Kazuyoshi MAEKAWA

Person

Ibaraki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having interconnection structure and method of...
- Patent number 12,080,591
- Issue date Sep 3, 2024
- Renesas Electronics Corporation
- Kazuyuki Omori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device with copper interconnections
- Patent number 11,450,561
- Issue date Sep 20, 2022
- Renesas Electronics Corporation
- Kazuyuki Omori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with an interconnection layer and method of ma...
- Patent number 10,665,502
- Issue date May 26, 2020
- RENSAS ELECTRONICS CORPORATION
- Kazuyuki Omori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device
- Patent number 10,204,853
- Issue date Feb 12, 2019
- Renesas Electronics Corporation
- Masahiro Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and its manufacturing method
- Patent number 10,192,755
- Issue date Jan 29, 2019
- Renesas Electronics Corporation
- Masahiro Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,083,924
- Issue date Sep 25, 2018
- Renesas Electronics Corporation
- Kazuyoshi Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and its manufacturing method
- Patent number 9,972,505
- Issue date May 15, 2018
- Renesas Electronics Corporation
- Masahiro Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device including copper inter...
- Patent number 9,972,530
- Issue date May 15, 2018
- Renesas Electronics Corporation
- Kazuyuki Omori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Manufacturing method of back illumination CMOS image sensor device...
- Patent number 9,608,034
- Issue date Mar 28, 2017
- Renesas Electronics Corporation
- Kazuyoshi Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,607,956
- Issue date Mar 28, 2017
- Renesas Electronics Corporation
- Masahiro Matsumoto
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Manufacturing method of semiconductor integrated circuit device
- Patent number 9,530,819
- Issue date Dec 27, 2016
- Renesas Electronics Corporation
- Kazuyoshi Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semicondutor device with copper plugs having different resistance v...
- Patent number 9,508,646
- Issue date Nov 29, 2016
- Renesas Electronics Corporation
- Kazuyuki Omori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,406,628
- Issue date Aug 2, 2016
- Renesas Electronics Corporation
- Masahiro Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of back illumination CMOS image sensor device...
- Patent number 9,263,497
- Issue date Feb 16, 2016
- Renesas Electronics Corporation
- Kazuyoshi Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a line and method of fabrication thereof
- Patent number 8,749,064
- Issue date Jun 10, 2014
- Renesas Electronics Corporation
- Kazuyoshi Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a line and method of fabrication thereof
- Patent number 8,432,037
- Issue date Apr 30, 2013
- Renesas Electronics Corporation
- Kazuyoshi Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a line and method of fabrication thereof
- Patent number 8,222,146
- Issue date Jul 17, 2012
- Renesas Electronics Corporation
- Kazuyoshi Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having wiring with oxide layer of impurity fro...
- Patent number 8,125,085
- Issue date Feb 28, 2012
- Renesas Electronics Corporation
- Kazuyoshi Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a line and method of fabrication thereof
- Patent number 7,936,069
- Issue date May 3, 2011
- Renesas Electronics Corporation
- Kazuyoshi Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a line and method of fabrication thereof
- Patent number 7,709,955
- Issue date May 4, 2010
- Renesas Technology Corp.
- Kazuyoshi Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a line and method of fabrication thereof
- Patent number 7,709,388
- Issue date May 4, 2010
- Renesas Technology Corp.
- Kazuyoshi Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 7,564,133
- Issue date Jul 21, 2009
- Panasonic Corporation
- Masakazu Hamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing same
- Patent number 7,538,030
- Issue date May 26, 2009
- Renesas Technology Corp.
- Kazuyoshi Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing same
- Patent number 7,479,446
- Issue date Jan 20, 2009
- Renesas Technology Corp.
- Kazuyoshi Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 7,371,681
- Issue date May 13, 2008
- Renesas Technology Corp.
- Kazuyoshi Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a line and method of fabrication thereof
- Patent number 7,192,871
- Issue date Mar 20, 2007
- Renesas Technology Corp.
- Kazuyoshi Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a polysilicon, barrier structure, an...
- Patent number 6,975,007
- Issue date Dec 13, 2005
- Renesas Technology Corp.
- Kazuyoshi Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device
- Patent number 6,864,183
- Issue date Mar 8, 2005
- Renesas Technology Corp.
- Kazuyoshi Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structure, method of forming the same, semiconductor device...
- Patent number 6,657,301
- Issue date Dec 2, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Kazuyoshi Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a semiconductor device
- Patent number 6,599,820
- Issue date Jul 29, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Yasuhiro Kanda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230097408
- Publication date Mar 30, 2023
- RENESAS ELECTRONICS CORPORATION
- Nozomi ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220384257
- Publication date Dec 1, 2022
- RENESAS ELECTRONICS CORPORATION
- Kazuyuki OMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200251385
- Publication date Aug 6, 2020
- Renesas Electronics Corporation
- Kazuyuki OMORI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200035552
- Publication date Jan 30, 2020
- Renesas Electronics Corporation
- Kazuyuki OMORI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180240700
- Publication date Aug 23, 2018
- Renesas Electronics Corporation
- Kazuyuki OMORI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
- Publication number 20180197753
- Publication date Jul 12, 2018
- RENESAS ELECTRONICS CORPORATION
- Masahiro MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170372996
- Publication date Dec 28, 2017
- RENESAS ELECTRONICS CORPORATION
- Masahiro MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20170040212
- Publication date Feb 9, 2017
- RENESAS ELECTRONICS CORPORATION
- Kazuyuki Omori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20160379946
- Publication date Dec 29, 2016
- RENESAS ELECTRONICS CORPORATION
- Kazuyoshi MAEKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160268222
- Publication date Sep 15, 2016
- RENESAS ELECTRONICS CORPORATION
- Masahiro Matsumoto
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
- Publication number 20160181184
- Publication date Jun 23, 2016
- RENESAS ELECTRONICS CORPORATION
- Masahiro MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF BACK ILLUMINATION CMOS IMAGE SENSOR DEVICE...
- Publication number 20160118437
- Publication date Apr 28, 2016
- RENESAS ELECTRONICS CORPORATION
- Kazuyoshi MAEKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20160043133
- Publication date Feb 11, 2016
- RENESAS ELECTRONICS CORPORATION
- Kazuyoshi MAEKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150221597
- Publication date Aug 6, 2015
- Renesas Electronics Corporation
- Kazuyuki Omori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140284790
- Publication date Sep 25, 2014
- RENESAS ELECTRONICS CORPORATION
- Masahiro Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20140141560
- Publication date May 22, 2014
- RENESAS ELECTRONICS CORPORATION
- Kazuyoshi MAEKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A LINE AND METHOD OF FABRICATION THEREOF
- Publication number 20130234334
- Publication date Sep 12, 2013
- Kazuyoshi MAEKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A LINE AND METHOD OF FABRICATION THEREOF
- Publication number 20120168949
- Publication date Jul 5, 2012
- RENESAS ELECTRONICS CORPORATION
- Kazuyoshi Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A LINE AND METHOD OF FABRICATION THEREOF
- Publication number 20110171828
- Publication date Jul 14, 2011
- RENESAS ELECTRONICS CORPORATION
- Kazuyoshi Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A LINE AND METHOD OF FABRICATION THEREOF
- Publication number 20100176511
- Publication date Jul 15, 2010
- Renesas Technology Corp.
- Kazuyoshi Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
- Publication number 20100044864
- Publication date Feb 25, 2010
- RENESAS TECHNOLOGY CORP.
- Kazuyoshi MAEKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having at least two layers of wirings stacked...
- Publication number 20080197496
- Publication date Aug 21, 2008
- RENESAS TECHNOLOGY CORP.
- Kenichi Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20080076239
- Publication date Mar 27, 2008
- Renesas Technology Corp.
- Kazuyoshi Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20080064196
- Publication date Mar 13, 2008
- Renesas Technology Corp.
- Kazuyoshi Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method therof
- Publication number 20070145591
- Publication date Jun 28, 2007
- Hisashi Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20070145600
- Publication date Jun 28, 2007
- Hisashi Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A LINE AND METHOD OF FABRICATION THEREOF
- Publication number 20070138532
- Publication date Jun 21, 2007
- Renesas Technology Corp.
- Kazuyoshi Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A LINE AND METHOD OF FABRICATION THEREOF
- Publication number 20070141831
- Publication date Jun 21, 2007
- Renesas Technology Corp.
- Kazuyoshi Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for fabricating the same
- Publication number 20060223325
- Publication date Oct 5, 2006
- Masakazu Hamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing same
- Publication number 20060054981
- Publication date Mar 16, 2006
- Renesas Technology Corp.
- Kazuyoshi Maekawa
- H01 - BASIC ELECTRIC ELEMENTS

Kazuyoshi MAEKAWA

Person

Patents Grantslast 30 patents

Semiconductor device having interconnection structure and method of...

Semiconductor device with copper interconnections

Semiconductor device with an interconnection layer and method of ma...

Semiconductor device

Semiconductor device and its manufacturing method

Semiconductor device and manufacturing method thereof

Semiconductor device and its manufacturing method

Method of manufacturing semiconductor device including copper inter...

Manufacturing method of back illumination CMOS image sensor device...

Semiconductor device and method of manufacturing the same

Manufacturing method of semiconductor integrated circuit device

Semicondutor device with copper plugs having different resistance v...

Semiconductor device and method of manufacturing the same

Manufacturing method of back illumination CMOS image sensor device...

Semiconductor device with a line and method of fabrication thereof

Semiconductor device with a line and method of fabrication thereof

Semiconductor device with a line and method of fabrication thereof

Semiconductor device having wiring with oxide layer of impurity fro...

Semiconductor device with a line and method of fabrication thereof

Semiconductor device with a line and method of fabrication thereof

Semiconductor device with a line and method of fabrication thereof

Semiconductor device and method for fabricating the same

Semiconductor device and method of manufacturing same

Semiconductor device and method of manufacturing same

Method of manufacturing a semiconductor device

Semiconductor device with a line and method of fabrication thereof

Semiconductor device including a polysilicon, barrier structure, an...

Method for manufacturing a semiconductor device

Contact structure, method of forming the same, semiconductor device...

Method of producing a semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

MANUFACTURING METHOD OF BACK ILLUMINATION CMOS IMAGE SENSOR DEVICE...

MANUFACTURING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH A LINE AND METHOD OF FABRICATION THEREOF

SEMICONDUCTOR DEVICE WITH A LINE AND METHOD OF FABRICATION THEREOF

SEMICONDUCTOR DEVICE WITH A LINE AND METHOD OF FABRICATION THEREOF

SEMICONDUCTOR DEVICE WITH A LINE AND METHOD OF FABRICATION THEREOF

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

Semiconductor device having at least two layers of wirings stacked...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

Semiconductor device and manufacturing method therof

Semiconductor device and manufacturing method thereof

SEMICONDUCTOR DEVICE WITH A LINE AND METHOD OF FABRICATION THEREOF

SEMICONDUCTOR DEVICE WITH A LINE AND METHOD OF FABRICATION THEREOF

Semiconductor device and method for fabricating the same

Semiconductor device and method of manufacturing same