Kazutaka Miyamoto

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Mie, JP

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Patents Grantslast 30 patents

Information Patent Grant
Tapering method for poromeric polishing pad
- Patent number 10,259,099
- Issue date Apr 16, 2019
- Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Koichi Yoshida
- B24 - GRINDING POLISHING
Information Patent Grant
Tapered poromeric polishing pad
- Patent number 9,925,637
- Issue date Mar 27, 2018
- Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Koichi Yoshida
- B24 - GRINDING POLISHING
Information Patent Grant
Method for chemical mechanical polishing silicon wafers
- Patent number 8,980,749
- Issue date Mar 17, 2015
- Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Yasuyuki Itai
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
TAPERING METHOD FOR POROMERIC POLISHING PAD
- Publication number 20180036860
- Publication date Feb 8, 2018
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- Koichi Yoshida
- B24 - GRINDING POLISHING
Information Patent Application
TAPERED POROMERIC POLISHING PAD
- Publication number 20180036862
- Publication date Feb 8, 2018
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- Koichi Yoshida
- B24 - GRINDING POLISHING