Kazuyuki Misumi

Person

Hyogo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor device, and wire bonder
- Patent number 8,881,966
- Issue date Nov 11, 2014
- Renesas Electronics Corporation
- Kazuyuki Misumi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device and method of manufacturing same
- Patent number 8,652,880
- Issue date Feb 18, 2014
- Renesas Electronics Corporation
- Koji Bando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing magnetic memory chip device
- Patent number 8,524,510
- Issue date Sep 3, 2013
- Renesas Electronics Corporation
- Kazuyuki Misumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing same
- Patent number 8,258,604
- Issue date Sep 4, 2012
- Renesas Electronics Corporation
- Koji Bando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing magnetic memory chip device
- Patent number 8,124,425
- Issue date Feb 28, 2012
- Renesas Electronics Corporation
- Kazuyuki Misumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including power supply bar having jutted porti...
- Patent number 8,097,942
- Issue date Jan 17, 2012
- Renesas Electronics Corporation
- Kazuyuki Misumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,915,719
- Issue date Mar 29, 2011
- Renesas Electronics Corporation
- Kazuyuki Misumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin molded semiconductor device and differential amplifier circuit
- Patent number 7,763,966
- Issue date Jul 27, 2010
- Renesas Technology Corp.
- Kazuyuki Misumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,151,316
- Issue date Dec 19, 2006
- Renesas Technology Corp.
- Kazuyuki Misumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,841,870
- Issue date Jan 11, 2005
- Renesas Technology Corp.
- Kazuyuki Misumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sealed semiconductor device and lead frame used for the same
- Patent number 6,737,733
- Issue date May 18, 2004
- Renesas Technology Corp.
- Kazuyuki Misumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame with raised leads and plastic packaged semiconductor dev...
- Patent number 6,614,101
- Issue date Sep 2, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Kazuyuki Misumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-encapsulated semiconductor device
- Patent number 6,552,418
- Issue date Apr 22, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Kazuyuki Misumi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20120309131
- Publication date Dec 6, 2012
- Renesas Electronics Corporation
- KOJI BANDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING MAGNETIC MEMORY CHIP DEVICE
- Publication number 20120122246
- Publication date May 17, 2012
- RENESAS ELECTRONICS CORPORATION
- Kazuyuki MISUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND WIRE BONDER
- Publication number 20100203681
- Publication date Aug 12, 2010
- RENEASAS TECHNOLOGY CORP.
- KAZUYUKI MISUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20100164077
- Publication date Jul 1, 2010
- RENESAS TECHNOLOGY CORP.
- Koji Bando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING MAGNETIC MEMORY CHIP DEVICE
- Publication number 20100120176
- Publication date May 13, 2010
- Kazuyuki Misumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20100001386
- Publication date Jan 7, 2010
- RENESAS TECHNOLOGY CORP.
- Kazuyuki Misumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20090085179
- Publication date Apr 2, 2009
- RENESAS TECHNOLOGY CORP.
- Kazuyuki Misumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20080217750
- Publication date Sep 11, 2008
- RENESAS TECHNOLOGY CORP.
- Kazuyuki Misumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20050006764
- Publication date Jan 13, 2005
- RENESAS TECHNOLOGY CORP.
- Kazuyuki Misumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20040016999
- Publication date Jan 29, 2004
- Mitsubishi Denki Kabushiki Kaisha
- Kazuyuki Misumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME WITH RAISED LEADS AND PLASTIC PACKAGED SEMICONDUCTOR DEV...
- Publication number 20020105060
- Publication date Aug 8, 2002
- Kazuyuki Misumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sealed semiconductor device and lead frame used for the same
- Publication number 20020070431
- Publication date Jun 13, 2002
- Kazuyuki Misumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resin-encapsulated semiconductor device
- Publication number 20020030251
- Publication date Mar 14, 2002
- Kazuyuki Misumi
- H01 - BASIC ELECTRIC ELEMENTS

Kazuyuki Misumi

Person

Patents Grantslast 30 patents

Method of manufacturing semiconductor device, and wire bonder

Semiconductor device and method of manufacturing same

Method for manufacturing magnetic memory chip device

Semiconductor device and method of manufacturing same

Method for manufacturing magnetic memory chip device

Semiconductor device including power supply bar having jutted porti...

Semiconductor device

Resin molded semiconductor device and differential amplifier circuit

Semiconductor device

Semiconductor device

Sealed semiconductor device and lead frame used for the same

Lead frame with raised leads and plastic packaged semiconductor dev...

Resin-encapsulated semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

METHOD FOR MANUFACTURING MAGNETIC MEMORY CHIP DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND WIRE BONDER

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

METHOD FOR MANUFACTURING MAGNETIC MEMORY CHIP DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR DEVICE

Semiconductor device

Semiconductor device

Semiconductor device

LEAD FRAME WITH RAISED LEADS AND PLASTIC PACKAGED SEMICONDUCTOR DEV...

Sealed semiconductor device and lead frame used for the same

Resin-encapsulated semiconductor device