Kazuya Hirata

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Store system, status determination method, and non-transitory compu...
- Patent number 12,133,140
- Issue date Oct 29, 2024
- Sato Holdings Kabushiki Kaisha
- Kazuya Hirata
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Manufacturing method of single-crystal silicon substrate
- Patent number 12,129,570
- Issue date Oct 29, 2024
- Disco Corporation
- Hayato Iga
- C30 - CRYSTAL GROWTH
Information Patent Grant
Wafer producing method
- Patent number 12,106,967
- Issue date Oct 1, 2024
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser processing apparatus and laser processing method
- Patent number 12,090,575
- Issue date Sep 17, 2024
- Disco Corporation
- Kazuki Mori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
SiC ingot processing method and laser processing apparatus
- Patent number 11,958,132
- Issue date Apr 16, 2024
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Separation method of wafer
- Patent number 11,901,231
- Issue date Feb 13, 2024
- Disco Corporation
- Asahi Nomoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Processed wafer and method of manufacturing chip formation wafer
- Patent number 11,881,407
- Issue date Jan 23, 2024
- Denso Corporation
- Masatake Nagaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing method and laser processing apparatus including imaging...
- Patent number 11,618,106
- Issue date Apr 4, 2023
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer producing method and laser processing apparatus
- Patent number 11,597,039
- Issue date Mar 7, 2023
- Disco Corporation
- Ryohei Yamamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
SiC ingot forming method
- Patent number 11,534,890
- Issue date Dec 27, 2022
- Disco Corporation
- Kazuya Hirata
- B24 - GRINDING POLISHING
Information Patent Grant
Method of producing wafer
- Patent number 11,469,094
- Issue date Oct 11, 2022
- Disco Corporation
- Kazuya Hirata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for detecting facet region, wafer producing me...
- Patent number 11,340,163
- Issue date May 24, 2022
- Disco Corporation
- Yusaku Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer producing method and laser processing apparatus
- Patent number 11,273,522
- Issue date Mar 15, 2022
- Disco Corporation
- Ryohei Yamamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer producing apparatus
- Patent number 10,981,250
- Issue date Apr 20, 2021
- Disco Corporation
- Kentaro Iizuka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Diamond substrate producing method
- Patent number 10,950,462
- Issue date Mar 16, 2021
- Disco Corporation
- Asahi Nomoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer producing apparatus
- Patent number 10,916,460
- Issue date Feb 9, 2021
- Disco Corporation
- Kentaro Iizuka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser processing apparatus and wafer producing method
- Patent number 10,870,169
- Issue date Dec 22, 2020
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
SiC wafer producing method
- Patent number 10,872,758
- Issue date Dec 22, 2020
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor substrate processing method
- Patent number 10,872,757
- Issue date Dec 22, 2020
- Disco Corporation
- Kazuya Hirata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SiC wafer producing method
- Patent number 10,870,176
- Issue date Dec 22, 2020
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
SiC wafer producing method using ultrasonic wave
- Patent number 10,828,726
- Issue date Nov 10, 2020
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser processing apparatus
- Patent number 10,799,987
- Issue date Oct 13, 2020
- Disco Corporation
- Kentaro Iizuka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer production method
- Patent number 10,774,445
- Issue date Sep 15, 2020
- DISCO CORPROATION
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a wafer from a hexagonal single crystal ingot...
- Patent number 10,755,946
- Issue date Aug 25, 2020
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Planarization method
- Patent number 10,714,353
- Issue date Jul 14, 2020
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shaft seal device and vertical pump with this shaft seal device
- Patent number 10,655,632
- Issue date May 19, 2020
- Ebara Corporation
- Yasushi Kawai
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Wafer producing method
- Patent number 10,625,371
- Issue date Apr 21, 2020
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer producing method
- Patent number 10,610,973
- Issue date Apr 7, 2020
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
SiC wafer producing method
- Patent number 10,573,505
- Issue date Feb 25, 2020
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer producing method
- Patent number 10,563,321
- Issue date Feb 18, 2020
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING WAFER
- Publication number 20250079331
- Publication date Mar 6, 2025
- Disco Corporation
- Nobuki KAKIUCHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING WAFER AND SEPARATING APPARATUS
- Publication number 20250010519
- Publication date Jan 9, 2025
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING METHOD
- Publication number 20250001520
- Publication date Jan 2, 2025
- Disco Corporation
- Asahi NOMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER MANUFACTURING METHOD AND PROCESSING APPARATUS
- Publication number 20240408697
- Publication date Dec 12, 2024
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER PROCESSING METHOD AND CHAMFER REMOVING APPARATUS
- Publication number 20240399494
- Publication date Dec 5, 2024
- Disco Corporation
- Kazuya HIRATA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WATER REFINING APPARATUS AND METHOD OF MANUFACTURING WAFER
- Publication number 20240308893
- Publication date Sep 19, 2024
- Disco Corporation
- Asahi NOMOTO
- C02 - TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
Information Patent Application
WAFER PROCESSING APPARATUS
- Publication number 20240194501
- Publication date Jun 13, 2024
- Disco Corporation
- Kentaro IIZUKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDED WAFER PROCESSING METHOD
- Publication number 20240153776
- Publication date May 9, 2024
- Disco Corporation
- Hayato IGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD OF BONDED WAFER
- Publication number 20240145248
- Publication date May 2, 2024
- Disco Corporation
- Hayato IGA
- B32 - LAYERED PRODUCTS
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20240128087
- Publication date Apr 18, 2024
- Disco Corporation
- Hayato IGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING WAFER AND WAFER PROCESSING APPARATUS
- Publication number 20240120215
- Publication date Apr 11, 2024
- Disco Corporation
- Hayato IGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD OF BONDED WAFER AND PROCESSING APPARATUS
- Publication number 20240112902
- Publication date Apr 4, 2024
- Disco Corporation
- Hayato IGA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESSING METHOD OF BONDED WAFER AND PROCESSING APPARATUS
- Publication number 20240087901
- Publication date Mar 14, 2024
- Disco Corporation
- Kazuma SEKIYA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER PRODUCTION SYSTEM AND WAFER MANUFACTURING METHOD
- Publication number 20230331614
- Publication date Oct 19, 2023
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER MANUFACTURING METHOD
- Publication number 20230321871
- Publication date Oct 12, 2023
- Disco Corporation
- Kazuya HIRATA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PROCESSING MONOCRYSTALLINE SILICON WAFER
- Publication number 20230066601
- Publication date Mar 2, 2023
- Disco Corporation
- Hayato IGA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF SINGLE-CRYSTAL SILICON SUBSTRATE
- Publication number 20230054939
- Publication date Feb 23, 2023
- Disco Corporation
- Hayato IGA
- C30 - CRYSTAL GROWTH
Information Patent Application
WAFER PRODUCING METHOD
- Publication number 20230048318
- Publication date Feb 16, 2023
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PROCESSING WAFER
- Publication number 20230050807
- Publication date Feb 16, 2023
- Disco Corporation
- Hayato IGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD AND PROCESSING APPARATUS FOR INGOT
- Publication number 20220395931
- Publication date Dec 15, 2022
- Disco Corporation
- Asahi NOMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD
- Publication number 20220266393
- Publication date Aug 25, 2022
- Disco Corporation
- Kazuki MORI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR DETECTING FACET REGION, WAFER PRODUCING ME...
- Publication number 20220236185
- Publication date Jul 28, 2022
- Disco Corporation
- Yusaku ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER MANUFACTURING APPARATUS
- Publication number 20220181174
- Publication date Jun 9, 2022
- Disco Corporation
- Ryohei Yamamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER PRODUCING METHOD AND LASER PROCESSING APPARATUS
- Publication number 20220161367
- Publication date May 26, 2022
- DISCO CORPORATION
- Ryohei Yamamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER PRODUCING METHOD
- Publication number 20220148881
- Publication date May 12, 2022
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STORE SYSTEM, STATUS DETERMINATION METHOD, AND NON-TRANSITORY COMPU...
- Publication number 20220132275
- Publication date Apr 28, 2022
- Sato Holdings Kabushiki Kaisha
- Kazuya HIRATA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ITEM MANAGEMENT SUPPORT SYSTEM, ITEM MANAGEMENTSUPPORT METHOD, AND...
- Publication number 20220129961
- Publication date Apr 28, 2022
- Sato Holdings Kabushiki Kaisha
- Kazuya HIRATA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CUSTOMER SERVICE SUPPORT SYSTEM, CUSTOMER SERVICE SUPPORT METHOD, A...
- Publication number 20220129956
- Publication date Apr 28, 2022
- Sato Holdings Kabushiki Kaisha
- Kazuya HIRATA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PROCESSED WAFER AND METHOD OF MANUFACTURING CHIP FORMATION WAFER
- Publication number 20220130675
- Publication date Apr 28, 2022
- DENSO CORPORATION
- Masatake NAGAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEPARATION METHOD OF WAFER
- Publication number 20220102213
- Publication date Mar 31, 2022
- Disco Corporation
- Asahi NOMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Kazuya Hirata

Person

Patents Grantslast 30 patents

Store system, status determination method, and non-transitory compu...

Manufacturing method of single-crystal silicon substrate

Wafer producing method

Laser processing apparatus and laser processing method

SiC ingot processing method and laser processing apparatus

Separation method of wafer

Processed wafer and method of manufacturing chip formation wafer

Processing method and laser processing apparatus including imaging...

Wafer producing method and laser processing apparatus

SiC ingot forming method

Method of producing wafer

Method and apparatus for detecting facet region, wafer producing me...

Wafer producing method and laser processing apparatus

Wafer producing apparatus

Diamond substrate producing method

Wafer producing apparatus

Laser processing apparatus and wafer producing method

SiC wafer producing method

Semiconductor substrate processing method

SiC wafer producing method

SiC wafer producing method using ultrasonic wave

Laser processing apparatus

Wafer production method

Method for producing a wafer from a hexagonal single crystal ingot...

Planarization method

Shaft seal device and vertical pump with this shaft seal device

Wafer producing method

Wafer producing method

SiC wafer producing method

Wafer producing method

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING WAFER

METHOD OF MANUFACTURING WAFER AND SEPARATING APPARATUS

LASER PROCESSING METHOD

WAFER MANUFACTURING METHOD AND PROCESSING APPARATUS

WAFER PROCESSING METHOD AND CHAMFER REMOVING APPARATUS

WATER REFINING APPARATUS AND METHOD OF MANUFACTURING WAFER

WAFER PROCESSING APPARATUS

BONDED WAFER PROCESSING METHOD

PROCESSING METHOD OF BONDED WAFER

WAFER PROCESSING METHOD

METHOD OF PROCESSING WAFER AND WAFER PROCESSING APPARATUS

PROCESSING METHOD OF BONDED WAFER AND PROCESSING APPARATUS

PROCESSING METHOD OF BONDED WAFER AND PROCESSING APPARATUS

WAFER PRODUCTION SYSTEM AND WAFER MANUFACTURING METHOD

WAFER MANUFACTURING METHOD

METHOD OF PROCESSING MONOCRYSTALLINE SILICON WAFER

MANUFACTURING METHOD OF SINGLE-CRYSTAL SILICON SUBSTRATE

WAFER PRODUCING METHOD

METHOD OF PROCESSING WAFER

PROCESSING METHOD AND PROCESSING APPARATUS FOR INGOT

LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD

METHOD AND APPARATUS FOR DETECTING FACET REGION, WAFER PRODUCING ME...

WAFER MANUFACTURING APPARATUS

WAFER PRODUCING METHOD AND LASER PROCESSING APPARATUS

WAFER PRODUCING METHOD

STORE SYSTEM, STATUS DETERMINATION METHOD, AND NON-TRANSITORY COMPU...

ITEM MANAGEMENT SUPPORT SYSTEM, ITEM MANAGEMENTSUPPORT METHOD, AND...

CUSTOMER SERVICE SUPPORT SYSTEM, CUSTOMER SERVICE SUPPORT METHOD, A...

PROCESSED WAFER AND METHOD OF MANUFACTURING CHIP FORMATION WAFER

SEPARATION METHOD OF WAFER