electrical contact passing through layers of optical wavegu...

Fabricating pillar solder bump

Electronic package for millimeter wave semiconductor dies

Mounting structure and mounting structure manufacturing method

Spacer resin pattern helping to reduce optical coupling loss in opt...

High frequency transition matching in an electronic package for mil...

Injection molded solder method for forming solder bumps on substrates

Injection molded solder method for forming solder bumps on substrates

Mounting method for semiconductor parts on circuit substrate

Patents Applicationslast 30 patents

CHIP MOUNTING STRUCTURE

SOLDER FILL INTO HIGH ASPECT THROUGH HOLES

WIRELESS COMMUNICATION DEVICE WITH JOINED SEMICONDUCTORS

SOLDER FILL INTO HIGH ASPECT THROUGH HOLES

ELECTRICAL CONNECTING STRUCTURE

FORMING A SOLDER JOINT BETWEEN METAL LAYERS

CHIP MOUNTING STRUCTURE

Method of Forming a Solder Bump on a Substrate

INTERFACIAL ALLOY LAYER FOR IMPROVING ELECTROMIGRATION (EM) RESISTA...

VIA FOR ELECTRICAL CONTACT PASSING THROUGH LAYERS OF OPTICAL WAVEGU...

SEMICONDUCTOR STRUCTURE INCLUDING A THROUGH ELECTRODE, AND METHOD F...

FORMING A SOLDER JOINT BETWEEN METAL LAYERS

FABRICATING PILLAR SOLDER BUMP

SEMICONDUCTOR STRUCTURE INCLUDING A THROUGH ELECTRODE, AND METHOD F...

WIRELESS COMMUNICATION DEVICE WITH JOINED SEMICONDUCTORS

VIA FOR ELECTRICAL CONTACT PASSING THROUGH LAYERS OF OPTICAL WAVEGU...

SUBSTRATE BONDING AND BUMP FORMATION OF A SEMICONDUCTOR DEVICE

MOUNTING STRUCTURE AND MOUNTING STRUCTURE MANUFACTURING METHOD

INTERFACIAL ALLOY LAYER FOR IMPROVING ELECTROMIGRATION (EM) RESISTA...

Design For Spacer Resin Pattern Helping to Reduce Optical Coupling...

ELECTRONIC PACKAGE FOR MILLIMETER WAVE SEMICONDUCTOR DIES

HIGH FREQUENCY TRANSITION MATCHING IN AN ELECTRONIC PACKAGE FOR MIL...

METHOD FOR FORMING STUDS USED FOR SELF-ALIGNMENT OF SOLDER BUMPS

Injection Molded Solder Method for Forming Solder Bumps on Substrates

INJECTION MOLDED SOLDER METHOD FOR FORMING SOLDER BUMPS ON SUBSTRATES

MOUNTING METHOD FOR SEMICONDUCTOR PARTS ON CIRCUIT SUBSTRATE