Kazushige Umetsu

Person

Chino, Nagano, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for dividing wafer, method for manufacturing silicon devices...
- Patent number 7,829,446
- Issue date Nov 9, 2010
- Seiko Epson Corporation
- Wataru Takahashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mask, mask forming method, pattern forming method, and wiring patte...
- Patent number 7,709,159
- Issue date May 4, 2010
- Seiko Epson Corporation
- Kazushige Umetsu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Laser processing apparatus and laser processing method
- Patent number 7,521,649
- Issue date Apr 21, 2009
- Seiko Epson Corporation
- Kazushige Umetsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of quartz crystal resonator, apparatus therefo...
- Patent number 7,518,294
- Issue date Apr 14, 2009
- Seiko Epson Corporation
- Kazushige Umetsu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of machining substrate and method of manufacturing element
- Patent number 7,468,310
- Issue date Dec 23, 2008
- Seiko Epson Corproation
- Yutaka Yamazaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for repair of liquid crystal display device light point defe...
- Patent number 7,440,074
- Issue date Oct 21, 2008
- Seiko Epson Corporation
- Kazushige Umetsu
- G02 - OPTICS
Information Patent Grant
Method for manufacturing a crystal device
- Patent number 7,411,649
- Issue date Aug 12, 2008
- Seiko Epson Corporation
- Kazushige Umetsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a piezoelectric resonator
- Patent number 7,406,756
- Issue date Aug 5, 2008
- Seiko Epson Corporation
- Kazushige Umetsu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Mask and method of manufacturing the same, electroluminescent devic...
- Patent number 7,387,739
- Issue date Jun 17, 2008
- Seiko Epson Corporation
- Shinichi Yotsuya
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Testing method and testing apparatus for liquid crystal panel
- Patent number 7,307,444
- Issue date Dec 11, 2007
- Seiko Epson Corporation
- Kazushige Umetsu
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for cutting electrical wiring line on a substr...
- Patent number 7,241,967
- Issue date Jul 10, 2007
- Seiko Epson Corporation
- Kazushige Umetsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of laser processing and head for ejecting droplet
- Patent number 7,070,700
- Issue date Jul 4, 2006
- Seiko Epson Corporation
- Daisuke Sawaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical module and method of manufacture thereof, semiconductor dev...
- Patent number 6,918,705
- Issue date Jul 19, 2005
- Seiko Epson Corporation
- Kazunori Sakurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method therefor, circuit boa...
- Patent number 6,852,621
- Issue date Feb 8, 2005
- Seiko Epson Corporation
- Terunao Hanaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and fabricating method thereof, semiconductor device a...
- Patent number 6,812,549
- Issue date Nov 2, 2004
- Seiko Epson Corporation
- Kazushige Umetsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for cutting electrical wiring line on a substr...
- Patent number 6,781,089
- Issue date Aug 24, 2004
- Seiko Epson Corporation
- Kazushige Umetsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package sealing method, manufacturing method of electronic device m...
- Patent number 6,775,958
- Issue date Aug 17, 2004
- Seiko Epson Corporation
- Jun Amako
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Electro-optical device and method of manufacture thereof, and elect...
- Patent number 6,690,032
- Issue date Feb 10, 2004
- Seiko Epson Corporation
- Kazushige Umetsu
- G02 - OPTICS
Information Patent Grant
Semiconductor chip, semiconductor device, circuit board and electro...
- Patent number 6,677,237
- Issue date Jan 13, 2004
- Seiko Epson Corporation
- Kazushige Umetsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing thereof, including a through...
- Patent number 6,667,551
- Issue date Dec 23, 2003
- Seiko Epson Corporation
- Terunao Hanaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical module and method of manufacture thereof, semiconductor dev...
- Patent number 6,623,178
- Issue date Sep 23, 2003
- Seiko Epson Corporation
- Kazunori Sakurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same, circuit...
- Patent number 6,608,371
- Issue date Aug 19, 2003
- Seiko Epson Corporation
- Yohei Kurashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and fabricating method thereof, semiconductor device a...
- Patent number 6,596,634
- Issue date Jul 22, 2003
- Seiko Epson Corporation
- Kazushige Umetsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for machining work by laser beam
- Patent number 6,563,079
- Issue date May 13, 2003
- Seiko Epson Corporation
- Kazushige Umetsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for laser processing
- Patent number 6,507,003
- Issue date Jan 14, 2003
- Seiko Epson Corporation
- Jun Amako
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Motor laminated core, method of manufacturing same, motor and ink j...
- Patent number 6,448,682
- Issue date Sep 10, 2002
- Seiko Epson Corporation
- Eimatsu Sakagami
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor chip, semiconductor device, circuit board and electro...
- Patent number 6,424,048
- Issue date Jul 23, 2002
- Seiko Epson Corporation
- Kazushige Umetsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Motor laminated core, method of manufacturing same, motor and ink j...
- Patent number 6,249,072
- Issue date Jun 19, 2001
- Seiko Epson Corporation
- Eimatsu Sakagami
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Crystal display processing method and crystal wafer manufacturing m...
- Patent number 6,063,301
- Issue date May 16, 2000
- Seiko Epson Corporation
- Kazunori Kiwada
- C30 - CRYSTAL GROWTH

Patents Applicationslast 30 patents

Information Patent Application
WORKPIECE SPLITTING METHOD AND OBJECT PRODUCING METHOD
- Publication number 20100089883
- Publication date Apr 15, 2010
- SEIKO EPSON CORPORATION
- Kazushige UMETSU
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
METHOD FOR DIVIDING WAFER, METHOD FOR MANUFACTURING SILICON DEVICES...
- Publication number 20080113459
- Publication date May 15, 2008
- SEIKO EPSON CORPORATION
- Wataru TAKAHASHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Mask, mask forming method, pattern forming method, and wiring patte...
- Publication number 20060166111
- Publication date Jul 27, 2006
- Seiko Epson Corporation
- Kazushige Umetsu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Method of machining substrate and method of manufacturing element
- Publication number 20060134885
- Publication date Jun 22, 2006
- Seiko Epson Corporation
- Yutaka Yamazaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing a crystal device
- Publication number 20060126868
- Publication date Jun 15, 2006
- Seiko Epson Corporation
- Kazushige Umetsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing method of substrate
- Publication number 20060113284
- Publication date Jun 1, 2006
- Kazushige Umetsu
- G02 - OPTICS
Information Patent Application
Testing method and testing apparatus for liquid crystal panel
- Publication number 20060055931
- Publication date Mar 16, 2006
- Kazushige Umetsu
- G02 - OPTICS
Information Patent Application
Method for repair of liquid crystal display device defects and defe...
- Publication number 20060050223
- Publication date Mar 9, 2006
- Kazushige Umetsu
- G02 - OPTICS
Information Patent Application
Manufacturing method of quartz crystal resonator, apparatus therefo...
- Publication number 20050258146
- Publication date Nov 24, 2005
- Kazushige Umetsu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Package sealing method, manufacturing method of electronic device m...
- Publication number 20050150875
- Publication date Jul 14, 2005
- SEIKO EPSON CORPORATION
- Jun Amako
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing a piezoelectric resonator
- Publication number 20050115038
- Publication date Jun 2, 2005
- Kazushige Umetsu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Method and apparatus for cutting electrical wiring line on a substr...
- Publication number 20040155018
- Publication date Aug 12, 2004
- Seiko Epson Corporation
- Kazushige Umetsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of laser processing and head for ejecting droplet
- Publication number 20040129684
- Publication date Jul 8, 2004
- Seiko Epson Corporation
- Daisuke Sawaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and manufacturing method therefor, circuit boa...
- Publication number 20040092099
- Publication date May 13, 2004
- SEIKO EPSON CORPORATION
- Terunao Hanaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical module and method of manufacture thereof, semiconductor dev...
- Publication number 20040028352
- Publication date Feb 12, 2004
- SEIKO EPSON CORPORATION
- Kazunori Sakurai
- G02 - OPTICS
Information Patent Application
Mask and method of manufacturing the same, electroluminescent devic...
- Publication number 20040026360
- Publication date Feb 12, 2004
- SEIKO EPSON CORPORATION
- Shinichi Yotsuya
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and apparatus for cutting electrical wiring line on a substr...
- Publication number 20030085208
- Publication date May 8, 2003
- Seiko Epson Corporation
- Kazushige Umetsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring board and fabricating method thereof, semiconductor device a...
- Publication number 20030060000
- Publication date Mar 27, 2003
- SEIKO EPSON CORPORATION
- Kazushige Umetsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip, semiconductor device, circuit board and electro...
- Publication number 20020151169
- Publication date Oct 17, 2002
- SEIKO EPSON CORPORATION
- Kazushige Umetsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring board and fabricating method thereof, semiconductor device a...
- Publication number 20020127839
- Publication date Sep 12, 2002
- SEIKO EPSON CORPORATION
- Kazushige Umetsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for laser processing
- Publication number 20020021723
- Publication date Feb 21, 2002
- SEIKO EPSON CORPORATION
- Jun Amako
- G02 - OPTICS
Information Patent Application
Semiconductor device and method of manufacturing the same, circuit...
- Publication number 20020017710
- Publication date Feb 14, 2002
- SEIKO EPSON CORPORATION
- Yohei Kurashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package sealing method, manufacturing method of electronic device m...
- Publication number 20010027633
- Publication date Oct 11, 2001
- Seiko Epson Corporation
- Jun Amako
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method therefor, circuit boa...
- Publication number 20010027011
- Publication date Oct 4, 2001
- Seiko Epson Corporation
- Terunao Hanaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Motor laminated core, method of manufacturing same, motor and ink j...
- Publication number 20010015589
- Publication date Aug 23, 2001
- Seiko Epson Corporation
- Eimatsu Sakagami
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Kazushige Umetsu

Person

Patents Grantslast 30 patents

Method for dividing wafer, method for manufacturing silicon devices...

Mask, mask forming method, pattern forming method, and wiring patte...

Laser processing apparatus and laser processing method

Manufacturing method of quartz crystal resonator, apparatus therefo...

Method of machining substrate and method of manufacturing element

Method for repair of liquid crystal display device light point defe...

Method for manufacturing a crystal device

Method for manufacturing a piezoelectric resonator

Mask and method of manufacturing the same, electroluminescent devic...

Testing method and testing apparatus for liquid crystal panel

Method and apparatus for cutting electrical wiring line on a substr...

Method of laser processing and head for ejecting droplet

Optical module and method of manufacture thereof, semiconductor dev...

Semiconductor device and manufacturing method therefor, circuit boa...

Wiring board and fabricating method thereof, semiconductor device a...

Method and apparatus for cutting electrical wiring line on a substr...

Package sealing method, manufacturing method of electronic device m...

Electro-optical device and method of manufacture thereof, and elect...

Semiconductor chip, semiconductor device, circuit board and electro...

Semiconductor device and manufacturing thereof, including a through...

Optical module and method of manufacture thereof, semiconductor dev...

Semiconductor device and method of manufacturing the same, circuit...

Wiring board and fabricating method thereof, semiconductor device a...

Method for machining work by laser beam

Method and apparatus for laser processing

Motor laminated core, method of manufacturing same, motor and ink j...

Semiconductor chip, semiconductor device, circuit board and electro...

Motor laminated core, method of manufacturing same, motor and ink j...

Crystal display processing method and crystal wafer manufacturing m...

Patents Applicationslast 30 patents

WORKPIECE SPLITTING METHOD AND OBJECT PRODUCING METHOD

METHOD FOR DIVIDING WAFER, METHOD FOR MANUFACTURING SILICON DEVICES...

Mask, mask forming method, pattern forming method, and wiring patte...

Method of machining substrate and method of manufacturing element

Method for manufacturing a crystal device

Manufacturing method of substrate

Testing method and testing apparatus for liquid crystal panel

Method for repair of liquid crystal display device defects and defe...

Manufacturing method of quartz crystal resonator, apparatus therefo...

Package sealing method, manufacturing method of electronic device m...

Method for manufacturing a piezoelectric resonator

Method and apparatus for cutting electrical wiring line on a substr...

Method of laser processing and head for ejecting droplet

Semiconductor device and manufacturing method therefor, circuit boa...

Optical module and method of manufacture thereof, semiconductor dev...

Mask and method of manufacturing the same, electroluminescent devic...

Method and apparatus for cutting electrical wiring line on a substr...

Wiring board and fabricating method thereof, semiconductor device a...

Semiconductor chip, semiconductor device, circuit board and electro...

Wiring board and fabricating method thereof, semiconductor device a...

Method and apparatus for laser processing

Semiconductor device and method of manufacturing the same, circuit...

Package sealing method, manufacturing method of electronic device m...

Semiconductor device and manufacturing method therefor, circuit boa...

Motor laminated core, method of manufacturing same, motor and ink j...