Kazutaka Honda

Person

Tsukuba-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Adhesive composition and semiconductor device production method
- Patent number 11,795,356
- Issue date Oct 24, 2023
- Kazutaka Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive for semiconductor device, and high productivity method for...
- Patent number 11,608,455
- Issue date Mar 21, 2023
- SHOWA DENKO MATERIALS CO., LTD.
- Kazutaka Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 10,734,350
- Issue date Aug 4, 2020
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device including heating and...
- Patent number 10,669,454
- Issue date Jun 2, 2020
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor adhesive, and semiconductor device and method for man...
- Patent number 10,224,311
- Issue date Mar 5, 2019
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive for semiconductor, fluxing agent, manufacturing method for...
- Patent number 9,803,111
- Issue date Oct 31, 2017
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermosetting resin composition for sealing packing of semiconducto...
- Patent number 9,431,314
- Issue date Aug 30, 2016
- Hitachi Chemical Company, Ltd.
- Tetsuya Enomoto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor device and production method therefor
- Patent number 9,425,120
- Issue date Aug 23, 2016
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor encapsulation adhesive composition, semiconductor enc...
- Patent number 9,129,898
- Issue date Sep 8, 2015
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor-encapsulating adhesive, semiconductor-encapsulating f...
- Patent number 9,123,734
- Issue date Sep 1, 2015
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor encapsulation adhesive composition, semiconductor enc...
- Patent number 9,024,455
- Issue date May 5, 2015
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor-encapsulating adhesive, semiconductor-encapsulating f...
- Patent number 8,674,502
- Issue date Mar 18, 2014
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
ADHESIVE COMPOSITION AND SEMICONDUCTOR DEVICE PRODUCTION METHOD
- Publication number 20210309897
- Publication date Oct 7, 2021
- Showa Denko Materials Co., Ltd.
- Kazutaka HONDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE FOR SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND METHOD FOR MA...
- Publication number 20200095481
- Publication date Mar 26, 2020
- Hitachi Chemical Company, Ltd.
- Kazutaka HONDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20190123014
- Publication date Apr 25, 2019
- Hitachi Chemical Company, Ltd.
- Kazutaka HONDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE FOR SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND METHOD FOR MA...
- Publication number 20180312731
- Publication date Nov 1, 2018
- Hitachi Chemical Company, Ltd.
- Kazutaka HONDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR ADHESIVE, AND SEMICONDUCTOR DEVICE AND METHOD FOR MAN...
- Publication number 20170345797
- Publication date Nov 30, 2017
- Hitachi Chemical Company, Ltd.
- Kazutaka HONDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
- Publication number 20150332983
- Publication date Nov 19, 2015
- Hitachi Chemical Company, Ltd.
- Kazutaka HONDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE FOR SEMICONDUCTOR, FLUXING AGENT, MANUFACTURING METHOD FOR...
- Publication number 20150048495
- Publication date Feb 19, 2015
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE FOR SEMICONDUCTOR, FLUXING AGENT, MANUFACTURING METHOD FOR...
- Publication number 20150035175
- Publication date Feb 5, 2015
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
- Publication number 20150014842
- Publication date Jan 15, 2015
- Kazutaka Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR-ENCAPSULATING ADHESIVE, SEMICONDUCTOR-ENCAPSULATING F...
- Publication number 20140206148
- Publication date Jul 24, 2014
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR ENCAPSULATION ADHESIVE COMPOSITION, SEMICONDUCTOR ENC...
- Publication number 20140015149
- Publication date Jan 16, 2014
- Kazutaka Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
THERMOSETTING RESIN COMPOSITION FOR SEALING PACKING OF SEMICONDUCTO...
- Publication number 20120101191
- Publication date Apr 26, 2012
- Hitachi Chemical Company, Ltd.
- Tetsuya ENOMOTO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR-ENCAPSULATING ADHESIVE, SEMICONDUCTOR-ENCAPSULATING F...
- Publication number 20120012999
- Publication date Jan 19, 2012
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR ENCAPSULATION ADHESIVE COMPOSITION, SEMICONDUCTOR ENC...
- Publication number 20110291260
- Publication date Dec 1, 2011
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
EPOXY RESIN COMPOSITION FOR SEALING PACKING OF SEMICONDUCTOR, SEMIC...
- Publication number 20110241228
- Publication date Oct 6, 2011
- Hitachi Chemical Company, Ltd.
- Tetsuya ENOMOTO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Kazutaka Honda

Person

Patents Grantslast 30 patents

Adhesive composition and semiconductor device production method

Adhesive for semiconductor device, and high productivity method for...

Method for manufacturing semiconductor device

Method for manufacturing semiconductor device including heating and...

Semiconductor adhesive, and semiconductor device and method for man...

Adhesive for semiconductor, fluxing agent, manufacturing method for...

Thermosetting resin composition for sealing packing of semiconducto...

Semiconductor device and production method therefor

Semiconductor encapsulation adhesive composition, semiconductor enc...

Semiconductor-encapsulating adhesive, semiconductor-encapsulating f...

Semiconductor encapsulation adhesive composition, semiconductor enc...

Semiconductor-encapsulating adhesive, semiconductor-encapsulating f...

Patents Applicationslast 30 patents

ADHESIVE COMPOSITION AND SEMICONDUCTOR DEVICE PRODUCTION METHOD

ADHESIVE FOR SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND METHOD FOR MA...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

ADHESIVE FOR SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND METHOD FOR MA...

SEMICONDUCTOR ADHESIVE, AND SEMICONDUCTOR DEVICE AND METHOD FOR MAN...

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR

ADHESIVE FOR SEMICONDUCTOR, FLUXING AGENT, MANUFACTURING METHOD FOR...

ADHESIVE FOR SEMICONDUCTOR, FLUXING AGENT, MANUFACTURING METHOD FOR...

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR

SEMICONDUCTOR-ENCAPSULATING ADHESIVE, SEMICONDUCTOR-ENCAPSULATING F...

SEMICONDUCTOR ENCAPSULATION ADHESIVE COMPOSITION, SEMICONDUCTOR ENC...

THERMOSETTING RESIN COMPOSITION FOR SEALING PACKING OF SEMICONDUCTO...

SEMICONDUCTOR-ENCAPSULATING ADHESIVE, SEMICONDUCTOR-ENCAPSULATING F...

SEMICONDUCTOR ENCAPSULATION ADHESIVE COMPOSITION, SEMICONDUCTOR ENC...

EPOXY RESIN COMPOSITION FOR SEALING PACKING OF SEMICONDUCTOR, SEMIC...