Kazuto Watanabe

Person

Yokkaichi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Memory device including laterally perforated support pillar structu...
- Patent number 11,812,598
- Issue date Nov 7, 2023
- SanDisk Technologies LLC
- Kazuto Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical overlay measurement methods and structures for wafer-to-...
- Patent number 11,569,139
- Issue date Jan 31, 2023
- Western Digital Technologies, Inc.
- Ikue Yokomizo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly containing side bonding structures and methods of m...
- Patent number 10,797,035
- Issue date Oct 6, 2020
- SanDisk Technologies LLC
- Michiaki Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Distortion-compensated wafer bonding method and apparatus using a t...
- Patent number 10,790,296
- Issue date Sep 29, 2020
- SanDisk Technologies LLC
- Takashi Yamaha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device having L-shaped word lines and a su...
- Patent number 10,217,746
- Issue date Feb 26, 2019
- SanDisk Technologies LLC
- Tae-Kyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing word lines having vertic...
- Patent number 10,211,215
- Issue date Feb 19, 2019
- SanDisk Technologies LLC
- Yashushi Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device having L-shaped word lines and meth...
- Patent number 10,181,442
- Issue date Jan 15, 2019
- SanDisk Technologies LLC
- Kazuto Watanabe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE HAVING EDGE SEAL AND METHOD OF MAKING THEREOF...
- Publication number 20240096694
- Publication date Mar 21, 2024
- SANDISK TECHNOLOGIES LLC
- Kazuto WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE INCLUDING LATERALLY PERFORATED SUPPORT PILLAR STRUCTU...
- Publication number 20220415907
- Publication date Dec 29, 2022
- SANDISK TECHNOLOGIES LLC
- Kazuto WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL OVERLAY MEASUREMENT METHODS AND STRUCTURES FOR WAFER-TO-...
- Publication number 20220285234
- Publication date Sep 8, 2022
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Ikue YOKOMIZO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY CONTAINING SIDE BONDING STRUCTURES AND METHODS OF M...
- Publication number 20200321324
- Publication date Oct 8, 2020
- SANDISK TECHNOLOGIES LLC
- Michiaki Sano
- H01 - BASIC ELECTRIC ELEMENTS

Kazuto Watanabe

Person

Patents Grantslast 30 patents

Memory device including laterally perforated support pillar structu...

Electrical overlay measurement methods and structures for wafer-to-...

Bonded assembly containing side bonding structures and methods of m...

Distortion-compensated wafer bonding method and apparatus using a t...

Three-dimensional memory device having L-shaped word lines and a su...

Three-dimensional memory device containing word lines having vertic...

Three-dimensional memory device having L-shaped word lines and meth...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE HAVING EDGE SEAL AND METHOD OF MAKING THEREOF...

MEMORY DEVICE INCLUDING LATERALLY PERFORATED SUPPORT PILLAR STRUCTU...

ELECTRICAL OVERLAY MEASUREMENT METHODS AND STRUCTURES FOR WAFER-TO-...

BONDED ASSEMBLY CONTAINING SIDE BONDING STRUCTURES AND METHODS OF M...