Kazuya Notsu

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Package and semiconductor device
- Patent number 11,784,201
- Issue date Oct 10, 2023
- Canon Kabushiki Kaisha
- Kazuya Notsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module and imaging system
- Patent number 10,831,235
- Issue date Nov 10, 2020
- Canon Kabushiki Kaisha
- Yu Katase
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Imaging device module, imaging system, imaging device package, and...
- Patent number 10,735,673
- Issue date Aug 4, 2020
- Canon Kabushiki Kaisha
- Koichi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing mounting member and method of manufacturing...
- Patent number 10,381,314
- Issue date Aug 13, 2019
- Canon Kabushiki Kaisha
- Takanori Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component, manufacturing method of electronic component,...
- Patent number 10,319,867
- Issue date Jun 11, 2019
- Canon Kabushiki Kaisha
- Yu Katase
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic component including an optical member fixed with adhesive
- Patent number 10,319,767
- Issue date Jun 11, 2019
- Canon Kabushiki Kaisha
- Kazuya Notsu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Mounting member, electronic component, and method for manufacturing...
- Patent number 9,673,141
- Issue date Jun 6, 2017
- Canon Kabushiki Kaisha
- Ichiro Kataoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and electronic apparatus
- Patent number 9,253,922
- Issue date Feb 2, 2016
- Canon Kabushiki Kaisha
- Koji Tsuduki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor member, manufacturing method thereof, and semiconduct...
- Patent number 7,750,367
- Issue date Jul 6, 2010
- Canon Kabushiki Kaisha
- Kazuya Notsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate and manufacturing method for the same
- Patent number 7,642,179
- Issue date Jan 5, 2010
- Canon Kabuhsiki Kaisha
- Hajime Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor member, manufacturing method thereof, and semiconduct...
- Patent number 7,238,973
- Issue date Jul 3, 2007
- Canon Kabushiki Kaisha
- Kazuya Notsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor member manufacturing method and semiconductor device...
- Patent number 7,008,701
- Issue date Mar 7, 2006
- Canon Kabushiki Kaisha
- Kazuya Notsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor member manufacturing method and semiconductor device...
- Patent number 6,828,214
- Issue date Dec 7, 2004
- Canon Kabushiki Kaisha
- Kazuya Notsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE, SEMICONDUCTOR DEVICE, AND APPARATUS
- Publication number 20240186259
- Publication date Jun 6, 2024
- Canon Kabushiki Kaisha
- IKUTO KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, DISPLAY DEVICE, PHOTOELECTRIC CONVERSION DEVI...
- Publication number 20230413626
- Publication date Dec 21, 2023
- Canon Kabushiki Kaisha
- KAZUYA NOTSU
Information Patent Application
PACKAGE AND SEMICONDUCTOR DEVICE
- Publication number 20220278149
- Publication date Sep 1, 2022
- Canon Kabushiki Kaisha
- Kazuya Notsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING DEVICE MODULE, IMAGING SYSTEM, IMAGING DEVICE PACKAGE, AND...
- Publication number 20190335119
- Publication date Oct 31, 2019
- Canon Kabushiki Kaisha
- Koichi Shimizu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ELECTRONIC MODULE AND IMAGING SYSTEM
- Publication number 20190294213
- Publication date Sep 26, 2019
- Canon Kabushiki Kaisha
- Yu Katase
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC COMPONENT, MANUFACTURING METHOD OF ELECTRONIC COMPONENT,...
- Publication number 20180269336
- Publication date Sep 20, 2018
- Canon Kabushiki Kaisha
- Yu Katase
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20170338267
- Publication date Nov 23, 2017
- Canon Kabushiki Kaisha
- Kazuya Notsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING MEMBER, ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING...
- Publication number 20150255383
- Publication date Sep 10, 2015
- Canon Kabushiki Kaisha
- Ichiro Kataoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING MOUNTING MEMBER AND METHOD OF MANUFACTURING...
- Publication number 20140237805
- Publication date Aug 28, 2014
- Canon Kabushiki Kaisha
- Takanori Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND ELECTRONIC APPARATUS
- Publication number 20130286592
- Publication date Oct 31, 2013
- Canon Kabushiki Kaisha
- Koji Tsuduki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor member, manufacturing method thereof, and semiconduct...
- Publication number 20070272944
- Publication date Nov 29, 2007
- Canon Kabushiki Kaisha
- Kazuya Notsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor substrate, manufacturing method thereof, and semicond...
- Publication number 20060124961
- Publication date Jun 15, 2006
- Canon Kabushiki Kaisha
- Kiyofumi Sakaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor member, manufacturing method thereof, and semiconduct...
- Publication number 20060113635
- Publication date Jun 1, 2006
- Canon Kabushiki Kaisha
- Kazuya Notsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor substrate and manufacturing method for the same
- Publication number 20060035447
- Publication date Feb 16, 2006
- Hajime Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor member manufacturing method and semiconductor device...
- Publication number 20040241398
- Publication date Dec 2, 2004
- Canon Kabushiki Kaisha
- Kazuya Notsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor member manufacturing method and semiconductor device...
- Publication number 20020146892
- Publication date Oct 10, 2002
- Kazuya Notsu
- H01 - BASIC ELECTRIC ELEMENTS

Kazuya Notsu

Person

Patents Grantslast 30 patents

Package and semiconductor device

Electronic module and imaging system

Imaging device module, imaging system, imaging device package, and...

Method of manufacturing mounting member and method of manufacturing...

Electronic component, manufacturing method of electronic component,...

Electronic component including an optical member fixed with adhesive

Mounting member, electronic component, and method for manufacturing...

Electronic component and electronic apparatus

Semiconductor member, manufacturing method thereof, and semiconduct...

Semiconductor substrate and manufacturing method for the same

Semiconductor member, manufacturing method thereof, and semiconduct...

Semiconductor member manufacturing method and semiconductor device...

Semiconductor member manufacturing method and semiconductor device...

Patents Applicationslast 30 patents

PACKAGE, SEMICONDUCTOR DEVICE, AND APPARATUS

SEMICONDUCTOR DEVICE, DISPLAY DEVICE, PHOTOELECTRIC CONVERSION DEVI...

PACKAGE AND SEMICONDUCTOR DEVICE

IMAGING DEVICE MODULE, IMAGING SYSTEM, IMAGING DEVICE PACKAGE, AND...

ELECTRONIC MODULE AND IMAGING SYSTEM

ELECTRONIC COMPONENT, MANUFACTURING METHOD OF ELECTRONIC COMPONENT,...

ELECTRONIC COMPONENT

MOUNTING MEMBER, ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING...

METHOD OF MANUFACTURING MOUNTING MEMBER AND METHOD OF MANUFACTURING...

ELECTRONIC COMPONENT AND ELECTRONIC APPARATUS

Semiconductor member, manufacturing method thereof, and semiconduct...

Semiconductor substrate, manufacturing method thereof, and semicond...

Semiconductor member, manufacturing method thereof, and semiconduct...

Semiconductor substrate and manufacturing method for the same

Semiconductor member manufacturing method and semiconductor device...

Semiconductor member manufacturing method and semiconductor device...