Kazuyuki Mitsukura

Person

Ibaraki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wiring structure, method for manufacturing same, and semiconductor...
- Patent number 12,114,437
- Issue date Oct 8, 2024
- Resonac Corporation
- Masaya Toba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and production method for same
- Patent number 12,004,305
- Issue date Jun 4, 2024
- Resonac Corporation
- Masaya Toba
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate and method for manufacturing the same
- Patent number 11,990,396
- Issue date May 21, 2024
- Resonac Corporation
- Kazuyuki Mitsukura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 11,979,990
- Issue date May 7, 2024
- Resonac Corporation
- Masaya Toba
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Organic interposer and method for manufacturing organic interposer
- Patent number 11,562,951
- Issue date Jan 24, 2023
- SHOWA DENKO MATERIALS CO., LTD.
- Kazuyuki Mitsukura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic interposer and method for manufacturing organic interposer
- Patent number 10,756,008
- Issue date Aug 25, 2020
- Hitachi Chemical Company, Ltd.
- Kazuyuki Mitsukura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition, wiring layer laminate for semiconductor, and sem...
- Patent number 10,575,402
- Issue date Feb 25, 2020
- Hitachi Chemical Company, Ltd.
- Shinichiro Abe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Photosensitive resin composition, film adhesive, adhesive sheet, ad...
- Patent number 10,428,253
- Issue date Oct 1, 2019
- Hitachi Chemical Company, Ltd.
- Tomonori Minegishi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 10,388,608
- Issue date Aug 20, 2019
- Hitachi Chemical Company, Ltd.
- Kazuyuki Mitsukura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Photosensitive adhesive composition, film-like adhesive, adhesive s...
- Patent number 9,309,446
- Issue date Apr 12, 2016
- Hitachi Chemical Company, Ltd.
- Kazuyuki Mitsukura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of producing semiconductor device with patterned photosensit...
- Patent number 8,507,323
- Issue date Aug 13, 2013
- Hitachi Chemical Company, Ltd.
- Takashi Masuko
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Photosensitive adhesive, semiconductor device and method for manufa...
- Patent number 8,349,700
- Issue date Jan 8, 2013
- Hitachi Chemical Company, Ltd.
- Takashi Masuko
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Photosensitive adhesive
- Patent number 8,258,017
- Issue date Sep 4, 2012
- Hitachi Chemical Company, Ltd.
- Takashi Masuko
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
WIRING STRUCTURE, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR...
- Publication number 20240397635
- Publication date Nov 28, 2024
- Resonac Corporation
- Masaya TOBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKA...
- Publication number 20240381529
- Publication date Nov 14, 2024
- Resonac Corporation
- Shunsuke OTAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SELECTING PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR P...
- Publication number 20240361697
- Publication date Oct 31, 2024
- Resonac Corporation
- Yuki IMAZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD
- Publication number 20240341039
- Publication date Oct 10, 2024
- Resonac Corporation
- Kei TOGASAKI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240306308
- Publication date Sep 12, 2024
- Resonac Corporation
- Masaya TOBA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240282684
- Publication date Aug 22, 2024
- Resonac Corporation
- Kazuyuki MITSUKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20240250025
- Publication date Jul 25, 2024
- Resonac Corporation
- Kazuyuki MITSUKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, WIRING BOARD, AND SEMICO...
- Publication number 20240088051
- Publication date Mar 14, 2024
- Resonac Corporation
- Kazuyuki MITSUKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING WIRING BOARD, LAMINATE AND METHOD FOR PRODUCIN...
- Publication number 20240057263
- Publication date Feb 15, 2024
- Resonac Corporation
- Masaya TOBA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAYERED PLATE AND WIRING BASE BOARD PRODUCTION METHOD
- Publication number 20240049395
- Publication date Feb 8, 2024
- Resonac Corporation
- Masaya TOBA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD, METHOD FOR MANUFACTURING SEM...
- Publication number 20240030044
- Publication date Jan 25, 2024
- Resonac Corporation
- Masaya TOBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING WIRING BOARD, AND WIRING BOARD
- Publication number 20240015889
- Publication date Jan 11, 2024
- Resonac Corporation
- Kei TOGASAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ORGANIC CORE MATERIAL, PRODUCTION METHOD FOR SAME, LAMINATE INCLUDI...
- Publication number 20230356498
- Publication date Nov 9, 2023
- Resonac Corporation
- Shunsuke OTAKE
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKA...
- Publication number 20230331946
- Publication date Oct 19, 2023
- Resonac Corporation
- Shunsuke OTAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, METHOD OF PRODUCING PATTERNED CUR...
- Publication number 20230259026
- Publication date Aug 17, 2023
- Showa Denko Materials Co., Ltd.
- Shinichiro ABE
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD FOR PRODUCING CIRCUIT BOARD
- Publication number 20230253215
- Publication date Aug 10, 2023
- Masaya TOBA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WIRING STRUCTURE, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR...
- Publication number 20230209725
- Publication date Jun 29, 2023
- Showa Denko Materials Co., Ltd.
- Masaya TOBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230118368
- Publication date Apr 20, 2023
- Showa Denko Materials Co., Ltd.
- Kazuyuki MITSUKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR SELECTING PHOTOSENSITI...
- Publication number 20230104391
- Publication date Apr 6, 2023
- Kazuyuki MITSUKURA
- G01 - MEASURING TESTING
Information Patent Application
WIRING BOARD AND PRODUCTION METHOD FOR SAME
- Publication number 20220071019
- Publication date Mar 3, 2022
- Showa Denko Materials Co., Ltd.
- Masaya TOBA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220071018
- Publication date Mar 3, 2022
- Showa Denko Materials Co., Ltd.
- Masaya TOBA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ORGANIC INTERPOSER AND METHOD FOR MANUFACTURING ORGANIC INTERPOSER
- Publication number 20200365501
- Publication date Nov 19, 2020
- Hitachi Chemical Company, Ltd.
- Kazuyuki MITSUKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION, WIRING LAYER LAMINATE FOR SEMICONDUCTOR, AND SEM...
- Publication number 20190281697
- Publication date Sep 12, 2019
- Hitachi Chemical Company, Ltd.
- Shinichiro ABE
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ORGANIC INTERPOSER AND METHOD FOR MANUFACTURING ORGANIC INTERPOSER
- Publication number 20190109082
- Publication date Apr 11, 2019
- Hitachi Chemical Company, Ltd.
- Kazuyuki MITSUKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20180337134
- Publication date Nov 22, 2018
- Hitachi Chemical Company, Ltd.
- Kazuyuki MITSUKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, FILM ADHESIVE, ADHESIVE SHEET, AD...
- Publication number 20160160102
- Publication date Jun 9, 2016
- Hitachi Chemical Company, Ltd.
- Tomonori MINEGISHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PHOTOSENSITIVE ADHESIVE
- Publication number 20120282547
- Publication date Nov 8, 2012
- Hitachi Chemical Company, Ltd.
- Takashi Masuko
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...
- Publication number 20120263946
- Publication date Oct 18, 2012
- Kazuyuki Mitsukura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE COMPOSITION, SEMICONDUCTOR DEVICE MAKING USE THEREOF, AND...
- Publication number 20120256326
- Publication date Oct 11, 2012
- Kazuyuki Mitsukura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD FOR MANUFACTURING FILM-LIKE ADHESIVE, ADHESIVE SHEET, SEMICO...
- Publication number 20120248634
- Publication date Oct 4, 2012
- Kazuyuki Mitsukura
- H01 - BASIC ELECTRIC ELEMENTS

Kazuyuki Mitsukura

Person

Patents Grantslast 30 patents

Wiring structure, method for manufacturing same, and semiconductor...

Wiring board and production method for same

Substrate and method for manufacturing the same

Wiring board and method for manufacturing the same

Organic interposer and method for manufacturing organic interposer

Organic interposer and method for manufacturing organic interposer

Resin composition, wiring layer laminate for semiconductor, and sem...

Photosensitive resin composition, film adhesive, adhesive sheet, ad...

Semiconductor device and method for manufacturing same

Photosensitive adhesive composition, film-like adhesive, adhesive s...

Method of producing semiconductor device with patterned photosensit...

Photosensitive adhesive, semiconductor device and method for manufa...

Photosensitive adhesive

Patents Applicationslast 30 patents

WIRING STRUCTURE, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR...

METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKA...

METHOD FOR SELECTING PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR P...

METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD

SEMICONDUCTOR PACKAGE

SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, WIRING BOARD, AND SEMICO...

METHOD FOR PRODUCING WIRING BOARD, LAMINATE AND METHOD FOR PRODUCIN...

LAYERED PLATE AND WIRING BASE BOARD PRODUCTION METHOD

METHOD FOR MANUFACTURING WIRING BOARD, METHOD FOR MANUFACTURING SEM...

METHOD FOR PRODUCING WIRING BOARD, AND WIRING BOARD

ORGANIC CORE MATERIAL, PRODUCTION METHOD FOR SAME, LAMINATE INCLUDI...

METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKA...

PHOTOSENSITIVE RESIN COMPOSITION, METHOD OF PRODUCING PATTERNED CUR...

METHOD FOR PRODUCING CIRCUIT BOARD

WIRING STRUCTURE, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR...

SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR SELECTING PHOTOSENSITI...

WIRING BOARD AND PRODUCTION METHOD FOR SAME

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

ORGANIC INTERPOSER AND METHOD FOR MANUFACTURING ORGANIC INTERPOSER

RESIN COMPOSITION, WIRING LAYER LAMINATE FOR SEMICONDUCTOR, AND SEM...

ORGANIC INTERPOSER AND METHOD FOR MANUFACTURING ORGANIC INTERPOSER

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

PHOTOSENSITIVE RESIN COMPOSITION, FILM ADHESIVE, ADHESIVE SHEET, AD...

PHOTOSENSITIVE ADHESIVE

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...

ADHESIVE COMPOSITION, SEMICONDUCTOR DEVICE MAKING USE THEREOF, AND...

METHOD FOR MANUFACTURING FILM-LIKE ADHESIVE, ADHESIVE SHEET, SEMICO...