Kazutaka Noda

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Kumamoto, JP

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Patents Grantslast 30 patents

Information Patent Grant
Separating method, separating apparatus, and separating system
- Patent number 12,157,293
- Issue date Dec 3, 2024
- Tokyo Electron Limited
- Takashi Terada
- B32 - LAYERED PRODUCTS
Information Patent Grant
Separation apparatus, separation system, and separation method
- Patent number 10,071,544
- Issue date Sep 11, 2018
- Tokyo Electron Limited
- Osamu Hirakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate conveyance apparatus and substrate peeling system
- Patent number 9,679,798
- Issue date Jun 13, 2017
- Tokyo Electron Limited
- Yasuharu Iwashita
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING METHOD AND BONDING SYSTEM
- Publication number 20240339431
- Publication date Oct 10, 2024
- TOKYO ELECTRON LIMITED
- Kazutaka Noda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEPARATING METHOD, SEPARATING APPARATUS, AND SEPARATING SYSTEM
- Publication number 20230055853
- Publication date Feb 23, 2023
- TOKYO ELECTRON LIMITED
- Takashi Terada
- B32 - LAYERED PRODUCTS
Information Patent Application
SUBSTRATE CONVEYANCE APPARATUS AND SUBSTRATE PEELING SYSTEM
- Publication number 20140234033
- Publication date Aug 21, 2014
- TOKYO ELECTRON LIMITED
- Yasuharu IWASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEPARATION APPARATUS, SEPARATION SYSTEM, AND SEPARATION METHOD
- Publication number 20130146228
- Publication date Jun 13, 2013
- TOKYO ELECTRON LIMITED
- Osamu HIRAKAWA
- B32 - LAYERED PRODUCTS