Kazuyoshi Ebe

Person

Minamisaitama-gun, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing semiconductor device using adhesive sheet...
- Patent number 6,977,024
- Issue date Dec 20, 2005
- Lintec Corporation
- Osamu Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device adhesive sheet with conductor bodies buried th...
- Patent number 6,911,720
- Issue date Jun 28, 2005
- Lintec Corporation
- Osamu Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including adhesive agent layer with embedded c...
- Patent number 6,900,550
- Issue date May 31, 2005
- Lintec Corporation
- Osamu Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape for forming resin tie bar, resin tie bar, lead frame equipped...
- Patent number 6,855,418
- Issue date Feb 15, 2005
- Lintec Corporation
- Osamu Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure sensitive adhesive sheet for semiconductor wafer processing
- Patent number 6,723,619
- Issue date Apr 20, 2004
- Lintec Corporation
- Koichi Nagamoto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of processing semiconductor wafer and semiconductor wafer su...
- Patent number 6,718,223
- Issue date Apr 6, 2004
- Lintec Corporation
- Yuichi Iwakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing a chip
- Patent number 6,702,910
- Issue date Mar 9, 2004
- Lintec Corporation
- Hayato Noguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for grinding a wafer back
- Patent number 6,465,330
- Issue date Oct 15, 2002
- Lintec Corporation
- Kazuhiro Takahashi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Process for producing semiconductor chip
- Patent number 6,436,795
- Issue date Aug 20, 2002
- Lintec Corporation
- Hayato Noguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of using pressure sensitive adhesive double coated sheet
- Patent number 6,398,892
- Issue date Jun 4, 2002
- Lintec Corporation
- Hayato Noguchi
- B24 - GRINDING POLISHING
Information Patent Grant
Pressure sensitive adhesive sheet for producing a chip
- Patent number 6,312,800
- Issue date Nov 6, 2001
- Lintec Corporation
- Hayato Noguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for preparing a semiconductor wafer
- Patent number 6,297,076
- Issue date Oct 2, 2001
- Lintec Corporation
- Masazumi Amagai
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Process for producing chip and pressure sensitive adhesive sheet fo...
- Patent number 6,225,194
- Issue date May 1, 2001
- Lintec Corporation
- Hayato Noguchi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Cover tape for chip transportation and sealed structure
- Patent number 6,171,672
- Issue date Jan 9, 2001
- Lintec Corp.
- Hiroshi Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Base material and adhesive tape using the same
- Patent number 6,156,423
- Issue date Dec 5, 2000
- Lintec Corporation
- Kouichi Nagamoto
- B32 - LAYERED PRODUCTS
Information Patent Grant
Adhesive tape, base material for adhesive tape and their manufactur...
- Patent number 6,139,953
- Issue date Oct 31, 2000
- Lintec Corporation
- Kouichi Nagamoto
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Wafer dicing/bonding sheet and process for producing semiconductor...
- Patent number 6,007,920
- Issue date Dec 28, 1999
- Texas Instruments Japan, Ltd.
- Norito Umehara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing chip and pressure sensitive adhesive sheet fo...
- Patent number 5,976,691
- Issue date Nov 2, 1999
- Lintec Corporation
- Hayato Noguchi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Process for producing semiconductor device
- Patent number 5,882,956
- Issue date Mar 16, 1999
- Texas Instruments Japan Ltd.
- Norito Umehara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive composition comprising (meth)acrylate polymer and epoxy resin
- Patent number 5,356,949
- Issue date Oct 18, 1994
- Lintec Corporation
- Mikio Komiyama
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive sheets
- Patent number 5,187,007
- Issue date Feb 16, 1993
- Lintec Corporation
- Kazuyoshi Ebe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive tape and use thereof
- Patent number 5,118,567
- Issue date Jun 2, 1992
- Lintec Corporation
- Mikio Komiyama
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of dicing and bonding semiconductor chips using a photocurab...
- Patent number 5,110,388
- Issue date May 5, 1992
- Lintec Corporation
- Mikio Komiyama
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of making a cover tape for sealing chip-holding parts of car...
- Patent number 4,994,300
- Issue date Feb 19, 1991
- Lintec Corporation
- Kazumi Itou
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Adhesive sheets
- Patent number 4,965,127
- Issue date Oct 23, 1990
- FSK Kabushiki Kaisha
- Kazuyoshi Ebe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive paper for copying
- Patent number 4,946,728
- Issue date Aug 7, 1990
- FSK Kabushiki Kaisha
- Takeshi Ikeda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Cover tape for sealing chip-holding parts of carrier tape
- Patent number 4,929,486
- Issue date May 29, 1990
- FSK Kabushiki Kaisha
- Kazumi Itou
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Adhesive sheets
- Patent number 4,756,968
- Issue date Jul 12, 1988
- FSK Kabushiki Kaisha
- Kazuyoshi Ebe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
Method for manufacturing semiconductor device using adhesive sheet...
- Publication number 20030226640
- Publication date Dec 11, 2003
- Osamu Yamazaki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Pressure sensitive adhesive double coated sheet
- Publication number 20030031866
- Publication date Feb 13, 2003
- LINTEC CORPORATION
- Hayato Noguchi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Pressure sensitive adhesive sheet for semiconductor wafer processing
- Publication number 20030008139
- Publication date Jan 9, 2003
- LINTEC CORPORATION
- Koichi Nagamoto
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Tape for forming resin tie bar, resin tie bar, lead frame equipped...
- Publication number 20020192464
- Publication date Dec 19, 2002
- Osamu Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductor bodies attached adhesive sheet, process for producing sem...
- Publication number 20020140093
- Publication date Oct 3, 2002
- Osamu Yamazaki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Process for producing a chip
- Publication number 20020025432
- Publication date Feb 28, 2002
- Hayato Noguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for producing semiconductor chip
- Publication number 20010014492
- Publication date Aug 16, 2001
- LINTEC CORPORATION
- Hayato Noguchi
- H01 - BASIC ELECTRIC ELEMENTS

Kazuyoshi Ebe

Person

Patents Grantslast 30 patents

Method for manufacturing semiconductor device using adhesive sheet...

Semiconductor device adhesive sheet with conductor bodies buried th...

Semiconductor device including adhesive agent layer with embedded c...

Tape for forming resin tie bar, resin tie bar, lead frame equipped...

Pressure sensitive adhesive sheet for semiconductor wafer processing

Method of processing semiconductor wafer and semiconductor wafer su...

Process for producing a chip

Method for grinding a wafer back

Process for producing semiconductor chip

Method of using pressure sensitive adhesive double coated sheet

Pressure sensitive adhesive sheet for producing a chip

Process for preparing a semiconductor wafer

Process for producing chip and pressure sensitive adhesive sheet fo...

Cover tape for chip transportation and sealed structure

Base material and adhesive tape using the same

Adhesive tape, base material for adhesive tape and their manufactur...

Wafer dicing/bonding sheet and process for producing semiconductor...

Process for producing chip and pressure sensitive adhesive sheet fo...

Process for producing semiconductor device

Adhesive composition comprising (meth)acrylate polymer and epoxy resin

Adhesive sheets

Adhesive tape and use thereof

Method of dicing and bonding semiconductor chips using a photocurab...

Method of making a cover tape for sealing chip-holding parts of car...

Adhesive sheets

Adhesive paper for copying

Cover tape for sealing chip-holding parts of carrier tape

Adhesive sheets

Patents Applicationslast 30 patents

Method for manufacturing semiconductor device using adhesive sheet...

Pressure sensitive adhesive double coated sheet

Pressure sensitive adhesive sheet for semiconductor wafer processing

Tape for forming resin tie bar, resin tie bar, lead frame equipped...

Conductor bodies attached adhesive sheet, process for producing sem...

Process for producing a chip

Process for producing semiconductor chip