TREA

Kazuyoshi Nishimoto

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  • Osaka, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Holding apparatus
    • Patent number 11,891,714
    • Issue date Feb 6, 2024
    • C. Uyemura & Co., Ltd.
    • Daisuke Matsuyama
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Holding jig
    • Patent number 11,887,882
    • Issue date Jan 30, 2024
    • C. Uyemura & Co., Ltd.
    • Daisuke Matsuyama
    • B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
  • Information Patent Grant

    Continuous copper electroplating method
    • Patent number 7,988,842
    • Issue date Aug 2, 2011
    • C. Uyemura & Co., Ltd.
    • Shinji Tachibana
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

  • Information Patent Application

    Workpiece Holding Jig and Electroplating Apparatus
    • Publication number 20220119980
    • Publication date Apr 21, 2022
    • C. UYEMURA & CO., LTD
    • Masahiro MURAKOSHI
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Workpiece Holding Jig and Electroplating Apparatus
    • Publication number 20220098750
    • Publication date Mar 31, 2022
    • C. UYEMURA & CO., LTD
    • Masahiro MURAKOSHI
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Workpiece Holding Jig and Electroplating Apparatus
    • Publication number 20220098751
    • Publication date Mar 31, 2022
    • C. UYEMURA & CO., LTD
    • Masahiro MURAKOSHI
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    HOLDING APPARATUS
    • Publication number 20210102306
    • Publication date Apr 8, 2021
    • C. Uyemura & Co., Ltd.
    • Daisuke MATSUYAMA
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    HOLDING JIG
    • Publication number 20200168499
    • Publication date May 28, 2020
    • C. Uyemura & Co., Ltd.
    • Daisuke MATSUYAMA
    • B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
  • Information Patent Application

    Workpiece Holding Jig and Electroplating Apparatus
    • Publication number 20200149180
    • Publication date May 14, 2020
    • C. UYEMURA & CO., LTD
    • Kazuyoshi NISHIMOTO
    • B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
  • Information Patent Application

    CONTINUOUS COPPER ELECTROPLATING METHOD
    • Publication number 20090026083
    • Publication date Jan 29, 2009
    • Shinji TACHIBANA
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR