Kazuya MARUYAMA

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HigashikurumeTokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 11,756,918
- Issue date Sep 12, 2023
- Kioxia Corporation
- Tsutomu Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and wire bonding method
- Patent number 11,749,634
- Issue date Sep 5, 2023
- Kioxia Corporation
- Kazuya Maruyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and wire bonding method
- Patent number 11,398,449
- Issue date Jul 26, 2022
- Kabushiki Kaisha Toshiba
- Kazuya Maruyama
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210288018
- Publication date Sep 16, 2021
- KIOXIA Corporation
- Tsutomu SANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND WIRE BONDING METHOD
- Publication number 20210288019
- Publication date Sep 16, 2021
- Kabushiki Kaisha Toshiba
- Kazuya MARUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND WIRE BONDING METHOD
- Publication number 20210210457
- Publication date Jul 8, 2021
- KIOXIA Corporation
- Kazuya MARUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND DRIVE CIRCUIT
- Publication number 20190326248
- Publication date Oct 24, 2019
- Kabushiki Kaisha Toshiba
- Masahiko HORI
- H01 - BASIC ELECTRIC ELEMENTS