Kazuya Tomii

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Chiyoda-ku, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for slicing workpiece
- Patent number 8,146,581
- Issue date Apr 3, 2012
- Shin-Etsu Handotai Co., Ltd.
- Koji Kitagawa
- B24 - GRINDING POLISHING
Information Patent Grant
Method and pad for polishing wafer
- Patent number 7,695,347
- Issue date Apr 13, 2010
- Shin-Etsu Handotai Co., Ltd.
- Hisashi Masumura
- B24 - GRINDING POLISHING
Information Patent Grant
Method for apparatus for polishing outer peripheral chamfered part...
- Patent number 6,884,154
- Issue date Apr 26, 2005
- Shin-Etsu Handotai Co., Ltd.
- Kazutoshi Mizushima
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR SLICING WORKPIECE
- Publication number 20110059679
- Publication date Mar 10, 2011
- Shin-Etsu Handotai Co., Ltd.
- Koji Kitagawa
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Method and pad for polishing wafer
- Publication number 20050014455
- Publication date Jan 20, 2005
- Hisashi Masumura
- B24 - GRINDING POLISHING
Information Patent Application
Method for apparatus for polishing outer peripheral chamfered part...
- Publication number 20030054739
- Publication date Mar 20, 2003
- Kazutoshi Mizushima
- B24 - GRINDING POLISHING