Kazuyoshi Tendou

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Liquid resin composition for electronic part sealing, and electroni...
- Patent number 7,982,322
- Issue date Jul 19, 2011
- Hitachi Chemical Co., Ltd.
- Satoru Tsuchida
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Sealant for electronics of epoxy resin, aromatic amine, accelerator...
- Patent number 7,981,977
- Issue date Jul 19, 2011
- Hitachi Chemical Co., Ltd.
- Kazuyoshi Tendou
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin molding material for sealing and electronic component
- Patent number 7,675,185
- Issue date Mar 9, 2010
- Hitachi Chemical Co., Ltd.
- Kazuyoshi Tendou
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
LIQUID RESIN COMPOSITION FOR ELECTRONIC PART SEALING, AND ELECTRONI...
- Publication number 20100014263
- Publication date Jan 21, 2010
- Satoru Tsuchida
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Liquid Resin Composition for Electronic Components and Electronic C...
- Publication number 20090273070
- Publication date Nov 5, 2009
- Kazuyoshi Tendou
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Epoxy Resin Molding Material for Sealing, and Electronic Component...
- Publication number 20090247670
- Publication date Oct 1, 2009
- Mitsuyoshi Hamada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Epoxy Resin Molding Material for Sealing and Electronic Component
- Publication number 20070254986
- Publication date Nov 1, 2007
- Hitachi Chemical Co., Ltd.
- Kazuyoshi Tendou
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...