Kazuyoshi Kojima

Person

Ibaraki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Circuit connecting material, film-form circuit connecting material...
- Patent number 8,501,045
- Issue date Aug 6, 2013
- Hitachi Chemical Company, Ltd.
- Motohiro Arifuku
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive for bonding circuit members, circuit board and process for...
- Patent number 8,273,458
- Issue date Sep 25, 2012
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive for bonding circuit members, circuit board and process for...
- Patent number 8,273,457
- Issue date Sep 25, 2012
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive for bonding circuit members, circuit board and process for...
- Patent number 8,252,419
- Issue date Aug 28, 2012
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Circuit connecting material, film-form circuit connecting material...
- Patent number 8,202,622
- Issue date Jun 19, 2012
- Hitachi Chemical Co., Ltd.
- Motohiro Arifuku
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Circuit connecting method
- Patent number 8,132,319
- Issue date Mar 13, 2012
- Hitachi Chemical Company, Ltd.
- Motohiro Arifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit connecting material, film-like circuit connecting material...
- Patent number 8,043,709
- Issue date Oct 25, 2011
- Hitachi Chemical Co., Ltd.
- Motohiro Arifuku
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive for bonding circuit members, circuit board and process for...
- Patent number 7,879,445
- Issue date Feb 1, 2011
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive for bonding circuit members, circuit board, and method of...
- Patent number 7,247,381
- Issue date Jul 24, 2007
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection sheet and electrode connection structure for electricall...
- Patent number 6,338,195
- Issue date Jan 15, 2002
- Hitachi Chemical Company, Ltd.
- Isao Tsukagoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filmy adhesive for connecting circuits and circuit board
- Patent number 6,328,844
- Issue date Dec 11, 2001
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of production of semiconductor device
- Patent number 6,223,429
- Issue date May 1, 2001
- Hitachi Chemical Company, Ltd.
- Aizou Kaneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component parts device
- Patent number 6,184,577
- Issue date Feb 6, 2001
- Hitachi Chemical Company, Ltd.
- Kenzo Takemura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection sheet and electrode connection structure for electricall...
- Patent number 6,034,331
- Issue date Mar 7, 2000
- Hitachi Chemical Company, Ltd.
- Isao Tsukagoshi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT CONNECTION MATERIAL, AND CONNECTION STRUCTURE OF CIRCUIT ME...
- Publication number 20110267791
- Publication date Nov 3, 2011
- Hitachi Chemical Company, Ltd.
- Katsuhiko Tomisaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR...
- Publication number 20110247867
- Publication date Oct 13, 2011
- Itsuo Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT CONNECTING MATERIAL, FILM-FORM CIRCUIT CONNECTING MATERIAL...
- Publication number 20110247870
- Publication date Oct 13, 2011
- Motohiro Arifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR...
- Publication number 20110247874
- Publication date Oct 13, 2011
- Itsuo Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR...
- Publication number 20110247873
- Publication date Oct 13, 2011
- Itsuo Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT CONNECTION MATERIAL, FILM-FORM CIRCUIT CONNECTING MATERIAL...
- Publication number 20110247757
- Publication date Oct 13, 2011
- Motohiro Arifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE AND METHOD FOR PR...
- Publication number 20100307805
- Publication date Dec 9, 2010
- Hitachi Chemical Company, Ltd.
- Takashi Nakazawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTION STRUCTURE
- Publication number 20100277884
- Publication date Nov 4, 2010
- Hitachi Chemical Company, Ltd.
- Motohiro Arifuku
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CIRCUIT CONNECTING METHOD
- Publication number 20100263208
- Publication date Oct 21, 2010
- Hitachi Chemical Company, Ltd.
- Motohiro Arifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT-CONNECTING MATERIAL, AND CONNECTION STRUCTURE FOR CIRCUIT M...
- Publication number 20100139947
- Publication date Jun 10, 2010
- HITACHI CHEMICAL COMPANY, LTD.
- Kazuyoshi Kojima
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
FILMY ADHESIVE FOR CIRCUIT CONNECTION
- Publication number 20100140556
- Publication date Jun 10, 2010
- Hitachi Chemical Company, Ltd.
- Kazuyoshi Kojima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT CONNECTION STRUCTURE
- Publication number 20100025097
- Publication date Feb 4, 2010
- Hitachi Chemical Company, Ltd.
- Kazuyoshi Kojima
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CIRCUIT CONNECTING MATERIAL, FILM-FORM CIRCUIT CONNECTING MATERIAL...
- Publication number 20090321116
- Publication date Dec 31, 2009
- Motohiro Arifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR...
- Publication number 20090314533
- Publication date Dec 24, 2009
- Itsuo Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Adhesive for bonding circuit members, circuit board and process for...
- Publication number 20070137887
- Publication date Jun 21, 2007
- Itsuo Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit connecting material, film-like circuit connecting material...
- Publication number 20060100314
- Publication date May 11, 2006
- Motohiro Arifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Kazuyoshi Kojima

Person

Patents Grantslast 30 patents

Circuit connecting material, film-form circuit connecting material...

Adhesive for bonding circuit members, circuit board and process for...

Adhesive for bonding circuit members, circuit board and process for...

Adhesive for bonding circuit members, circuit board and process for...

Circuit connecting material, film-form circuit connecting material...

Circuit connecting method

Circuit connecting material, film-like circuit connecting material...

Adhesive for bonding circuit members, circuit board and process for...

Adhesive for bonding circuit members, circuit board, and method of...

Connection sheet and electrode connection structure for electricall...

Filmy adhesive for connecting circuits and circuit board

Method of production of semiconductor device

Electronic component parts device

Connection sheet and electrode connection structure for electricall...

Patents Applicationslast 30 patents

CIRCUIT CONNECTION MATERIAL, AND CONNECTION STRUCTURE OF CIRCUIT ME...

ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR...

CIRCUIT CONNECTING MATERIAL, FILM-FORM CIRCUIT CONNECTING MATERIAL...

ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR...

ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR...

CIRCUIT CONNECTION MATERIAL, FILM-FORM CIRCUIT CONNECTING MATERIAL...

CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE AND METHOD FOR PR...

CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTION STRUCTURE

CIRCUIT CONNECTING METHOD

CIRCUIT-CONNECTING MATERIAL, AND CONNECTION STRUCTURE FOR CIRCUIT M...

FILMY ADHESIVE FOR CIRCUIT CONNECTION

CIRCUIT CONNECTION STRUCTURE

CIRCUIT CONNECTING MATERIAL, FILM-FORM CIRCUIT CONNECTING MATERIAL...

ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR...

Adhesive for bonding circuit members, circuit board and process for...

Circuit connecting material, film-like circuit connecting material...