Kazutaka Matsumoto

Person

Yokohama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Thermosetting flux and solder paste
- Patent number 7,604,154
- Issue date Oct 20, 2009
- Kabushiki Kaisha Toshiba
- Kazutaka Matsumoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copolymer resin composition and production process thereof
- Patent number 7,026,379
- Issue date Apr 11, 2006
- Kabushiki Kaisha Toshiba
- Yumiko Oyasato
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Solder material, device using the same and manufacturing process th...
- Patent number 6,673,310
- Issue date Jan 6, 2004
- Kabushiki Kaisha Toshiba
- Masahiro Tadauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Epoxy resin composition, resin-encapsulated semiconductor device us...
- Patent number 6,054,222
- Issue date Apr 25, 2000
- Kabushiki Kaisha Toshiba
- Hiromichi Takami
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Molding resin composition and molded electronic component
- Patent number 5,252,639
- Issue date Oct 12, 1993
- Kabushiki Kaisha Toshiba
- Shinetsu Fujieda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin composition and a resin-sealed semiconductor device
- Patent number 5,043,211
- Issue date Aug 27, 1991
- Kabushiki Kaisha Toshiba
- Akira Yoshizumi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin composition for encapsulation of semi-conductor device
- Patent number 4,719,255
- Issue date Jan 12, 1988
- Kabushiki Kaisha Toshiba
- Akira Yoshizumi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin encapsulation type semiconductor device
- Patent number 4,572,853
- Issue date Feb 25, 1986
- Tokyo Shibaura Denki Kabushiki Kaisha
- Hirotoshi Ikeya
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
THERMOSETTING FLUX AND SOLDER PASTE
- Publication number 20070221712
- Publication date Sep 27, 2007
- Kabushiki Kaisha Toshiba
- Kazutaka Matsumoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Soldered material, semiconductor device, method of soldering, and m...
- Publication number 20060081995
- Publication date Apr 20, 2006
- Kabushiki Kaisha Toshiba
- Toshihide Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead free solder
- Publication number 20060067853
- Publication date Mar 30, 2006
- Kabushiki Kaisha Toshiba
- Toshihide Takahashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Soldered material, semiconductor device, method of soldering, and m...
- Publication number 20050218525
- Publication date Oct 6, 2005
- Kabushiki Kaisha Toshiba
- Toshihide Takahashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermosetting flux and solder paste
- Publication number 20050056687
- Publication date Mar 17, 2005
- Kabushiki Kaisha Toshiba
- Kazutaka Matsumoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lead-free joining material and joining method using the same
- Publication number 20040096688
- Publication date May 20, 2004
- Kabushiki Kaisha Toshiba
- Masahiro Tadauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Copolymer resin composition and production process thereof
- Publication number 20030069354
- Publication date Apr 10, 2003
- Kabushiki Kaisha Toshiba
- Yumiko Oyasato
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Solder material, device using the same and manufacturing process th...
- Publication number 20010029095
- Publication date Oct 11, 2001
- Masahiro Tadauchi
- H01 - BASIC ELECTRIC ELEMENTS

Kazutaka Matsumoto

Person

Patents Grantslast 30 patents

Thermosetting flux and solder paste

Copolymer resin composition and production process thereof

Solder material, device using the same and manufacturing process th...

Epoxy resin composition, resin-encapsulated semiconductor device us...

Molding resin composition and molded electronic component

Epoxy resin composition and a resin-sealed semiconductor device

Epoxy resin composition for encapsulation of semi-conductor device

Resin encapsulation type semiconductor device

Patents Applicationslast 30 patents

THERMOSETTING FLUX AND SOLDER PASTE

Soldered material, semiconductor device, method of soldering, and m...

Lead free solder

Soldered material, semiconductor device, method of soldering, and m...

Thermosetting flux and solder paste

Lead-free joining material and joining method using the same

Copolymer resin composition and production process thereof

Solder material, device using the same and manufacturing process th...