Kazuya HIRASAWA

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Obu-city, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package, semiconductor device and semiconductor packa...
- Patent number 11,335,628
- Issue date May 17, 2022
- Denso Corporation
- Kazuya Hirasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 11,127,702
- Issue date Sep 21, 2021
- Denso Corporation
- Mariko Fujieda
- G01 - MEASURING TESTING
Information Patent Grant
Physical quantity sensor and method for manufacturing same
- Patent number 10,809,144
- Issue date Oct 20, 2020
- Denso Corporation
- Kazuya Hirasawa
- G01 - MEASURING TESTING
Information Patent Grant
Thermally conductive sheet and semiconductor device
- Patent number 10,269,689
- Issue date Apr 23, 2019
- Sumitomo Bakelite Company Limited
- Shunsuke Mochizuki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKA...
- Publication number 20200381341
- Publication date Dec 3, 2020
- DENSO CORPORATION
- Kazuya HIRASAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20190252336
- Publication date Aug 15, 2019
- DENSO CORPORATION
- Mariko FUJIEDA
- G01 - MEASURING TESTING
Information Patent Application
PHYSICAL QUANTITY SENSOR AND METHOD FOR MANUFACTURING SAME
- Publication number 20190078955
- Publication date Mar 14, 2019
- Denso Corporation
- Kazuya HIRASAWA
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110180938
- Publication date Jul 28, 2011
- DENSO CORPORATION
- Kazuya HIRASAWA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...