Kazutaka Kobayashi

Person

Nagano, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wiring substrate, method of manufacturing the same and electronic c...
- Patent number 9,837,337
- Issue date Dec 5, 2017
- Shinko Electric Industries Co., Ltd.
- Kazutaka Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and semiconductor package
- Patent number 9,685,391
- Issue date Jun 20, 2017
- Shinko Electric Industries Co., Ltd.
- Kazutaka Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, method for manufacturing wiring board, and electronic...
- Patent number 9,655,238
- Issue date May 16, 2017
- Shinko Electric Industries Co., Ltd.
- Kazutaka Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and semiconductor package
- Patent number 9,282,629
- Issue date Mar 8, 2016
- Shinko Electric Industries Co., Ltd.
- Yasuyoshi Horikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and semiconductor package
- Patent number 9,192,049
- Issue date Nov 17, 2015
- Shinko Electric Industries Co., Ltd.
- Tatsuaki Denda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and light emitting device
- Patent number 9,137,890
- Issue date Sep 15, 2015
- Shinko Electric Industries Co., Ltd.
- Kazutaka Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate, light emitting device, and manufacturing method o...
- Patent number 9,029,891
- Issue date May 12, 2015
- Shinko Electric Industries Co., Ltd.
- Shigetsugu Muramatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and light emitting device
- Patent number 9,006,894
- Issue date Apr 14, 2015
- Shinko Electric Industries Co., Ltd.
- Kazutaka Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate, light emitting device, and manufacturing method o...
- Patent number 9,000,474
- Issue date Apr 7, 2015
- Shinko Electric Industries Co. Ltd.
- Shigetsugu Muramatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light-emitting element mounting package, light-emitting element pac...
- Patent number 8,952,408
- Issue date Feb 10, 2015
- Shinko Electric Industries Co., Ltd.
- Tatsuaki Denda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light-emitting element mounting package, light-emitting element pac...
- Patent number 8,941,139
- Issue date Jan 27, 2015
- Shinko Electric Industries Co., Ltd.
- Kazutaka Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead frame including an insulating resin layer entirely covering le...
- Patent number 8,928,130
- Issue date Jan 6, 2015
- Shinko Electric Industries Co., Ltd.
- Toshio Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for mounting electronic components, electronic apparatus, a...
- Patent number 8,901,580
- Issue date Dec 2, 2014
- Shinko Electric Industries Co., Ltd.
- Tadashi Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element, semiconductor element mounted board, and met...
- Patent number 8,610,268
- Issue date Dec 17, 2013
- Shinko Electric Industries Co., Ltd.
- Kazutaka Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with electronic component incorporation substrate
- Patent number 8,482,117
- Issue date Jul 9, 2013
- Shinko Electric Industries Co., Ltd.
- Kazutaka Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate, electronic device, and method of manufacturing wi...
- Patent number 8,436,249
- Issue date May 7, 2013
- Shinko Electric Industries Co., Ltd.
- Kazutaka Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Motor
- Patent number 8,035,264
- Issue date Oct 11, 2011
- NIDEC SANKYO CORPORATION
- Kazutaka Kobayashi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Wiring substrate with plurality of wiring and insulating layers wit...
- Patent number 8,035,033
- Issue date Oct 11, 2011
- Shinko Electric Industries Co., Ltd.
- Kazutaka Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic parts packaging structure and method of manufacturing th...
- Patent number 7,964,950
- Issue date Jun 21, 2011
- Shinko Electric Industries Co., Ltd.
- Masahiro Sunohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic parts packaging structure and method of manufacturing th...
- Patent number 7,691,673
- Issue date Apr 6, 2010
- Shinko Electric Industries Co., Ltd.
- Masahiro Sunohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic parts packaging structure
- Patent number 7,545,049
- Issue date Jun 9, 2009
- Shinko Electric Industries Co., Ltd.
- Masahiro Sunohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Motor
- Patent number 7,479,721
- Issue date Jan 20, 2009
- NIDEC SANKYO CORPORATION
- Kazutaka Kobayashi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Maskless direct exposure system and user interface
- Patent number 7,307,691
- Issue date Dec 11, 2007
- Shinko Electric Industries Co., Ltd.
- Kazunari Sekigawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Motor
- Patent number 7,215,053
- Issue date May 8, 2007
- NIDEC SANKYO CORPORATION
- Kazutaka Kobayashi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Electronic parts packaging structure and method of manufacturing th...
- Patent number 7,057,290
- Issue date Jun 6, 2006
- Shinko Electric Industries Co., Ltd.
- Masahiro Sunohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Motor with resin base plate
- Patent number 6,936,940
- Issue date Aug 30, 2005
- Sankyo Seiki Mfg. Co., Ltd.
- Kazutaka Kobayashi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Method of producing a multilayer wiring board
- Patent number 6,629,366
- Issue date Oct 7, 2003
- Shinko Electric Industries Co., Ltd.
- Kazutaka Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Disc chucking mechanism
- Patent number 6,222,818
- Issue date Apr 24, 2001
- Kabushiki Kaisha Sankyo Seiki Seisakusho
- Kazutaka Kobayashi
- G11 - INFORMATION STORAGE
Information Patent Grant
Disc chucking mechanism
- Patent number 6,163,520
- Issue date Dec 19, 2000
- Kabushiki Kaisha Sanyo Seiki Seisakusho
- Kazutaka Kobayashi
- G11 - INFORMATION STORAGE
Information Patent Grant
Motor having magnetic slot closure for salient poles
- Patent number 5,973,432
- Issue date Oct 26, 1999
- Kabushiki Kaisha Sankyo Seiki Seisakusho
- Masayuki Katagiri
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD AND SEMICONDUCTOR PACKAGE
- Publication number 20160307814
- Publication date Oct 20, 2016
- Shinko Electric Industries Co., Ltd.
- Kazutaka KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE, METHOD OF MANUFACTURING THE SAME AND ELECTRONIC C...
- Publication number 20160157345
- Publication date Jun 2, 2016
- Shinko Electric Industries Co., Ltd.
- Kazutaka Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, METHOD FOR MANUFACTURING WIRING BOARD, AND ELECTRONIC...
- Publication number 20150319841
- Publication date Nov 5, 2015
- Shinko Electric Industries Co., Ltd.
- Kazutaka Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE
- Publication number 20150230328
- Publication date Aug 13, 2015
- Shinko Electric Industries Co., Ltd.
- Yasuyoshi HORIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE
- Publication number 20150200337
- Publication date Jul 16, 2015
- Shinko Electric Industries Co., Ltd.
- Tatsuaki DENDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND LIGHT EMITTING DEVICE
- Publication number 20140264417
- Publication date Sep 18, 2014
- Shinko Electric Industries Co., Ltd.
- Kazutaka Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND LIGHT EMITTING DEVICE
- Publication number 20140226346
- Publication date Aug 14, 2014
- Shinko Electric Industries Co., Ltd.
- Kazutaka KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING LEAD...
- Publication number 20130256854
- Publication date Oct 3, 2013
- Shinko Electric Industries Co., LTD.
- Toshio Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE, LIGHT EMITTING DEVICE, AND MANUFACTURING METHOD O...
- Publication number 20130187182
- Publication date Jul 25, 2013
- Shinko Electric Industries Co., Ltd.
- Shigetsugu MURAMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE, LIGHT EMITTING DEVICE, AND MANUFACTURING METHOD O...
- Publication number 20130187190
- Publication date Jul 25, 2013
- Shinko Electric Industries Co., Ltd.
- Shigetsugu MURAMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING ELEMENT MOUNTING PACKAGE, LIGHT-EMITTING ELEMENT PAC...
- Publication number 20130153945
- Publication date Jun 20, 2013
- Shinko Electric Industries Co., Ltd.
- Kazutaka KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING ELEMENT MOUNTING PACKAGE, LIGHT-EMITTING ELEMENT PAC...
- Publication number 20130153946
- Publication date Jun 20, 2013
- Shinko Electric Industries Co., Ltd.
- Tatsuaki DENDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR MOUNTING ELECTRONIC COMPONENTS, ELECTRONIC APPARATUS, A...
- Publication number 20130126916
- Publication date May 23, 2013
- Shinko Electric Industries Co., Ltd.
- Tadashi Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING WI...
- Publication number 20120103663
- Publication date May 3, 2012
- Shinko Electric Industries Co., Ltd.
- Kazutaka KOBAYASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR ELEMENT, SEMICONDUCTOR ELEMENT MOUNTED BOARD, AND MET...
- Publication number 20120074578
- Publication date Mar 29, 2012
- Shinko Electric Industries Co., Ltd.
- Kazutaka KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDCUTOR DEVICE
- Publication number 20120013021
- Publication date Jan 19, 2012
- Shinko Electric Industries Co., LTD.
- Kazutaka Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE, MANUFACTURING METHOD THEREOF AND SEMICONDUCTOR PA...
- Publication number 20090205860
- Publication date Aug 20, 2009
- Shinko Electric Industries Co., Ltd.
- Kazutaka KOBAYASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic parts packaging structure and method of manufacturing th...
- Publication number 20090206471
- Publication date Aug 20, 2009
- Shinko Electric Industries Co., Ltd.
- Masahiro Sunohara
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MOTOR AND MANUFACTURING METHOD THEREFOR
- Publication number 20070252486
- Publication date Nov 1, 2007
- NIDEC SANKYO CORPORATION
- Kazutaka Kobayashi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electronic parts packaging structure and method of manufacturing th...
- Publication number 20070013048
- Publication date Jan 18, 2007
- Shinko Electric Industries Co., Ltd.
- Masahiro Sunohara
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electronic parts packaging structure and method of manufacturing th...
- Publication number 20060145359
- Publication date Jul 6, 2006
- Shinko Electric Industries Co., Ltd.
- Masahiro Sunohara
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method of forming via hole in resin layer
- Publication number 20060068581
- Publication date Mar 30, 2006
- Shinko Electric Industries Co., Ltd.
- Kazutaka Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Production method of wiring substrate having ultra-fine pattern, an...
- Publication number 20050269206
- Publication date Dec 8, 2005
- Shinko Electric Industries Co., Ltd.
- Shuichi Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Direct exposure system and user interface
- Publication number 20050094120
- Publication date May 5, 2005
- Kazunari Sekigawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic parts packaging structure and method of manufacturing th...
- Publication number 20040178510
- Publication date Sep 16, 2004
- Masahiro Sunohara
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Motor with resin base plate
- Publication number 20040000828
- Publication date Jan 1, 2004
- Sankyo Seiki Mfg. Co., Ltd.
- Kazutaka Kobayashi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Kazutaka Kobayashi

Person

Patents Grantslast 30 patents

Wiring substrate, method of manufacturing the same and electronic c...

Wiring board and semiconductor package

Wiring board, method for manufacturing wiring board, and electronic...

Wiring substrate and semiconductor package

Wiring substrate and semiconductor package

Wiring board and light emitting device

Wiring substrate, light emitting device, and manufacturing method o...

Wiring board and light emitting device

Wiring substrate, light emitting device, and manufacturing method o...

Light-emitting element mounting package, light-emitting element pac...

Light-emitting element mounting package, light-emitting element pac...

Lead frame including an insulating resin layer entirely covering le...

Package for mounting electronic components, electronic apparatus, a...

Semiconductor element, semiconductor element mounted board, and met...

Semiconductor device with electronic component incorporation substrate

Wiring substrate, electronic device, and method of manufacturing wi...

Motor

Wiring substrate with plurality of wiring and insulating layers wit...

Electronic parts packaging structure and method of manufacturing th...

Electronic parts packaging structure and method of manufacturing th...

Electronic parts packaging structure

Motor

Maskless direct exposure system and user interface

Motor

Electronic parts packaging structure and method of manufacturing th...

Motor with resin base plate

Method of producing a multilayer wiring board

Disc chucking mechanism

Disc chucking mechanism

Motor having magnetic slot closure for salient poles

Patents Applicationslast 30 patents

WIRING BOARD AND SEMICONDUCTOR PACKAGE

WIRING SUBSTRATE, METHOD OF MANUFACTURING THE SAME AND ELECTRONIC C...

WIRING BOARD, METHOD FOR MANUFACTURING WIRING BOARD, AND ELECTRONIC...

WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE

WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE

WIRING BOARD AND LIGHT EMITTING DEVICE

WIRING BOARD AND LIGHT EMITTING DEVICE

LEAD FRAME, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING LEAD...

WIRING SUBSTRATE, LIGHT EMITTING DEVICE, AND MANUFACTURING METHOD O...

WIRING SUBSTRATE, LIGHT EMITTING DEVICE, AND MANUFACTURING METHOD O...

LIGHT-EMITTING ELEMENT MOUNTING PACKAGE, LIGHT-EMITTING ELEMENT PAC...

LIGHT-EMITTING ELEMENT MOUNTING PACKAGE, LIGHT-EMITTING ELEMENT PAC...

PACKAGE FOR MOUNTING ELECTRONIC COMPONENTS, ELECTRONIC APPARATUS, A...

WIRING SUBSTRATE, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING WI...

SEMICONDUCTOR ELEMENT, SEMICONDUCTOR ELEMENT MOUNTED BOARD, AND MET...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDCUTOR DEVICE

WIRING SUBSTRATE, MANUFACTURING METHOD THEREOF AND SEMICONDUCTOR PA...

Electronic parts packaging structure and method of manufacturing th...

MOTOR AND MANUFACTURING METHOD THEREFOR

Electronic parts packaging structure and method of manufacturing th...

Electronic parts packaging structure and method of manufacturing th...

Method of forming via hole in resin layer

Production method of wiring substrate having ultra-fine pattern, an...

Direct exposure system and user interface

Electronic parts packaging structure and method of manufacturing th...

Motor with resin base plate