Kazuyuki Inoue

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Substrate processing apparatus
- Patent number 9,287,158
- Issue date Mar 15, 2016
- Ebara Corporation
- Tamami Takahashi
- B24 - GRINDING POLISHING
Information Patent Grant
Device for polishing peripheral edge of semiconductor wafer
- Patent number 8,029,333
- Issue date Oct 4, 2011
- Ebara Corporation
- Tamami Takahashi
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20160172221
- Publication date Jun 16, 2016
- EBARA CORPORATION
- Tamami TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR AND METHOD OF POLISHING PERIPHERAL EDGE OF SEMICONDUCTOR...
- Publication number 20090093192
- Publication date Apr 9, 2009
- EBARA CORPORATION
- Tamami Takahashi
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20090017733
- Publication date Jan 15, 2009
- EBARA CORPORATION
- Tamami Takahashi
- B24 - GRINDING POLISHING
Information Patent Application
Substrate Processing Apparatus
- Publication number 20080200100
- Publication date Aug 21, 2008
- EBARA CORPORATION
- Tamami Takahashi
- B24 - GRINDING POLISHING