Membership
Tour
Register
Log in
Kazuto Nishida
Follow
Person
Katano-shi, JP
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Electronic component mounting method and apparatus
Patent number
8,007,627
Issue date
Aug 30, 2011
Panasonic Corporation
Kazuto Nishida
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Carrier frame for electronic components and production method for e...
Patent number
7,960,828
Issue date
Jun 14, 2011
Panasonic Corporation
Toshihiko Satou
G01 - MEASURING TESTING
Information
Patent Grant
Apparatus and method for surface treatment to substrate
Patent number
7,771,561
Issue date
Aug 10, 2010
Panasonic Corporation
Naoki Suzuki
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
3D circuit module, multilayer 3D circuit module formed thereof, mob...
Patent number
7,759,784
Issue date
Jul 20, 2010
Panasonic Corporation
Masahiro Ono
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electronic component unit
Patent number
7,683,482
Issue date
Mar 23, 2010
Panasonic Corporation
Kazuto Nishida
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Stereoscopic electronic circuit device, and relay board and relay f...
Patent number
7,613,010
Issue date
Nov 3, 2009
Panasonic Corporation
Masahiro Ono
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Soldering method, component to be joined by the soldering method, a...
Patent number
7,473,476
Issue date
Jan 6, 2009
Panasonic Corporation
Atsushi Yamaguchi
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electronic parts packaging method and electronic parts package
Patent number
7,355,126
Issue date
Apr 8, 2008
Matsushita Electric Industrial Co., Ltd.
Hidenobu Nishikawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Board connecting component and three-dimensional connecting structu...
Patent number
7,090,502
Issue date
Aug 15, 2006
Matsushita Electric Industrial Co., Ltd.
Masahiro Ono
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for mounting a semiconductor element to an interposer by com...
Patent number
7,060,528
Issue date
Jun 13, 2006
Matsushita Electric Industrial Co., Ltd.
Hidenobu Nishikawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and device for mounting electronic component on circuit board
Patent number
6,981,317
Issue date
Jan 3, 2006
Matsushita Electric Industrial Co., Ltd.
Kazuto Nishida
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method and apparatus for manufacturing semiconductor device
Patent number
6,966,964
Issue date
Nov 22, 2005
Matsushita Electric Industrial Co., Ltd.
Koujiro Nakamura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic parts mounting method and device therefor
Patent number
6,926,796
Issue date
Aug 9, 2005
Matsushita Electric Industrial Co., Ltd.
Kazuto Nishida
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
IC component separating method and separating apparatus
Patent number
6,156,150
Issue date
Dec 5, 2000
Matsushita Electric Industrial Co., Ltd.
Kazuto Nishida
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for connecting electrodes of plasma display panel
Patent number
6,086,441
Issue date
Jul 11, 2000
Matsushita Electric Industrial Co., Ltd.
Takashi Akiguchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit board having electrodes and pre-deposit solder receiver
Patent number
5,917,156
Issue date
Jun 29, 1999
Matsushita Electric Industrial Co., Ltd.
Kazuhiro Nobori
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of bonding IC component to flat panel display
Patent number
5,858,806
Issue date
Jan 12, 1999
Matsushita Electric Industrial Co., Ltd.
Kazuto Nishida
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of bonding an external lead and a tool therefor
Patent number
5,462,626
Issue date
Oct 31, 1995
Matsushita Electric Industrial Co., Ltd.
Shinji Kanayama
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for bonding lead of IC component with electrode
Patent number
5,240,170
Issue date
Aug 31, 1993
Matsushita Electric Industrial Co., Ltd.
Kazuto Nishida
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
STEREOSCOPIC ELECTRONIC CIRCUIT DEVICE, AND RELAY BOARD AND RELAY F...
Publication number
20100008056
Publication date
Jan 14, 2010
PANASONIC CORPORATION
Masahiro ONO
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
CARRIER FRAME FOR ELECTRONIC COMPONENTS AND PRODUCTION METHOD FOR E...
Publication number
20090104014
Publication date
Apr 23, 2009
Toshihiko SATOU
G01 - MEASURING TESTING
Information
Patent Application
Electronic component mounting method, and circuit substrate and cir...
Publication number
20070164079
Publication date
Jul 19, 2007
Matsushita Electric Industrial Co., Ltd.
Masato Mori
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Apparatus and method for surface treatment to substrate
Publication number
20070062558
Publication date
Mar 22, 2007
Naoki Suzuki
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Electronic component mounting method and apparatus
Publication number
20070013067
Publication date
Jan 18, 2007
Kazuto Nishida
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
3D circuit module, multilayer 3D circuit module formed thereof, mob...
Publication number
20060038274
Publication date
Feb 23, 2006
Masahiro Ono
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Board connecting component and three-dimensional connecting structu...
Publication number
20050260867
Publication date
Nov 24, 2005
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Masahiro Ono
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Electronic component mounting method and apparatus
Publication number
20050224974
Publication date
Oct 13, 2005
Kazuto Nishida
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Stereoscopic electronic circuit device, and relay board and relay f...
Publication number
20050168961
Publication date
Aug 4, 2005
Masahiro Ono
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Electronic component mounting method and apparatus
Publication number
20050155706
Publication date
Jul 21, 2005
Kazuto Nishida
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Electronic circuit device, and method and apparatus for manufacturi...
Publication number
20050093172
Publication date
May 5, 2005
Norihito Tsukahara
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
Soldering method, component to be joined by the soldering method, a...
Publication number
20040155336
Publication date
Aug 12, 2004
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Atsushi Yamaguchi
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Semiconductor element mounting method
Publication number
20030166313
Publication date
Sep 4, 2003
Hidenobu Nishikawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method and apparatus for manufacturing semiconductor device
Publication number
20030138993
Publication date
Jul 24, 2003
Matsushita Elec. Ind. Co., Ltd.
Koujiro Nakamura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electronic parts packaging method and electronic parts package
Publication number
20030092326
Publication date
May 15, 2003
Hidenobu Nishikawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Apparatus and method for surface treatment to substrate
Publication number
20030049937
Publication date
Mar 13, 2003
Naoki Suzuki
H01 - BASIC ELECTRIC ELEMENTS